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31.发明申请公开(公告)号：US20160020248A1
公开(公告)日：2016-01-21
申请号：US14868082
申请日：2015-09-28
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Richard Austin Blanchard , Bradley Steven Oraw
CPC classification number: H01L27/153 , H01L27/15 , H01L33/32
Abstract: An LED module is disclosed containing an integrated driver transistor (e.g, a MOSFET) in series with an LED. In one embodiment, LED layers are grown over a substrate. The transistor regions are formed over the same substrate. After the LED layers, such as GaN layers, are grown to form the LED portion, a central area of the LED is etched away to expose a semiconductor surface in which the transistor regions are formed. A conductor connects the transistor in series with the LED. Another node of the transistor is electrically coupled to an electrode on the bottom surface of the substrate. In one embodiment, an anode of the LED is connected to one terminal of the module, one current carrying node of the transistor is connected to a second terminal of the module, and the control terminal of the transistor is connected to a third terminal of the module.
Abstract translation: 公开了一种LED模块，其包含与LED串联的集成驱动晶体管（例如，MOSFET）。 在一个实施例中，LED层在衬底上生长。 晶体管区域形成在相同的衬底上。 在诸如GaN层的LED层被生长以形成LED部分之后，将LED的中心区域蚀刻掉以暴露其中形成晶体管区域的半导体表面。 导体将晶体管与LED串联连接。 晶体管的另一个节点电耦合到衬底的底表面上的电极。 在一个实施例中，LED的阳极连接到模块的一个端子，晶体管的一个馈电节点连接到模块的第二端子，并且晶体管的控制端子连接到模块的第三端子 模块。
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公开(公告)号：US09229597B2
公开(公告)日：2016-01-05
申请号：US14186172
申请日：2014-02-21
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Bradley Steven Oraw
IPC: G06F3/044
CPC classification number: G06F3/044 , G06F2203/04103 , H01H2239/006
Abstract: A layer of microscopic printed VLEDs is sandwiched between a first conductor layer and a transparent second conductor layer so that light exits the second conductor layer. Touch sensor electrodes are formed overlying the VLED layer so that the VLEDs illuminate the touch sensor. In one embodiment, the touch sensor electrodes are independent from the conductor layers for the VLEDs. In another embodiment, the transparent second conductor layer also serves as a touch sensor electrode. In another embodiment, both the conductor layers for the VLEDs serve as touch sensor electrodes. The conductor layers for the VLEDs may be segmented in groups to selectively illuminate groups of the VLEDs under each touch sensor position. The touch sensor electrodes may be transparent or opaque, depending on whether the electrodes are intended to allow the VLED light to pass through.
Abstract translation: 在第一导体层和透明第二导体层之间夹有显微印刷的VLED层，使得光离开第二导体层。 触摸传感器电极形成在VLED层上方，以便VLED照亮触摸传感器。 在一个实施例中，触摸传感器电极独立于用于VLED的导体层。 在另一个实施例中，透明第二导体层还用作触摸传感器电极。 在另一个实施例中，VLED的导体层都用作触摸传感器电极。 用于VLED的导体层可以被分组成组，以在每个触摸传感器位置下选择性地照亮VLED的组。 根据电极是否允许VLED光通过，触摸传感器电极可以是透明或不透明的。
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33.发明授权公开(公告)号：US09177992B2
公开(公告)日：2015-11-03
申请号：US14204965
申请日：2014-03-11
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Richard Austin Blanchard , Bradley Steven Oraw
CPC classification number: H01L27/153 , H01L27/15 , H01L33/32
Abstract: An LED module is disclosed containing an integrated driver transistor (e.g, a MOSFET) in series with an LED. In one embodiment, LED layers are grown over a substrate. The transistor regions are formed over the same substrate. After the LED layers, such as GaN layers, are grown to form the LED portion, a central area of the LED is etched away to expose a semiconductor surface in which the transistor regions are formed. A conductor connects the transistor in series with the LED. Another node of the transistor is electrically coupled to an electrode on the bottom surface of the substrate. In one embodiment, an anode of the LED is connected to one terminal of the module, one current carrying node of the transistor is connected to a second terminal of the module, and the control terminal of the transistor is connected to a third terminal of the module.
