公开(公告)号：US08470920B2

公开(公告)日：2013-06-25

申请号：US13514667

申请日：2010-02-12

申请人： Sang Min Kwon ,  Seok Jin Kim ,  Tae Keun Lee ,  Woon Ki Chung

发明人： Sang Min Kwon ,  Seok Jin Kim ,  Tae Keun Lee ,  Woon Ki Chung

IPC分类号： C08K3/26

CPC分类号： C08J5/18 ,  C08J2323/10 ,  C08L23/10 ,  C08L67/02 ,  C08L2666/18

摘要： The present invention relates to a polyolefin composition for an interior sheet/film. The polyolefin composition of the present invention for an interior sheet comprises 70 to 99 wt % of polyolefin and 1 to 30 wt % of modified polyethylene terephthalate having a melting point of 130 to 180° C. The polyolefin composition of the present invention is environmentally friendly and has good physical properties such as workability, printing characteristics, and adhesiveness. In addition, sheets having various thicknesses can be produced by extrusion without having to stretch the sheets, and thus the sheets can be used separately or in combination in various application fields.

摘要翻译： 本发明涉及用于内部片/薄膜的聚烯烃组合物。 用于内部片材的本发明的聚烯烃组合物包含70至99重量％的聚烯烃和1至30重量％的熔点为130至180℃的改性聚对苯二甲酸乙二醇酯。本发明的聚烯烃组合物是环境友好的 并且具有良好的物理性能，例如可加工性，印刷特性和粘合性。 此外，可以通过挤出而不必拉伸片材来生产具有各种厚度的片材，因此片材可以在各种应用领域中单独使用或组合使用。

公开(公告)号：US20120235318A1

公开(公告)日：2012-09-20

申请号：US13513888

申请日：2010-12-02

申请人： Sang Min Kwon ,  Seok Jin Kim ,  Tae Keun Lee ,  Woon Ki Chung ,  Sung Bo Yoo

发明人： Sang Min Kwon ,  Seok Jin Kim ,  Tae Keun Lee ,  Woon Ki Chung ,  Sung Bo Yoo

IPC分类号： B29C47/88

CPC分类号： B29C48/914 ,  B29C48/07 ,  B29C48/08 ,  B29C48/12 ,  B29C48/92 ,  B29C2948/92704 ,  B29C2948/92923 ,  B29K2023/0625 ,  B29K2023/0633 ,  B29K2023/12 ,  B29L2007/008

摘要： Provided herein is a method of manufacturing a polyolefin sheet using a circulating belt and a first roller, comprising the steps of: heating polyolefin resin to melt polyolefin; and forming the molten polyolefin into a polyolefin sheet using an extruding die, wherein the circulating belt includes a plurality of second rollers (cooling rollers) which come into contact with an inner side of the circulating belt and are arranged in a circle around the circulating belt running in a circle and which cool the rotating circulating belt; a temperature of the circulating belt is maintained at 0˜30 to cool the polyolefin sheet such that the polyolefin sheet has desired thickness, a temperature of the first roller is set to a specific temperature between 40 and 120, and the temperature of the first roller is maintained in a temperature range of the specific temperature ±5; and a linear speed of the molten polyolefin sheet is substantially equal to a rotation speed of the circulating belt or the first roller to obtain a polyolefin sheet having a thickness of 0.05˜0.45 mm and a width of 1100˜1700 mm The method is advantageous in that a wide-width polyolefin sheet having excellent flatness and a small thickness deviation can be manufactured.

