利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

57 条记录 (耗时 0.024 秒)

    Winding structure for static electrical induction apparatus
    31.
    发明授权
    Winding structure for static electrical induction apparatus 失效
    静电感应装置绕组结构

    公开(公告)号：US4245206A

    公开(公告)日：1981-01-13

    申请号：US888996

    申请日：1978-03-22

    申请人： Takahiro Daikoku ,  Masahiro Ikegawa ,  Wataru Nakayama ,  Taisei Uede

    发明人： Takahiro Daikoku ,  Masahiro Ikegawa ,  Wataru Nakayama ,  Taisei Uede

    IPC分类号： H01F27/08 ,  H01F27/32

    CPC分类号： H01F27/322 ,  H01F27/08

    摘要： Winding structure for static electrical induction apparatus such as transformers, reactors, or the like. A winding assembly is disposed in a space formed between a pair of inner and outer insulation continuous walls which are disposed in a container so as to commonly include the vertical axis of the container thereby defining the space therebetween. An inner vertical coolant passage is formed between the winding assembly and the inner insulation wall and an outer vertical coolant passage is also formed between the winding assembly and the inner insulation wall. The winding assembly is composed of a plurality of coil units stacked on one another in the vertical direction with separation at predetermined intervals so as to form horizontal coolant passages between vertically adjacent ones of the coil units, the inner and outer vertical coolant passages communicating with each other through the horizontal coolant passages.A plurality of coolant flow control members are disposed in discrete relation from one another in at least selected one of the inner and outer vertical coolant passages in a manner so that a horizontal sectional area of the selected vertical coolant passage is decreased periodically at a pitch of nP along the vertical direction where n represents an integer which is not smaller than two (2) and P represents a pitch of the coil units along the vertical direction.Further, each of the coil units may be divided into at least two, inner and outer, coil sub-units disposed concentrically with each other in a common horizontal plane to thereby additionally form an intermediate vertical coolant passage between the vertically stacked inner coil sub-units and the vertically stacked outer coil sub-units. The coolant flow control members are disposed only in this intermediate vertical coolant passage to decrease periodically the horizontal sectional area thereof at the pitch of nP in the same manner as mentioned above.

    摘要翻译： 用于诸如变压器，电抗器等的静电感应装置的绕组结构。 绕组组件设置在形成在一对内绝缘连续壁和外绝缘连续壁之间的空间中，所述间隔件设置在容器中，以便共同地包括容器的垂直轴线，从而限定其间的空间。 内部垂直冷却剂通道形成在绕组组件和内绝缘壁之间，并且外部垂直冷却剂通道也形成在绕组组件和内绝缘壁之间。 绕组组件由沿垂直方向彼此叠置的多个线圈单元组成，并以预定间隔隔开，以在垂直相邻的线圈单元之间形成水平冷却剂通道，内和外垂直冷却剂通道与每个线圈单元连通 其他通过水平冷却剂通道。 多个冷却剂流量控制构件以内部和外部垂直冷却剂通道中的至少一个中的至少一个中的彼此离散的关系设置，使得所选择的垂直冷却剂通道的水平截面面积以 nP，其中n表示不小于2（2）的整数，P表示线圈单元沿垂直方向的间距。 此外，每个线圈单元可以被划分为在共同的水平平面中彼此同心设置的至少两个内部和外部线圈子单元，从而在垂直堆叠的内部线圈子单元之间另外形成中间垂直冷却剂通道， 单元和垂直堆叠的外部线圈子单元。 冷却剂流量控制构件仅设置在该中间垂直冷却剂通道中，以与上述相同的方式以nP的间距周期性地减小其水平截面面积。

    Device for sealing and cooling multi-chip modules
    32.
    发明授权
    Device for sealing and cooling multi-chip modules 失效
    密封和冷却多芯片模块的装置

    公开(公告)号：US06890799B2

    公开(公告)日：2005-05-10

    申请号：US10338485

    申请日：2003-01-07

    申请人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

    发明人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

    IPC分类号： H01L23/10 ,  H01L23/473 ,  H01L21/48 ,  H01L23/34 ,  H05K7/20

    CPC分类号： H01L23/10 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1626

    摘要： According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

    摘要翻译： 根据本发明，多芯片模块中的密封顶板由具有与多层电路基板的热膨胀系数一致的高导热性的陶瓷形成。 覆盖整个冷却流路槽的冷却流路盖形成为单独的金属部件。 密封顶板的形成冷却流路槽的背面使用焊料直接接合在半导体装置的背面。 提供具有低热阻的导热护套。 多芯片模块密封框架焊接到密封顶板的边缘。 此外，诸如O形圈的密封材料简单地介于密封顶板的边缘和冷却水通道盖之间，并且紧固装置用于紧固金属冷却流路盖和多芯片模块密封框架 对彼此。