Abstract translation: 公开了一种LED模块，其包含与LED串联的集成驱动晶体管（例如，MOSFET）。 在一个实施例中，LED层在衬底上生长。 晶体管区域形成在相同的衬底上。 在诸如GaN层的LED层被生长以形成LED部分之后，将LED的中心区域蚀刻掉以暴露其中形成晶体管区域的半导体表面。 导体将晶体管与LED串联连接。 晶体管的另一节点电耦合到衬底的底表面上的电极。 在一个实施例中，LED的阳极连接到模块的一个端子，晶体管的一个馈电节点连接到模块的第二端子，并且晶体管的控制端子连接到模块的第三端子 模块。
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公开(公告)号：US20150267907A1
公开(公告)日：2015-09-24
申请号：US14731129
申请日：2015-06-04
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Travis Thompson , Bradley Steven Oraw
IPC: F21V23/06 , F21V21/005 , F21K99/00
CPC classification number: F21V23/06 , F21K9/20 , F21K9/64 , F21S2/005 , F21V21/005 , F21Y2105/10 , F21Y2115/10 , H01L25/0753 , H01L33/62 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: A system of interconnectable LED light emitting tiles includes identical tiles having a light emitting area that extends all the way to two contiguous edges. One set of anode and cathode interconnects is accessible from the underside of one edge of the tile, and a second set of anode and cathode interconnects is accessible from the top side of an opposite edge of the tile. The second set of anode and cathode interconnects extends out from the light emitting area on the top side. When tiles are interconnected together, their interconnection edges overlap to make the electrical interconnections, while the light emitting areas of all the tiles abut to form a large seamless light emitting area. The flexible tiles may be mounted on a backplane that includes anode and cathode conductors for electrically interconnecting the tiles. A large, addressable display may be formed using interconnected tiles.
Abstract translation: 可互连的LED发光砖的系统包括具有一直延伸到两个相邻边缘的发光区域的相同的瓦片。 一组阳极和阴极互连可从瓦片的一个边缘的下侧接近，并且第二组阳极和阴极互连可从瓦片的相对边缘的顶侧进入。 第二组阳极和阴极互连从顶侧的发光区域延伸出来。 当瓦片互连在一起时，它们的互连边缘重叠以形成电互连，而所有瓦片的发光区域邻接以形成大的无缝发光区域。 柔性瓦片可以安装在包括用于电互连瓦片的阳极和阴极导体的背板上。 可以使用互连瓦片形成大的可寻址显示器。
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公开(公告)号：US09074758B2
公开(公告)日：2015-07-07
申请号：US14162257
申请日：2014-01-23
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Bradley Steven Oraw , Marc Oliver Meier
IPC: H01R33/00 , F21V23/06 , F21K99/00 , H01L25/075 , F21V21/005 , F21Y101/02
CPC classification number: F21V23/06 , F21K9/20 , F21K9/64 , F21V21/005 , F21Y2115/10 , H01L25/0753 , H01L2924/0002 , H01L2924/00
Abstract: A system of interlocking LED panel tiles includes a first tile having at least one layer of light emitting diodes (LEDs) provided on a substrate, where the substrate is mounted on a substantially rectangular supporting plate having interlocking features. The substrate overlaps the interlocking features. The first tile has a set of positive and negative voltage conductors running between the two sets of opposite edges of the tile as busses. Multiple identical tiles are provided. Each tile has the interlocking features along their edges that firmly physically connect to abutting tiles to create a lamp having any pattern of tiles selected by the user. By interlocking the tiles, the positive and negative conductors are automatically connected to electrically connect the LEDs in the tiles in parallel, and the interlocking features are hidden by the overlying substrate. Additional conductors may be used to provide greater interconnection flexibility.