摘要翻译： 本发明提供使用循环带和第一辊制造聚烯烃片材的方法，包括以下步骤：加热聚烯烃树脂以熔化聚烯烃; 以及使用挤出模具将熔融聚烯烃形成聚烯烃片材，其中循环带包括与循环带的内侧接触并围绕循环带布置的多个第二辊（冷却辊） 以循环方式运行，并冷却旋转循环带; 循环带的温度保持在0〜30以冷却聚烯烃片材，使得聚烯烃片材具有期望的厚度，将第一辊子的温度设定在40至120的特定温度，并且第一辊子的温度 保持在特定温度±5℃的温度范围内; 熔融聚烯烃片材的线速度基本上等于循环带或第一辊的转速，得到厚度为0.05〜0.45mm，宽度为1100〜1700mm的聚烯烃片材。该方法有利于 可以制造具有优异的平坦度和小的厚度偏差的宽幅聚烯烃片材。

公开(公告)号：US20130005893A1

公开(公告)日：2013-01-03

申请号：US13514667

申请日：2010-02-12

申请人： Sang Min Kwon ,  Seok Kim ,  Tae Keun Lee ,  Woon Ki Chung

发明人： Sang Min Kwon ,  Seok Kim ,  Tae Keun Lee ,  Woon Ki Chung

IPC分类号： C08L67/06 ,  C08K3/34 ,  C08L51/06 ,  C08K3/26

CPC分类号： C08J5/18 ,  C08J2323/10 ,  C08L23/10 ,  C08L67/02 ,  C08L2666/18

摘要： The present invention relates to a polyolefin composition for an interior sheet/film. The polyolefin composition of the present invention for an interior sheet comprises 70 to 99 wt % of polyolefin and 1 to 30 wt % of modified polyethylene terephthalate having a melting point of 130 to 180° C. The polyolefin composition of the present invention is environmentally friendly and has good physical properties such as workability, printing characteristics, and adhesiveness. In addition, sheets having various thicknesses can be produced by extrusion without having to stretch the sheets, and thus the sheets can be used separately or in combination in various application fields.

摘要翻译： 本发明涉及用于内部片/薄膜的聚烯烃组合物。 用于内部片材的本发明的聚烯烃组合物包含70至99重量％的聚烯烃和1至30重量％的熔点为130至180℃的改性聚对苯二甲酸乙二醇酯。本发明的聚烯烃组合物是环境友好的 并且具有良好的物理性能，例如可加工性，印刷特性和粘合性。 此外，可以通过挤出而不必拉伸片材来生产具有各种厚度的片材，因此片材可以在各种应用领域中单独使用或组合使用。

公开(公告)号：US08633056B2

公开(公告)日：2014-01-21

申请号：US12723596

申请日：2010-03-12

申请人： Hyung Jun Jeon ,  Tae Keun Lee ,  Sung Soo Kim

发明人： Hyung Jun Jeon ,  Tae Keun Lee ,  Sung Soo Kim

IPC分类号： H01L21/00 ,  H01L23/02

CPC分类号： H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method of manufacture of an integrated circuit package system includes forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.

摘要翻译： 一种制造集成电路封装系统的方法包括：在其上形成具有器件的衬底，形成具有平面顶表面的封装，以覆盖器件和跨越封装的提取侧的衬底，以及在封装中形成凹部 从平面顶面。

公开(公告)号：US08114771B2

公开(公告)日：2012-02-14

申请号：US11615923

申请日：2006-12-22

申请人： Hyung Jun Jeon ,  Tae Keun Lee ,  Young Chan Ko

发明人： Hyung Jun Jeon ,  Tae Keun Lee ,  Young Chan Ko

IPC分类号： H01L21/44

CPC分类号： H01L24/72 ,  H01L21/561 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2924/00014 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor wafer scale package system is provided including providing a semiconductor substrate having a through-hole via with a conductive coating, forming a filled via by filling the through-hole via with a conductive material, coupling a package substrate to the filled via, and singulating a chip scale package from the semiconductor substrate and the package substrate.

摘要翻译： 提供了一种半导体晶片级封装系统，包括提供具有通孔通孔的半导体衬底和导电涂层，通过用导电材料填充通孔通孔来形成填充通孔，将封装衬底耦合到填充通孔，以及 从半导体衬底和封装衬底分离芯片级封装。

公开(公告)号：US08030755B2

公开(公告)日：2011-10-04

申请号：US11307532

申请日：2006-02-10

申请人： Sangkwon Lee ,  Tae Keun Lee

发明人： Sangkwon Lee ,  Tae Keun Lee

IPC分类号： H01L23/10

CPC分类号： H01L23/4334 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided forming a substrate having an integrated circuit die thereon, thermally connecting a heat slug and a resilient thermal structure to the integrated circuit die, and encapsulating the resilient thermal structure.