    Cooling apparatus for electronic devices
    35.
    发明授权
    Cooling apparatus for electronic devices 失效
    电子设备冷却装置

    公开(公告)号：US5818694A

    公开(公告)日：1998-10-06

    申请号：US800460

    申请日：1997-02-14

    申请人： Takahiro Daikoku ,  Shigeyasu Tsubaki

    发明人： Takahiro Daikoku ,  Shigeyasu Tsubaki

    IPC分类号： H05K7/20 ,  F28F3/02 ,  H01L23/467

    CPC分类号： F28F3/02 ,  H01L23/467 ,  H01L2924/0002

    摘要： The cooling apparatus has cooling fins attached to heat generating units of electronic devices and provided with a plurality of elemental fins. According to one embodiment, the cooling apparatus has a first cooling fin composed of elemental fins that are uniform in fin density in the height direction of the cooling fin from a fin base. The cooling apparatus also has a second cooling fin composed of elemental fins with a zero or small fin density at the lower portion close to a fin base of the cooling fin as compared with the fin density at the upper portion of the cooling fin. The first and second cooling fins are positioned adjacent to one another. Various different embodiments of cooling fins are disclosed.

    摘要翻译： 冷却装置具有附接到电子装置的发热单元并具有多个元件翅片的散热片。 根据一个实施例，冷却装置具有由散热片基部的冷却翅片的高度方向上的翅片密度均匀的元件翅片构成的第一冷却翅片。 与冷却翅片上部的翅片密度相比，冷却装置还具有第二冷却翅片，其在靠近冷却翅片的翅片底部的下部处具有零或小翅片密度的元件翅片。 第一和第二冷却片彼此相邻地定位。 公开了散热片的各种不同实施例。

    Low thermal resistant, fluid-cooled semiconductor module
    36.
    发明授权
    Low thermal resistant, fluid-cooled semiconductor module 失效
    低耐热，流体冷却的半导体模块

    公开(公告)号：US5774334A

    公开(公告)日：1998-06-30

    申请号：US520338

    申请日：1995-08-28

    申请人： Keizo Kawamura ,  Noriyuki Ashiwake ,  Takahiro Daikoku ,  Akio Idei ,  Kenichi Kasai ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Shigeyuki Sasaki

    发明人： Keizo Kawamura ,  Noriyuki Ashiwake ,  Takahiro Daikoku ,  Akio Idei ,  Kenichi Kasai ,  Hideyuki Kimura ,  Atsuo Nishihara ,  Toshio Hatada ,  Shigeyuki Sasaki

    IPC分类号： H01L23/433 ,  H05K7/20

    CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253

    摘要： Semiconductor devices are fixed on a substrate by solder and a semiconductor module having an enclosed structure is formed by the substrate, flanges and a housing. Two groups of heat conducting members, each having fins respectively in contract with the semiconductor devices and an inner wall of the housing are attached to the semiconductors. A fin thickness of each fin of the two groups of heat conducting members is comparatively thick, a fin height is low and the respective fins of the respective opposed heat conducting members have with very small clearances therebetween. A liquid as a heat conducting medium is enclosed in the semiconductor module. The liquid level of the semiconductor module is controlled such that it contacts a uppermost semiconductor device in the semiconductor module in a vertical arrangement. Further, valve mechanisms for introducing and removing a cooling fluid are provided at a top face and a bottom face of a space formed in the semiconductor module. The mass production capability of the heat conducting members is improved by providing such highly rigid fins, and improved cooling function is provided by firmly introducing the cooling medium to the respective fins while permitting the module to be reduced in size.

    摘要翻译： 半导体器件通过焊料固定在衬底上，并且具有封闭结构的半导体模块由衬底，凸缘和壳体形成。 两组导热构件分别与半导体装置收缩的翅片和壳体的内壁连接到半导体。 两组导热构件的每个翅片的翅片厚度相对较厚，翅片高度低，并且相应的相对的导热构件的各个翅片之间的间隙非常小。 作为导热介质的液体封装在半导体模块中。 半导体模块的液面被控制成使得其以垂直方式接触半导体模块中的最上面的半导体器件。 此外，在半导体模块中形成的空间的顶面和底面设置有用于引入和移除冷却流体的阀机构。 通过提供这种高度刚性的翅片来提高导热构件的批量生产能力，并且通过将冷却介质牢固地引入各个翅片来提供改进的冷却功能，同时允许模块减小尺寸。

