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    MEMS device with optimized geometry for reducing the offset due to the radiometric effect
    34.
    发明授权
    MEMS device with optimized geometry for reducing the offset due to the radiometric effect 有权

    公开(公告)号：US11603310B2

    公开(公告)日：2023-03-14

    申请号：US16736485

    申请日：2020-01-07

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Francesco Rizzini ,  Alessandro Tocchio

    IPC: B81B7/00 ,  G01P15/02 ,  G01P15/08 ,  G01P15/125 ,  G01C19/5712

    Abstract: A MEMS device with teeter-totter structure includes a mobile mass having an area in a plane and a thickness in a direction perpendicular to the plane. The mobile mass is tiltable about a rotation axis extending parallel to the plane and formed by a first and by a second half-masses arranged on opposite sides of the rotation axis. The first and the second masses have a first and a second centroid, respectively, arranged at a first and a second distance b1, b2, respectively, from the rotation axis. First through openings are formed in the first half-mass and, together with the first half-mass, have a first total perimeter p1 in the plane. Second through openings are formed in the second half-mass and, together with the second half-mass, have a second total perimeter p2 in the plane, where the first and the second perimeters p1, p2 satisfy the equation: p1×b1=p2×b2.

    Semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit
    36.
    发明授权
    Semiconductor device including a microelectromechanical structure and an associated integrated electronic circuit 有权

    公开(公告)号：US10934158B2

    公开(公告)日：2021-03-02

    申请号：US16240415

    申请日：2019-01-04

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Alessandro Tocchio ,  Lorenzo Corso

    IPC: B81B7/00 ,  B81C1/00

    Abstract: An integrated semiconductor device includes: a MEMS structure; an ASIC electronic circuit; and conductive interconnection structures electrically coupling the MEMS structure to the ASIC electronic circuit. The MEMS structure and the ASIC electronic circuit are integrated starting from a same substrate including semiconductor material; wherein the MEMS structure is formed at a first surface of the substrate, and the ASIC electronic circuit is formed at a second surface of the substrate, vertically opposite to the first surface in a direction transverse to a horizontal plane of extension of the first surface and of the second surface.

    MEMS triaxial magnetic sensor with improved configuration
    37.
    发明授权
    MEMS triaxial magnetic sensor with improved configuration 有权

    公开(公告)号：US10705158B2

    公开(公告)日：2020-07-07

    申请号：US16290778

    申请日：2019-03-01

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Giacomo Laghi ,  Giacomo Langfelder ,  Gabriele Gattere ,  Alessandro Tocchio ,  Dario Paci

    IPC: G01R33/02 ,  G01R33/028 ,  G01R33/00 ,  G01R33/038

    Abstract: A MEMS triaxial magnetic sensor device includes a sensing structure having: a substrate; an outer frame, which internally defines a window and is elastically coupled to first anchorages fixed with respect to the substrate by first elastic elements; a mobile structure arranged in the window, suspended above the substrate, which is elastically coupled to the outer frame by second elastic elements and carries a conductive path for flow of an electric current; and an elastic arrangement operatively coupled to the mobile structure. The mobile structure performs, due to the first and second elastic elements and the arrangement of elastic elements, first, second, and third sensing movements in response to Lorentz forces from first, second, and third magnetic-field components, respectively. The first, second, and third sensing movements are distinct and decoupled from one another.

    MEMS accelerometric sensor having high accuracy and low sensitivity to temperature and aging
    38.
    发明授权
    MEMS accelerometric sensor having high accuracy and low sensitivity to temperature and aging 有权

    公开(公告)号：US10591507B2

    公开(公告)日：2020-03-17

    申请号：US15265111

    申请日：2016-09-14

    Applicant: STMicroelectronics S.R.L.

    Inventor： Alessandro Tocchio ,  Gabriele Gattere

    IPC: G01P15/125 ,  B81B3/00 ,  G01P15/08

    Abstract: A MEMS accelerometric sensor includes a bearing structure and a suspended region that is made of semiconductor material, mobile with respect to the bearing structure. At least one modulation electrode is fixed to the bearing structure and is biased with an electrical modulation signal including at least one periodic component having a first frequency. At least one variable capacitor is formed by the suspended region and by the modulation electrode in such a way that the suspended region is subjected to an electrostatic force that depends upon the electrical modulation signal. A sensing assembly generates, when the accelerometric sensor is subjected to an acceleration, an electrical sensing signal indicating the position of the suspended region with respect to the bearing structure and includes a frequency-modulated component that is a function of the acceleration and of the first frequency.

    Frequency modulation MEMS triaxial gyroscope
    39.
    发明授权
    Frequency modulation MEMS triaxial gyroscope 有权

    公开(公告)号：US10520315B2

    公开(公告)日：2019-12-31

    申请号：US15639608

    申请日：2017-06-30

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Alessandro Tocchio ,  Luca Giuseppe Falorni ,  Claudia Comi ,  Valentina Zega

    IPC: G01C19/574 ,  G01C19/5747 ,  G01C19/5769

    Abstract: A frequency modulation MEMS triaxial gyroscope, having two mobile masses; a first and a second driving body coupled to the mobile masses through elastic elements rigid in a first direction and compliant in a second direction transverse to the first direction; and a third and a fourth driving body coupled to the mobile masses through elastic elements rigid in the second direction and compliant in the first direction. A first and a second driving element are coupled to the first and second driving bodies for causing the mobile masses to translate in the first direction in phase opposition. A third and a fourth driving element are coupled to the third and fourth driving bodies for causing the mobile masses to translate in the second direction and in phase opposition. An out-of-plane driving element is coupled to the first and second mobile masses for causing a translation in a third direction, in phase opposition. Movement-sensing electrodes generate frequency signals as a function of external angular velocities.

    Z-axis microelectromechanical detection structure with reduced drifts
    40.
    发明授权
    Z-axis microelectromechanical detection structure with reduced drifts 有权

    公开(公告)号：US10209269B2

    公开(公告)日：2019-02-19

    申请号：US14858563

    申请日：2015-09-18

    Applicant: STMICROELECTRONICS S.R.L.

    Inventor： Alessandro Tocchio

    IPC: G01P15/02 ,  G01P15/125 ,  G01C19/5712 ,  B81B7/00 ,  G01P15/08

    Abstract: Described herein is a microelectromechanical detection structure, provided with: a substrate having a top surface extending in a plane; a detection-electrode arrangement; an inertial mass, suspended above the substrate and the detection-electrode arrangement; and elastic elements, coupling the inertial mass to a central anchorage element fixed with respect to the substrate, in such a way that it is free to rotate about an axis of rotation as a function of a quantity to be detected along a vertical axis, the central anchorage element being arranged at the axis of rotation. A suspension structure is coupled to the detection-electrode arrangement for supporting it, suspended above the substrate and underneath the inertial mass, and is anchored to the substrate via at least one first anchorage region; the fixed-electrode arrangement is anchored to the suspension structure via at least one second anchorage region.

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