公开(公告)号：US08470920B2

公开(公告)日：2013-06-25

申请号：US13514667

申请日：2010-02-12

申请人： Sang Min Kwon ,  Seok Jin Kim ,  Tae Keun Lee ,  Woon Ki Chung

发明人： Sang Min Kwon ,  Seok Jin Kim ,  Tae Keun Lee ,  Woon Ki Chung

IPC分类号： C08K3/26

CPC分类号： C08J5/18 ,  C08J2323/10 ,  C08L23/10 ,  C08L67/02 ,  C08L2666/18

摘要： The present invention relates to a polyolefin composition for an interior sheet/film. The polyolefin composition of the present invention for an interior sheet comprises 70 to 99 wt % of polyolefin and 1 to 30 wt % of modified polyethylene terephthalate having a melting point of 130 to 180° C. The polyolefin composition of the present invention is environmentally friendly and has good physical properties such as workability, printing characteristics, and adhesiveness. In addition, sheets having various thicknesses can be produced by extrusion without having to stretch the sheets, and thus the sheets can be used separately or in combination in various application fields.

摘要翻译： 本发明涉及用于内部片/薄膜的聚烯烃组合物。 用于内部片材的本发明的聚烯烃组合物包含70至99重量％的聚烯烃和1至30重量％的熔点为130至180℃的改性聚对苯二甲酸乙二醇酯。本发明的聚烯烃组合物是环境友好的 并且具有良好的物理性能，例如可加工性，印刷特性和粘合性。 此外，可以通过挤出而不必拉伸片材来生产具有各种厚度的片材，因此片材可以在各种应用领域中单独使用或组合使用。

公开(公告)号：US20130056726A1

公开(公告)日：2013-03-07

申请号：US13587611

申请日：2012-08-16

申请人： Ji Eun Chae ,  Jung Eun Ahn ,  Tae Keun Lee

发明人： Ji Eun Chae ,  Jung Eun Ahn ,  Tae Keun Lee

IPC分类号： H01L21/44 ,  H01L29/786

CPC分类号： H01L27/1225 ,  H01L27/1288 ,  H01L27/3276 ,  H01L2227/323

摘要： A flat panel display device with an oxide thin film transistor and a fabricating method thereof are disclosed. The fabricating method of the flat panel display device includes: preparing a substrate defined into a pixel region and a pad contact region; forming a gate electrode and a link line; forming a pixel electrode within the pixel region; forming an oxide layer on the substrate provided with the pixel electrode; forming a passivation layer on the substrate and performing a formation process of contact holes to expose the link line; and forming a second transparent conductive material film on the substrate.

摘要翻译： 公开了一种具有氧化物薄膜晶体管的平板显示装置及其制造方法。 平板显示装置的制造方法包括：准备限定为像素区域和衬垫接触区域的衬底; 形成栅电极和连接线; 在所述像素区域内形成像素电极; 在设置有像素电极的基板上形成氧化物层; 在所述基板上形成钝化层，并进行接触孔的形成处理以暴露所述连接线; 以及在所述基板上形成第二透明导电材料膜。

公开(公告)号：US20130056724A1

公开(公告)日：2013-03-07

申请号：US13553790

申请日：2012-07-19

申请人： Ji Eun Chae ,  Tae Keun Lee

发明人： Ji Eun Chae ,  Tae Keun Lee

IPC分类号： H01L27/15 ,  H01L33/36

CPC分类号： H01L27/1259 ,  H01L27/1225 ,  H01L27/1244 ,  H01L29/66969

摘要： A flat panel display device with oxide thin film transistors and a fabricating method thereof are disclosed. The flat panel display device includes: a substrate; gate lines and data lines formed to cross each other and define a plurality of pixel regions on the substrate; the thin film transistors each including an oxide channel layer which is formed at an intersection of the gate and data lines; a pixel electrode and a common electrode formed in the pixel region with having a passivation layer therebetween; and step coverage compensation patterns formed at a step portion formed by the gate line and a gate electrode of the thin film transistor.