    Cooling apparatus of electronic devices
    37.
    发明授权
    Cooling apparatus of electronic devices 失效
    电子设备冷却装置

    公开(公告)号：US5595240A

    公开(公告)日：1997-01-21

    申请号：US464581

    申请日：1995-06-05

    申请人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    发明人： Takahiro Daikoku ,  Noriyuki Ashiwake ,  Nobuo Kawasaki ,  Shizuo Zushi

    IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/34

    CPC分类号： H01L23/4338 ,  H01L2224/16225

    摘要： A cooling apparatus of electronic devices including thermal conductive members each of which is positioned with one side thereof being in contact with a surface of each electronic device, the other side thereof being fitted to a housing with a small clearance provided therebetween, so as to diffuse and remove heat generated in the electronic devices. In order to press each thermal conductive member onto the associated electronic device, a resilient member is provided between the housing and the thermal conductive member, and is arranged to have a width larger than a width of grooves between fins formed on the housing and also larger than a width of grooves between fins formed on the thermal conductive member. A setting space to receive each resilient member therein is formed in a region where the fins are fitted to each other, so that the resilient member and the thermal conductive member can be fitted and positioned with respect to the housing when the resilient member is provided in this setting space.

    摘要翻译： 一种电子设备的冷却装置，包括导热构件，每个导热构件的一侧与每个电子装置的表面接触，其另一侧装配到具有设置在其间的小间隙的壳体，以便扩散 并去除电子设备中产生的热量。 为了将每个导热构件按压到相关联的电子装置上，弹性构件设置在壳体和导热构件之间，并且布置成具有比形成在壳体上的翅片之间的凹槽的宽度更大的宽度，并且还更大 比形成在导热构件上的翅片之间的槽宽度大。 在翅片彼此装配的区域中形成有用于接收其中的每个弹性构件的设置空间，使得当弹性构件设置在弹性构件中时，可以将弹性构件和导热构件相对于壳体配合和定位 这个设置空间。

    Heat transfer surface and manufacturing method for same
    40.
    发明授权
    Heat transfer surface and manufacturing method for same 失效
    传热面及其制造方法相同

    公开(公告)号：US4561497A

    公开(公告)日：1985-12-31

    申请号：US561070

    申请日：1983-12-14

    申请人： Tadakatsu Nakajima ,  Wataru Nakayama ,  Takahiro Daikoku ,  Heikichi Kuwahara ,  Akira Yasukawa ,  Katsuhiko Kasuya ,  Kazuaki Yokoi ,  Hideo Nakae ,  Hiromichi Yoshida

    发明人： Tadakatsu Nakajima ,  Wataru Nakayama ,  Takahiro Daikoku ,  Heikichi Kuwahara ,  Akira Yasukawa ,  Katsuhiko Kasuya ,  Kazuaki Yokoi ,  Hideo Nakae ,  Hiromichi Yoshida

    IPC分类号： F28F13/02 ,  F28F1/10 ,  F28F13/18

    CPC分类号： F28F13/187 ,  Y10T29/49378

    摘要： In a heat transfer surface having cavity groups and restricted opening groups in an outer surface region, the cavity groups are composed of a plurality of rows of void strip members. The cavity strip members are arranged in parallel on a base member of the heat transfer surface and are laminated in one or more layers. Each strip member has a number of elongate cavities laterally arranged in parallel. The elongate cavities are closed at upper surfaces and have at both ends openings. The adjacent cavities in the same layer are communicated with each other by communicating portions each provided between the cavity strip members and by the openings. The restricted opening groups are formed on the upper surfaces of the communicating portions. The restricted opening groups render the communicating portions in one layer, the communicating portions in another layer and the outside to communicate with each another. The method of manufacturing such a heat transfer surface is also disclosed.

    摘要翻译： 在具有空腔组和外表面区域中的限制开口组的传热表面中，空腔组由多排空隙条构件组成。 空腔条构件平行地布置在传热表面的基底构件上，并且层叠成一层或多层。 每个带状构件具有横向布置成平行的多个细长空腔。 细长的空腔在上表面封闭并且在两端开口。 相同层中的相邻空腔通过各个设置在空腔条形构件之间的连通部分和开口彼此连通。 限制的开口组形成在连通部的上表面上。 受限制的开口组使一个层中的通信部分，另一层中的通信部分和外部彼此通信。 还公开了制造这种传热表面的方法。