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116 条记录 (耗时 0.021 秒)

    Characterizing Thermomechanical Properties of an Organic Substrate Using Finite Element Analysis
    32.
    发明申请
    Characterizing Thermomechanical Properties of an Organic Substrate Using Finite Element Analysis 有权
    使用有限元分析表征有机基板的热机械性能

    公开(公告)号：US20090310848A1

    公开(公告)日：2009-12-17

    申请号：US12260693

    申请日：2008-10-29

    申请人： Hien Phu Dang ,  Arun Sharma ,  Sri M. Sri-Jayantha

    发明人： Hien Phu Dang ,  Arun Sharma ,  Sri M. Sri-Jayantha

    IPC分类号： G06K9/00

    CPC分类号： G06F17/5018 ,  G06F2217/80

    摘要： A method for characterizing thermomechanical properties of an organic substrate is provided. The method includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the plurality of circuit layers of the substrate; selecting a given one of the plurality of circuit layers for processing; converting the image to a two-dimensional finite element model (FEM) image of the given one of the circuit layers; determining at least one of a coefficient of thermal expansion (CTE), modulus and Poisson's ratio of the FEM image of the given one of the circuit layers; repeating the steps of selecting a given one of the plurality of circuit layers, converting the image to a two-dimensional FEM image, and determining at least one of a CTE, modulus and Poisson's ratio of the FEM image for all of the plurality of circuit layers corresponding to at least a portion of the organic substrate; and constructing a three-dimensional representation of at least a portion of the organic substrate including the plurality of circuit layers as a function of at least one of the CTE, modulus and Poisson's ratio of each of the plurality of circuit layers.

    摘要翻译： 提供了表征有机基板的热机械性能的方法。 该方法包括以下步骤：接收有机衬底的图像，该图像包括衬底的多个电路层的几何描述; 选择所述多个电路层中的给定一个以进行处理; 将图像转换成给定的一个电路层的二维有限元模型（FEM）图像; 确定给定一个电路层的FEM图像的热膨胀系数（CTE），模数和泊松比中的至少一个; 重复选择多个电路层中的给定的一个电路层的步骤，将图像转换为二维有机图像，以及确定所有多个电路中的有限元图像的CTE，模数和泊松比中的至少一个 对应于有机基材的至少一部分的层; 以及构成包括所述多个电路层的所述有机衬底的至少一部分的三维表示作为所述多个电路层中的每一个的CTE，模数和泊松比中的至少一个的函数。

    Method to extract and apply circuit features in organic substrate for automation of warp modeling
    37.
    发明授权
    Method to extract and apply circuit features in organic substrate for automation of warp modeling 失效
    提取和应用电路特征的方法，用于有机衬底自动化的翘曲建模

    公开(公告)号：US08127255B2

    公开(公告)日：2012-02-28

    申请号：US12260957

    申请日：2008-10-29

    申请人： Hien Phu Dang ,  Vijayeshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    发明人： Hien Phu Dang ,  Vijayeshwar Das Khanna ,  Arun Sharma ,  Sri M. Sri-Jayantha

    IPC分类号： G06F17/50

    CPC分类号： H05K3/0005 ,  H05K1/0271 ,  H05K2201/09136

    摘要： A method of characterizing an organic substrate including a plurality of circuit layers is provided includes the steps of: receiving an image of the organic substrate, the image including a geometric description of the circuit layers of the substrate; segmenting the substrate into multiple processing regions based, at least in part, on geometric coordinates of circuit structures defined in the image of the substrate; generating a circuit layer image corresponding to a selected one of the processing regions of the substrate; identifying one or more geometric features in the circuit layer image; estimating at least one thermomechanical property of the circuit layer image as a function of the identified geometric features; repeating the steps of receiving an image, generating a circuit layer image, identifying one or more geometric features in the circuit layer image, and estimating at least one thermomechanical property of the circuit layer image until all circuit layers in the substrate have been processed; and generating a 3-D representation of the selected one of the processing regions of the substrate including the plurality of circuit layer images as a function of the at least one thermomechanical property of each of the plurality of circuit layer images.

    摘要翻译： 提供了表征包括多个电路层的有机衬底的方法包括以下步骤：接收有机衬底的图像，该图像包括衬底的电路层的几何描述; 至少部分地基于在衬底的图像中限定的电路结构的几何坐标将衬底分割成多个处理区域; 生成与所述基板的所述选择的一个所述处理区域对应的电路层图像; 识别电路层图像中的一个或多个几何特征; 估计电路层图像的至少一个热机械性质作为所识别的几何特征的函数; 重复接收图像的步骤，生成电路层图像，识别电路层图像中的一个或多个几何特征，以及估计电路层图像的至少一个热机械特性，直到已经处理了基板中的所有电路层; 以及根据所述多个电路层图像中的每一个的所述至少一个热机械特性，生成包括所述多个电路层图像的所述基板的所选择的一个处理区域的3-D表示。