摘要翻译： 提供一种集成电路封装系统，其形成具有集成电路管芯的基板，将散热块和弹性热结构热连接到集成电路管芯，并封装弹性热结构。

公开(公告)号：US20080029911A1

公开(公告)日：2008-02-07

申请号：US11462303

申请日：2006-08-03

申请人： Hyung Jun Jeon ,  Tae Keun Lee ,  Sung Soo Kim

发明人： Hyung Jun Jeon ,  Tae Keun Lee ,  Sung Soo Kim

IPC分类号： H01L23/28 ,  H01L21/00

CPC分类号： H01L23/3121 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system is provided including forming a substrate with a device thereover, forming an encapsulation having a planar top surface to cover the device and the substrate spanning to an extraction side of the encapsulation, and forming a recess in the encapsulation from the planar top surface.

摘要翻译： 提供了一种集成电路封装系统，包括在其上形成具有器件的衬底，形成具有平坦顶表面的封装以覆盖器件，衬底跨越封装的提取侧，以及在封装中从平面形成凹部 顶面。

公开(公告)号：US07309622B2

公开(公告)日：2007-12-18

申请号：US11307350

申请日：2006-02-01

申请人： Minseok Kim ,  Tae Keun Lee

发明人： Minseok Kim ,  Tae Keun Lee

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/36 ,  H01L21/4871 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes providing a substrate. An integrated circuit is attached to the substrate. A plurality of support bars is formed on the substrate. A plurality of adhesive structures is formed. A heat sink is attached to the plurality of adhesive structures. The integrated circuit is encapsulated. The support bars are removed.

摘要翻译： 集成电路封装系统包括提供衬底。 集成电路连接到基板。 在基板上形成多个支撑杆。 形成多个粘合剂结构。 散热器附接到多个粘合剂结构。 集成电路封装。 支撑杆被移除。

公开(公告)号：US08841782B2

公开(公告)日：2014-09-23

申请号：US12192042

申请日：2008-08-14

申请人： DaeWook Yang ,  Youngcheol Kim ,  Tae Keun Lee

发明人： DaeWook Yang ,  Youngcheol Kim ,  Tae Keun Lee

IPC分类号： H01L23/29 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated circuit package system includes: providing a substrate; forming a conductive layer over the substrate; forming a mold gate layer having an organic material without polymerization over the conductive layer; and attaching an integrated circuit over the substrate adjacent the mold gate layer.

摘要翻译： 一种集成电路封装系统，包括：提供衬底; 在衬底上形成导电层; 在所述导电层上形成没有聚合的有机材料的模具浇口层; 以及在所述基板上邻近所述模具浇口层附接集成电路。

公开(公告)号：US07759783B2

公开(公告)日：2010-07-20

申请号：US11608123

申请日：2006-12-07

申请人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

发明人： Hun Teak Lee ,  Tae Keun Lee ,  Soo Jung Park

IPC分类号： H01L23/538 ,  H01L23/02 ,  H01L23/495 ,  H01L23/522 ,  H01L23/52 ,  H01L25/065 ,  H01L23/28 ,  H01L23/31 ,  H05K7/00

CPC分类号： H01L25/03 ,  H01L23/3135 ,  H01L23/552 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system that includes: providing an electrical interconnect system including a first lead-finger system and a second lead-finger system; stacking a second device over a first device between the first lead-finger system and the second lead-finger system; connecting the second device to the second lead-finger system with a bump bond; stacking a dummy device over the second device; and connecting the first device to the first lead-finger system with a wire bond.

摘要翻译： 一种集成电路封装系统，包括：提供包括第一引线指系统和第二引线指系统的电互连系统; 在第一引线指系统和第二引指系统之间的第一器件上堆叠第二器件; 将所述第二装置连接到具有凸块接合的所述第二引线指系统; 在第二设备上堆叠虚拟设备; 以及用引线键将所述第一装置连接到所述第一引线指系统。