公开(公告)号：US20180019383A1

公开(公告)日：2018-01-18

申请号：US15643136

申请日：2017-07-06

Applicant: ROHM CO., LTD.

Inventor： Masahiko KOBAYAKAWA ,  Tomoichiro TOYAMA

IPC: H01L33/52 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/52 ,  H01L33/005 ,  H01L33/62 ,  H01L2224/48227 ,  H01L2933/005

Abstract: A semiconductor light-emitting device includes a base, a light-emitting element and a sealing resin. The base includes an obverse surface and a reverse surface spaced in a first direction, first side surfaces spaced in a second direction crossing the first direction, and second side surfaces spaced in a third direction crossing the first and second directions. The light-emitting element is on the base obverse surface. The sealing resin for covering the light-emitting element is smaller than the base in plan. The base has a wiring pattern connected to the light-emitting element and including an obverse surface electrode on the base obverse surface. The base also has a resist layer including a pattern-covering portion overlapping with the obverse surface electrode. The pattern-covering portion includes a resin outflow preventing portion, disposed outside the sealing resin in plan and extends continuously from one second side surface to the other.

公开(公告)号：US20170229616A1

公开(公告)日：2017-08-10

申请号：US15498786

申请日：2017-04-27

Applicant: ROHM CO., LTD.

Inventor： Tomoichiro TOYAMA ,  Masahiko KOBAYAKAWA

IPC: H01L33/48 ,  H01L33/60 ,  H01L33/38 ,  H01L25/16 ,  H01L29/866 ,  H01L33/56 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L24/97 ,  H01L25/167 ,  H01L29/866 ,  H01L33/38 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A light-emitting apparatus includes a light-emitting, a first lead, a second lead, and a resin molded body configured to support the first lead and the second lead. The main surfaces of the first and second leads includes first and second coverage areas covered by the resin molded body and first and second exposure regions exposed from the resin molded body at a window portion of the resin molded body, respectively. First and second metal layers are provided to cover main surfaces of the first and second leads at first and second exposure regions, respectively.

公开(公告)号：US20170025396A1

公开(公告)日：2017-01-26

申请号：US15288337

申请日：2016-10-07

Applicant: ROHM CO., LTD.

Inventor： Tomoichiro TOYAMA

IPC: H01L25/075 ,  H01L33/64 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/48

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L27/15 ,  H01L33/08 ,  H01L33/486 ,  H01L33/507 ,  H01L33/52 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48465

Abstract: A semiconductor light emitting device includes an LED chip, which includes an n-type semiconductor layer, active layer, and p-type semiconductor layer stacked on a substrate. The LED chip further includes an anode electrode connected to the p-type semiconductor, and a cathode connected to the n-type semiconductor. The anode and cathode electrodes face a case with the LED chip mounted thereon. The case includes a base member including front and rear surfaces, and wirings including a front surface layer having anode and cathode pads formed at the front surface, a rear surface layer having anode and cathode mounting electrodes formed at the rear surface, an anode through wiring connecting the anode pad and the anode mounting electrode and passing through a portion of the base member, and a cathode through wirings connecting the cathode pad and the cathode mounting electrode and passing through a portion of the base member.

Abstract translation: 半导体发光器件包括LED芯片，其包括层叠在基板上的n型半导体层，有源层和p型半导体层。 LED芯片还包括连接到p型半导体的阳极电极和连接到n型半导体的阴极。 阳极和阴极电极面对安装有LED芯片的壳体。 壳体包括包括前表面和后表面的基底构件，以及包括在前表面形成有阳极和阴极衬垫的前表面层的布线，在后表面上形成有阳极和阴极安装电极的后表面层，阳极通过布线 连接阳极焊盘和阳极安装电极并穿过基底部件的一部分，以及通过连接阴极焊盘和阴极安装电极并穿过基底部件的一部分的布线连接阴极。