公开(公告)号：US06528878B1

公开(公告)日：2003-03-04

申请号：US09631889

申请日：2000-08-04

申请人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

发明人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

IPC分类号： H01L2334

CPC分类号： H01L23/10 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1626

摘要： According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

摘要翻译： 根据本发明，多芯片模块中的密封顶板由具有与多层电路基板的热膨胀系数一致的高导热性的陶瓷形成。 覆盖整个冷却流路槽的冷却流路盖形成为单独的金属部件。 密封顶板的形成冷却流路槽的背面使用焊料直接接合在半导体装置的背面。 提供具有低热阻的导热护套。 多芯片模块密封框架焊接到密封顶板的边缘。 此外，诸如O形圈的密封材料简单地介于密封顶板的边缘和冷却水通道盖之间，并且紧固装置用于紧固金属冷却流路盖和多芯片模块密封框架 对彼此。

公开(公告)号：US07518233B1

公开(公告)日：2009-04-14

申请号：US09590897

申请日：2000-06-09

申请人： Kouichi Takahashi ,  Kenichi Kasai ,  Takahiro Daikoku ,  Takayuki Uda ,  Toshitada Netsu ,  Takeshi Yamaguchi ,  Takahiko Matsushita ,  Osamu Maruyama

发明人： Kouichi Takahashi ,  Kenichi Kasai ,  Takahiro Daikoku ,  Takayuki Uda ,  Toshitada Netsu ,  Takeshi Yamaguchi ,  Takahiko Matsushita ,  Osamu Maruyama

IPC分类号： H01L23/12 ,  H01L23/10 ,  H01L23/34 ,  H01L23/28 ,  H01L21/00

CPC分类号： H01L23/4006 ,  H01L2023/4068 ,  H01L2023/4081 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/09701

摘要： A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in thermal expansion rate is fixed with solder 8 to the face of the wiring board 1 for mounting semiconductor devices 2; a rubber O-ring 15 is placed between the upper face of the frame 5 and the under face of the circumference of an air-cooled: heat sink 7; the plastic member 6 making possible relative sliding is placed between the upper face of the circumference of the heat sink 7 and the upper frame 10; the upper face of a plastic member 6 is restrained with the inside middle stage of an upper frame 10; and the lower part of the upper frame 10 and the frame 5 are fastened together with bolts 9.

摘要翻译： 提供一种用于具有稳定的冷却性能和优异的密封可靠性的多芯片模块的密封结构。 以热膨胀率与布线板1相容的框架5的底面用焊料8固定到布线板1的面上，用于安装半导体器件2; 橡胶O形环15放置在框架5的上表面和空气冷却：散热器7的圆周的下表面之间; 能够进行相对滑动的塑料构件6设置在散热器7的周边的上表面与上框架10之间; 塑料构件6的上表面被上框架10的内侧中间段限制; 并且上部框架10的下部和框架5用螺栓9紧固在一起。

公开(公告)号：US06890799B2

公开(公告)日：2005-05-10

申请号：US10338485

申请日：2003-01-07

申请人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

发明人： Takahiro Daikoku ,  Kenichi Kasai ,  Toshitada Netsu ,  Koichi Koyano ,  Takayuki Uda

IPC分类号： H01L23/10 ,  H01L23/473 ,  H01L21/48 ,  H01L23/34 ,  H05K7/20

CPC分类号： H01L23/10 ,  H01L23/473 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1626

摘要： According to the invention, a sealing top plate in a multi-chip module is formed from a ceramic with high thermal conductivity having a thermal expansion coefficient consistent with that of a multi-layer circuit substrate. A cooling flow path cover covering the entirety of cooling flow path grooves is formed as a separate metallic member. The back surface of the sealing top plate, on which are formed the cooling flow path grooves, is bonded directly to the back surface of a semiconductor device using solder. A thermal-conductive jacket with low thermal resistance is provided. A multi-chip module sealing frame is soldered to the edge of the sealing top plate. Furthermore, a sealing material such as an O-ring is simply interposed between the edge of the sealing top plate and the cooling water path cover, and tightening means is used to tighten the metallic cooling flow path cover and the multi-chip module sealing frame to each other.

摘要翻译： 根据本发明，多芯片模块中的密封顶板由具有与多层电路基板的热膨胀系数一致的高导热性的陶瓷形成。 覆盖整个冷却流路槽的冷却流路盖形成为单独的金属部件。 密封顶板的形成冷却流路槽的背面使用焊料直接接合在半导体装置的背面。 提供具有低热阻的导热护套。 多芯片模块密封框架焊接到密封顶板的边缘。 此外，诸如O形圈的密封材料简单地介于密封顶板的边缘和冷却水通道盖之间，并且紧固装置用于紧固金属冷却流路盖和多芯片模块密封框架 对彼此。

公开(公告)号：US06272020B1

公开(公告)日：2001-08-07

申请号：US09173174

申请日：1998-10-15

申请人： Hiromi Tosaki ,  Takaji Takenaka ,  Kazutoshi Takahashi ,  Norio Sengoku ,  Toshitada Netsu