公开(公告)号：US20120235318A1

公开(公告)日：2012-09-20

申请号：US13513888

申请日：2010-12-02

申请人： Sang Min Kwon ,  Seok Jin Kim ,  Tae Keun Lee ,  Woon Ki Chung ,  Sung Bo Yoo

发明人： Sang Min Kwon ,  Seok Jin Kim ,  Tae Keun Lee ,  Woon Ki Chung ,  Sung Bo Yoo

IPC分类号： B29C47/88

CPC分类号： B29C48/914 ,  B29C48/07 ,  B29C48/08 ,  B29C48/12 ,  B29C48/92 ,  B29C2948/92704 ,  B29C2948/92923 ,  B29K2023/0625 ,  B29K2023/0633 ,  B29K2023/12 ,  B29L2007/008

摘要： Provided herein is a method of manufacturing a polyolefin sheet using a circulating belt and a first roller, comprising the steps of: heating polyolefin resin to melt polyolefin; and forming the molten polyolefin into a polyolefin sheet using an extruding die, wherein the circulating belt includes a plurality of second rollers (cooling rollers) which come into contact with an inner side of the circulating belt and are arranged in a circle around the circulating belt running in a circle and which cool the rotating circulating belt; a temperature of the circulating belt is maintained at 0˜30 to cool the polyolefin sheet such that the polyolefin sheet has desired thickness, a temperature of the first roller is set to a specific temperature between 40 and 120, and the temperature of the first roller is maintained in a temperature range of the specific temperature ±5; and a linear speed of the molten polyolefin sheet is substantially equal to a rotation speed of the circulating belt or the first roller to obtain a polyolefin sheet having a thickness of 0.05˜0.45 mm and a width of 1100˜1700 mm The method is advantageous in that a wide-width polyolefin sheet having excellent flatness and a small thickness deviation can be manufactured.

摘要翻译： 本发明提供使用循环带和第一辊制造聚烯烃片材的方法，包括以下步骤：加热聚烯烃树脂以熔化聚烯烃; 以及使用挤出模具将熔融聚烯烃形成聚烯烃片材，其中循环带包括与循环带的内侧接触并围绕循环带布置的多个第二辊（冷却辊） 以循环方式运行，并冷却旋转循环带; 循环带的温度保持在0〜30以冷却聚烯烃片材，使得聚烯烃片材具有期望的厚度，将第一辊子的温度设定在40至120的特定温度，并且第一辊子的温度 保持在特定温度±5℃的温度范围内; 熔融聚烯烃片材的线速度基本上等于循环带或第一辊的转速，得到厚度为0.05〜0.45mm，宽度为1100〜1700mm的聚烯烃片材。该方法有利于 可以制造具有优异的平坦度和小的厚度偏差的宽幅聚烯烃片材。

公开(公告)号：US08022531B2

公开(公告)日：2011-09-20

申请号：US12880415

申请日：2010-09-13

申请人： Kyungsic Yu ,  Tae Keun Lee ,  Youngnam Choi

发明人： Kyungsic Yu ,  Tae Keun Lee ,  Youngnam Choi

IPC分类号： H01L23/34 ,  H01L23/10

CPC分类号： H01L23/3121 ,  H01L21/568 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes a substrate having an integrated circuit die thereon; a heat slug having a tie bar, the tie bar having characteristics of singulation from an adjacent heat slug; and an encapsulant molded on the substrate, the heat slug, and the integrated circuit die includes the encapsulant which fills all of the space between the integrated circuit die and the heat slug.