Abstract translation: 互锁LED面板瓦的系统包括具有设置在基板上的至少一层发光二极管（LED）的第一瓦片，其中基板安装在具有互锁特征的大致矩形的支撑板上。 基板与互锁特征重叠。 第一瓦片具有一组在瓦片的两组相对边缘之间运行的正和负电压导体作为总线。 提供多个相同的瓷砖。 每个瓦片沿其边缘具有互锁特征，其牢固地物理地连接到邻接的瓦片，以产生具有由用户选择的瓦片的任何图案的灯。 通过互锁瓦片，正和负导体自动连接以平行地电连接瓦片中的LED，并且互锁特征被上覆基板隐藏。 可以使用附加导体来提供更大的互连灵活性。
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Patent Agency Ranking
公开(公告)号：US20140355251A1
公开(公告)日：2014-12-04
申请号：US14292069
申请日：2014-05-30
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Eric William Kahrs , Bradley Steven Oraw
CPC classification number: H01L33/58 , F21K9/65 , F21V33/0052 , H01L25/0753 , H01L2224/32245 , H01L2924/0002 , H01L2924/00
Abstract: An initially flat light sheet is formed by printing conductor layers and microscopic LEDs over a flexible substrate to connect the LEDs in parallel. The light sheet is then subjected to a molding process which forms 3-dimensional features in the light sheet, such as bumps of any shape. The features may be designed to create a desired light emission profile, increase light extraction, and/or create graphical images. In one embodiment, an integrated light sheet and touch sensor is formed, where the molded features convey touch positions of the sensor. In one embodiment, a curable resin is applied to the light sheet to fix the molded features. In another embodiment, optical features are molded over the flat light sheet. In another embodiment, each molded portion of the light sheet forms a separate part that is then singulated from the light sheet.
Abstract translation: 通过在柔性基板上印刷导体层和微观LED以平行地连接LED来形成初始平坦的光片。 然后对光片进行在光片中形成三维特征的成型工艺，例如任何形状的凸块。 特征可以被设计成产生期望的发光轮廓，增加光提取和/或创建图形图像。 在一个实施例中，形成集成的光片和触摸传感器，其中模制特征传送传感器的触摸位置。 在一个实施例中，将可固化树脂施加到光片以固定模制特征。 在另一个实施例中，光学特征被模制在平面光板上。 在另一个实施例中，光片的每个模制部分形成一个单独的部分，然后从光片中分离。
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公开(公告)号：US20140268591A1
公开(公告)日：2014-09-18
申请号：US14204800
申请日：2014-03-11
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： William Johnstone Ray , Richard Austin Blanchard , Mark David Lowenthal , Bradley Steven Oraw
CPC classification number: H01L24/95 , H01L21/563 , H01L23/3121 , H01L24/06 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L25/0655 , H01L25/072 , H01L25/0753 , H01L25/18 , H01L25/50 , H01L33/20 , H01L2221/68381 , H01L2224/06181 , H01L2224/24137 , H01L2224/25105 , H01L2224/25174 , H01L2224/32225 , H01L2224/73267 , H01L2224/82101 , H01L2224/82104 , H01L2224/82143 , H01L2224/92244 , H01L2224/95085 , H01L2224/95101 , H01L2224/95102 , H01L2224/95115 , H01L2224/95143 , H01L2224/95146 , H01L2924/10253 , H01L2924/12 , H01L2924/1203 , H01L2924/12041 , H01L2924/13 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H05K1/029 , H05K1/0296 , H05K3/12
Abstract: A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.
Abstract translation: 可编程电路包括微阵列晶体管或二极管的印刷组阵列。 这些装置被预先形成并印刷成油墨并固化。 每个组中的设备并联连接，以使每个组充当单个设备。 在一个实施例中，每个组中包含约10个设备，因此冗余使得每个组非常可靠。 每个组具有终止于衬底上的贴片区域中的至少一个电引线。 互连导体图案将贴片区域中的组的至少一些引线互连以产生用于通用电路的定制应用的逻辑电路。 这些组也可以互连成逻辑门，并且栅极引线终止于贴片区域。 然后，互连导体图案将形成复合逻辑电路的栅极互连。
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公开(公告)号：US20140254136A1
公开(公告)日：2014-09-11
申请号：US14183115
申请日：2014-02-18
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Bradley Steven Oraw , Marc Oliver Meier
CPC classification number: F21V19/004 , A47F11/10 , F21S4/28 , F21V21/088 , F21W2131/305 , F21W2131/405 , F21Y2115/10 , F25D27/00
Abstract: A thin flexible light strip is formed by printing microscopic LEDs in rectangular sections along the light strip, where each rectangular section creates a vertically elongated emission profile. The light strip has a length approximately equal to the length of a shelf supporting products (e.g., bottles) to be illuminated. The shelf may be in a glass-door cooler in a store. Each section is located along the light strip to be centered with a product in the front row on the shelf. The light strip is supported by a plastic holder that attaches to the front of the shelf. The holder angles the light strip upward between 20-40 degrees, relative to vertical, to substantially uniformly illuminate each product equally. The holder may support an additional light strip that is angled downward toward products on a lower shelf.