发明人： Hiromi Tosaki ,  Takaji Takenaka ,  Kazutoshi Takahashi ,  Norio Sengoku ,  Toshitada Netsu

IPC分类号： H05K116

CPC分类号： H01L23/50 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19106 ,  H05K1/0231 ,  H05K1/145 ,  H05K1/183 ,  H05K3/301 ,  H05K2201/10424 ,  H05K2201/1053 ,  H05K2201/10734

摘要： A semiconductor device-mounting substrate is provided with a semiconductor device, a capacitor device, and a wiring substrate. The wiring substrate has a space in which the capacitor device should be located, and the capacitor device is locate in the space. Terminals of a driving power supply wiring for the semiconductor device are provided on a surface of the space, and the terminals are connected with the capacitor device.

摘要翻译： 半导体器件安装基板设置有半导体器件，电容器器件和布线基板。 布线基板具有电容器装置所在的空间，电容器装置位于该空间中。 用于半导体器件的驱动电源布线的端子设置在该空间的表面上，并且端子与电容器器件连接。

公开(公告)号：US5136360A

公开(公告)日：1992-08-04

申请号：US563281

申请日：1990-08-06

申请人： Masahide Harada ,  Ryohei Satoh ,  Fumiyuki Kobayashi ,  Takaji Takenaka ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai

发明人： Masahide Harada ,  Ryohei Satoh ,  Fumiyuki Kobayashi ,  Takaji Takenaka ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai

IPC分类号： B23K35/22 ,  B23K35/26 ,  C22C13/00 ,  H01L21/60 ,  H01L23/488 ,  H05K3/34

CPC分类号： H05K3/3463 ,  B23K35/262 ,  H01L23/488 ,  H01L2224/16225

摘要： An electronic circuit device comprising an electronic part having a gold-plated connecting terminal arranged thereon connected through a solder to a circuit substrate on the predetermined connecting element thereof, in which the connecting terminal of the electronic part and the solder-connected portion of the circuit substrate are constituted by an alloy composition consisting of 1.0 to 8.0 wt. % of Ag, 0.1 to 6.0 wt % of Au and the balance of Sn, is provided. The device is made by using a solder for use in connecting a gold-plated connecting terminal which consists of 1.0 to 8.0 wt % of Ag and the balance of Sn and a method of connecting an electronic part having a gold-plated connecting terminal arranged thereon to a circuit substrate, which comprises the steps of placing the electronic part and the gold-plated connected terminal so as to face each other via a solder and then melting the solder to connect and fix the connecting terminal to the circuit substrate onto the predetermined element thereof, the composition of said solder consisting of 1.0 to 8.0 wt % Ag and the balance of Sn.

摘要翻译： 一种电子电路装置，包括电子部件，该电子部件具有通过焊料连接到其预定连接元件上的电路基板上的镀金连接端子，其中电子部件的连接端子和电路的焊接部分 基材由1.0〜8.0重量份的合金组成构成。 提供Ag的％，0.1〜6.0重量％的Au和余量的Sn。 该装置通过使用焊料制成，用于连接由1.0至8.0重量％的Ag组成的镀金连接端子和余量的Sn，以及连接其上布置有镀金连接端子的电子部件的方法 电路基板，其包括以下步骤：通过焊料将电子部件和镀金连接的端子放置成彼此面对，然后熔化焊料以将连接端子连接并固定到电路基板到预定元件 所述焊料的组成由1.0至8.0重量％的Ag和余量的Sn组成。

公开(公告)号：US5151773A

公开(公告)日：1992-09-29

申请号：US676389

申请日：1991-03-28

申请人： Kiyoshi Matsui ,  Ryohei Satoh ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai ,  Kenichi Hamamura

发明人： Kiyoshi Matsui ,  Ryohei Satoh ,  Toshitada Netsu ,  Hideaki Sasaki ,  Mitugu Shirai ,  Kenichi Hamamura

IPC分类号： H01L23/10

CPC分类号： H01L23/10 ,  H01L2924/0002 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/16315

摘要： An electronic circuit apparatus in which electronic circuit components are mounted to multiwiring substrate or the like for use with electronic circuits such as an LSI are sealed airtight by sealing units. The sealing unit is sealed by an upper board designated as an upper board sealing unit and a side board designated as a side board sealing unit, and the shape of the edge on cross section of the side board is convex or circular. Metallization is applied to solder joint portions between a substrate and a side board and between the side board and the upper board, and a predetermined solder joint height is provided by a support post to effect solder joining.

摘要翻译： 将电子电路部件安装到多路接线基板等上以与诸如LSI的电子电路一起使用的电子电路装置通过密封单元密封。 密封单元由指定为上板密封单元的上板和指定为侧板密封单元的侧板密封，侧板的横截面的边缘的形状为凸形或圆形。 金属化应用于基板和侧板之间以及侧板和上板之间的焊接部分，并且由支撑柱提供预定的焊点高度以实现焊料接合。