摘要翻译： 集成电路封装系统包括其上具有集成电路管芯的衬底; 具有连接杆的散热片，所述连接杆具有来自相邻加热块的分离的特征; 并且模塑在基板上的密封剂，热塞和集成电路管芯包括填充集成电路管芯和热段之间的所有空间的密封剂。

公开(公告)号：US20100176503A1

公开(公告)日：2010-07-15

申请号：US12729204

申请日：2010-03-22

申请人： Sangkwon Lee ,  Tae Keun Lee

发明人： Sangkwon Lee ,  Tae Keun Lee

IPC分类号： H01L23/367

CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48475 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83801 ,  H01L2224/85051 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package system includes providing a substrate having a plurality of thermal vias extending through the substrate. A solder mask is positioned over the plurality of thermal vias. A plurality of thermally conductive bumps is formed on at least some of the plurality of thermal vias using the solder mask. An integrated circuit die is attached to the plurality of thermally conductive bumps. An encapsulant encapsulates the integrated circuit die.

摘要翻译： 半导体封装系统包括提供具有延伸穿过衬底的多个热通孔的衬底。 焊接掩模位于多个热通孔上。 使用焊接掩模在多个热通孔中的至少一些上形成多个导热凸块。 集成电路芯片附接到多个导热凸块。 密封剂封装集成电路管芯。

公开(公告)号：US20100171228A1

公开(公告)日：2010-07-08

申请号：US12723596

申请日：2010-03-12

申请人： Hyung Jun Jeon ,  Tae Keun Lee ,  Sung Soo Kim

发明人： Hyung Jun Jeon ,  Tae Keun Lee ,  Sung Soo Kim

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit package system includes forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.

摘要翻译： 一种制造集成电路封装系统的方法包括：在其上形成具有器件的衬底，形成具有平面顶表面的封装，以覆盖器件和跨越封装的提取侧的衬底，以及在封装中形成凹部 从平面顶面。

公开(公告)号：US07714451B2

公开(公告)日：2010-05-11

申请号：US11307614

申请日：2006-02-14

申请人： Sangkwon Lee ,  Tae Keun Lee

发明人： Sangkwon Lee ,  Tae Keun Lee

IPC分类号： H01L23/12

CPC分类号： H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48475 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83801 ,  H01L2224/85051 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package system includes providing a substrate having a plurality of thermal vias extending through the substrate. A solder mask is positioned over the plurality of thermal vias. A plurality of thermally conductive bumps is formed on at least some of the plurality of thermal vias using the solder mask. An integrated circuit die is attached to the plurality of thermally conductive bumps. An encapsulant encapsulates the integrated circuit die.

摘要翻译： 半导体封装系统包括提供具有延伸穿过衬底的多个热通孔的衬底。 焊接掩模位于多个热通孔上。 使用焊接掩模在多个热通孔中的至少一些上形成多个导热凸块。 集成电路芯片附接到多个导热凸块。 密封剂封装集成电路管芯。

公开(公告)号：US07705475B2

公开(公告)日：2010-04-27

申请号：US11462303

申请日：2006-08-03

申请人： Hyung Jun Jeon ,  Tae Keun Lee ,  Sung Soo Kim

发明人： Hyung Jun Jeon ,  Tae Keun Lee ,  Sung Soo Kim

IPC分类号： H01L23/28

CPC分类号： H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.

摘要翻译： 提供了一种集成电路封装系统，包括在其上形成具有器件的衬底，形成具有平坦顶表面的封装以覆盖器件，衬底跨越封装的提取侧，以及在封装中从平面形成凹部 顶面。

公开(公告)号：US20100038804A1

公开(公告)日：2010-02-18

申请号：US12192042

申请日：2008-08-14

申请人： DaeWook Yang ,  Youngcheol Kim ,  Tae Keun Lee

发明人： DaeWook Yang ,  Youngcheol Kim ,  Tae Keun Lee

IPC分类号： H01L23/28 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit package system includes: providing a substrate; forming a conductive layer over the substrate; forming a mold gate layer having an organic material without polymerization over the conductive layer; and attaching an integrated circuit over the substrate adjacent the mold gate layer.

摘要翻译： 集成电路封装系统包括：提供衬底; 在衬底上形成导电层; 在所述导电层上形成没有聚合的有机材料的模具浇口层; 以及在所述基板上邻近所述模具浇口层附接集成电路。