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    ELECTRONIC DEVICE AND ASSEMBLY WHICH INCLUDES OPTICAL-WAVE GUIDES
    31.
    发明申请
    ELECTRONIC DEVICE AND ASSEMBLY WHICH INCLUDES OPTICAL-WAVE GUIDES 审中-公开

    公开(公告)号：US20200033537A1

    公开(公告)日：2020-01-30

    申请号：US16519753

    申请日：2019-07-23

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY ,  Florian PERMINJAT ,  Jean-Michel RIVIERE

    IPC: G02B6/30

    Abstract: An electronic chip includes an integrated optical-wave guide having an end section that extends parallel to a face of the electronic chip. A local groove provided in the electronic chip extends adjacent to the end section of the integrated optical-wave guide. An elongate optical cable includes an optical-wave guide and has an end portion that is at least partially engaged in the local groove. The end portion of the elongate optical cable is configured to support an optical coupling of the optical-wave guide to the integrated optical-wave guide via lateral coupling in a zone of the local groove. An exterior package is provided to house the electronic chip.

    PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT
    33.
    发明公开
    PACKAGE, FOR EXAMPLE AN OPTICAL PACKAGE, FOR AN INTEGRATED CIRCUIT 审中-公开

    公开(公告)号：US20230403791A1

    公开(公告)日：2023-12-14

    申请号：US18205655

    申请日：2023-06-05

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY ,  Younes BOUTALEB

    IPC: H05K1/03 ,  H05K1/11 ,  H05K1/02 ,  H05K3/46

    CPC classification number: H05K1/036 ,  H05K1/11 ,  H05K1/0209 ,  H05K3/4697 ,  H05K2201/10689 ,  H05K2201/10121

    Abstract: An integrated-circuit package includes a flexible electrical-connection element sandwiched between a first face of a first multilayer support substrate and a second face of a second multilayer support substrate. The flexible electrical-connection element laterally projects with respect to, and is in electrical contact with at least one of, the multilayer support substrates. The flexible electrical-connection element and the first multilayer support substrate include, at a first region, respectively two first mutually facing orifices defining together a first cavity. The first cavity is at least partially closed off by a first part of the second face of the second multilayer support substrate. A first component is located in the first cavity, attached at the first part of the second face of the second multilayer support substrate and in electrical contact with the flexible electrical-connection element through the second multilayer support substrate.

    INTEGRATED CIRCUIT OPTICAL PACKAGE
    35.
    发明申请
    INTEGRATED CIRCUIT OPTICAL PACKAGE 有权

    公开(公告)号：US20220392820A1

    公开(公告)日：2022-12-08

    申请号：US17833153

    申请日：2022-06-06

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY ,  Younes BOUTALEB

    IPC: H01L23/367 ,  H01L33/64 ,  H01L31/024 ,  H01L33/58 ,  H01L31/0232 ,  H01L33/62 ,  H01L31/02 ,  H01L23/00

    Abstract: A cap is mounted to a support substrate, the cap including a cap body and an optical shutter. The cap and support substrate define a housing. An electronic chip is disposed in the housing above the support substrate. A face of the electronic chip supports an optical device that is optically coupled with the optical shutter. The cap body is thermally conductive. Within the housing, a thermally conductive linking structure is coupled in a thermally conductive manner between the cap body and the electronic chip. The thermally conductive linking structure surrounds the electronic chip. A thermal interface material fills a portion of the housing between the thermally conductive linking structure and the cap body.

    OPTOELECTRONIC DEVICE
    36.
    发明申请
    OPTOELECTRONIC DEVICE 有权

    公开(公告)号：US20220310869A1

    公开(公告)日：2022-09-29

    申请号：US17838929

    申请日：2022-06-13

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

    IPC: H01L31/16 ,  H01L23/00

    Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated in a transparent block. An opaque conductive layer is applied to a top surface and a side surface of the transparent block. The receiver is mounted to the opaque conductive layer at the top surface. An electrical connection is made between the receiver and the opaque conductive layer. A conductive strip is also mounted to the side surface of the transparent block and isolated from the opaque conductive layer. A further electrical connection is made between the receiver and the conductive strip.

    OPTOELECTRONIC DEVICE
    40.
    发明申请
    OPTOELECTRONIC DEVICE 有权

    公开(公告)号：US20210135069A1

    公开(公告)日：2021-05-06

    申请号：US17071603

    申请日：2020-10-15

    Applicant: STMicroelectronics (Grenoble 2) SAS

    Inventor： Romain COFFY ,  Remi BRECHIGNAC ,  Jean-Michel RIVIERE

    IPC: H01L33/54 ,  H01L33/00

    Abstract: An optoelectronic device includes an emitter of light rays and a receiver of light rays. The emitter is encapsulated within a first encapsulation layer, and the receiver is encapsulated within a second encapsulation layer. An opaque layer covers the first encapsulation layer (encapsulating the receiver) and covers the second encapsulation layer (encapsulating the emitter). The first and second encapsulation layers are separated by a region of opaque material. This opaque material may be provided by the opaque layer or an opaque fill.

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