Abstract translation: 通过在沿着光条的矩形部分中印刷微型LED来形成薄的柔性光条，其中每个矩形部分形成垂直细长的发射轮廓。 光条的长度大致等于待照明的搁板支撑产品（例如瓶）的长度。 货架可能在商店的玻璃门冷却器中。 每个部分沿着光条位于与货架前排中的产品对中。 灯带由附着在货架前部的塑料支架支撑。 支架将灯带向上相对于垂直方向在20-40度之间向上平衡地均匀地照射每个产品。 支架可以支撑向下倾斜的附加灯条，朝向下架上的产品。
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公开(公告)号：US20140240618A1
公开(公告)日：2014-08-28
申请号：US14186172
申请日：2014-02-21
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Bradley Steven Oraw
CPC classification number: G06F3/044 , G06F2203/04103 , H01H2239/006
Abstract: A layer of microscopic printed VLEDs is sandwiched between a first conductor layer and a transparent second conductor layer so that light exits the second conductor layer. Touch sensor electrodes are formed overlying the VLED layer so that the VLEDs illuminate the touch sensor. In one embodiment, the touch sensor electrodes are independent from the conductor layers for the VLEDs. In another embodiment, the transparent second conductor layer also serves as a touch sensor electrode. In another embodiment, both the conductor layers for the VLEDs serve as touch sensor electrodes. The conductor layers for the VLEDs may be segmented in groups to selectively illuminate groups of the VLEDs under each touch sensor position. The touch sensor electrodes may be transparent or opaque, depending on whether the electrodes are intended to allow the VLED light to pass through.
Abstract translation: 在第一导体层和透明第二导体层之间夹有显微印刷的VLED层，使得光离开第二导体层。 触摸传感器电极形成在VLED层上方，以便VLED照亮触摸传感器。 在一个实施例中，触摸传感器电极独立于用于VLED的导体层。 在另一个实施例中，透明第二导体层还用作触摸传感器电极。 在另一个实施例中，VLED的导体层都用作触摸传感器电极。 用于VLED的导体层可以被分组成组，以在每个触摸传感器位置下选择性地照亮VLED的组。 根据电极是否允许VLED光通过，触摸传感器电极可以是透明或不透明的。
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40.发明申请公开(公告)号：US20140191249A1
公开(公告)日：2014-07-10
申请号：US14204965
申请日：2014-03-11
Applicant: Nthdegree Technologies Worldwide Inc.
Inventor： Richard Austin Blanchard , Bradley Steven Oraw
IPC: H01L27/15
CPC classification number: H01L27/153 , H01L27/15 , H01L33/32
Abstract: An LED module is disclosed containing an integrated driver transistor (e.g, a MOSFET) in series with an LED. In one embodiment, LED layers are grown over a substrate. The transistor regions are formed over the same substrate. After the LED layers, such as GaN layers, are grown to form the LED portion, a central area of the LED is etched away to expose a semiconductor surface in which the transistor regions are formed. A conductor connects the transistor in series with the LED. Another node of the transistor is electrically coupled to an electrode on the bottom surface of the substrate. In one embodiment, an anode of the LED is connected to one terminal of the module, one current carrying node of the transistor is connected to a second terminal of the module, and the control terminal of the transistor is connected to a third terminal of the module.
Abstract translation: 公开了一种LED模块，其包含与LED串联的集成驱动晶体管（例如，MOSFET）。 在一个实施例中，LED层在衬底上生长。 晶体管区域形成在相同的衬底上。 在诸如GaN层的LED层被生长以形成LED部分之后，将LED的中心区域蚀刻掉以暴露其中形成晶体管区域的半导体表面。 导体将晶体管与LED串联连接。 晶体管的另一个节点电耦合到衬底的底表面上的电极。 在一个实施例中，LED的阳极连接到模块的一个端子，晶体管的一个馈电节点连接到模块的第二端子，并且晶体管的控制端子连接到模块的第三端子 模块。
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