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    LED LAMP WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION UTILIZING RED EMITTERS
    31.
    发明申请
    LED LAMP WITH REMOTE PHOSPHOR AND DIFFUSER CONFIGURATION UTILIZING RED EMITTERS 有权
    带有远程荧光灯的LED灯泡和利用红色发射体的差分配置

    公开(公告)号：US20110227469A1

    公开(公告)日：2011-09-22

    申请号：US13028913

    申请日：2011-02-16

    申请人： Zongjie Yuan ,  Eric Tarsa ,  Tao Tong ,  Ronan Letoquin ,  Bernd Keller ,  Long Larry Le ,  James Michael Lay ,  Randolph Cary Demuynck

    发明人： Zongjie Yuan ,  Eric Tarsa ,  Tao Tong ,  Ronan Letoquin ,  Bernd Keller ,  Long Larry Le ,  James Michael Lay ,  Randolph Cary Demuynck

    IPC分类号： H01J61/52 ,  H01J1/62

    CPC分类号： F21K9/135 ,  F21K9/232 ,  F21K9/64 ,  F21V3/02 ,  F21V3/12 ,  F21V9/30 ,  F21V29/505 ,  F21V29/507 ,  F21V29/677 ,  F21V29/745 ,  F21V29/75 ,  F21V29/773 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10

    摘要： Lamps and bulbs are disclosed generally comprising different combinations and arrangement of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. Additionally, this arrangement allows aesthetic masking or concealment of the appearance of the conversion regions or layers when the lamp is not illuminated. Some embodiments of the present invention utilize LED chips to provide one or more lighting components instead of providing the components through phosphor conversion. This can provide for lamps that can be operated with lower power and can be manufactured at lower cost. In one embodiment, a red lighting component can be provided by red emitting LEDs as opposed to a red conversion material.

    摘要翻译： 公开了通常包括光源，一个或多个波长转换材料，相对于光源单独或远程定位的区域或层的不同组合和布置的灯和灯泡，以及单独的漫射层。 这种布置允许制造高效，可靠和成本有效的灯和灯泡，并且可以提供基本上全方位的发射图案，即使由包括LED的共面布置的光源也是如此。 此外，当灯不被照亮时，这种布置允许对转换区域或层的外观的美观掩蔽或隐藏。 本发明的一些实施例利用LED芯片来提供一个或多个照明组件，而不是通过磷光体转换提供组件。 这可以提供可以以较低功率操作并且可以以较低成本制造的灯。 在一个实施例中，与红色转换材料相反，可以通过红色发光的LED提供红色照明部件。

    SOLID STATE LAMP WITH THERMAL SPREADING ELEMENTS AND LIGHT DIRECTING OPTICS
    32.
    发明申请
    SOLID STATE LAMP WITH THERMAL SPREADING ELEMENTS AND LIGHT DIRECTING OPTICS 审中-公开
    具有热膨胀元件和光导光学的固态灯

    公开(公告)号：US20110215345A1

    公开(公告)日：2011-09-08

    申请号：US13029068

    申请日：2011-02-16

    申请人： ERIC TARSA ,  Ronan Letoquin ,  Tao Tong ,  Bernd Keller

    发明人： ERIC TARSA ,  Ronan Letoquin ,  Tao Tong ,  Bernd Keller

    IPC分类号： H01L27/15 ,  H01L33/60 ,  H01L33/62

    CPC分类号： F21K9/232 ,  F21K9/60 ,  F21K9/62 ,  F21K9/64 ,  F21V3/02 ,  F21V3/12 ,  F21V29/00 ,  F21V29/505 ,  F21V29/773 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： Lamps and bulbs are disclosed generally comprising different combinations and arrangements of a light source, one or more wavelength conversion materials, regions or layers which are positioned separately or remotely with respect to the light source, and a separate diffusing layer. This arrangement allows for the fabrication of lamps and bulbs that are efficient, reliable and cost effective and can provide an essentially omni-directional emission pattern, even with a light source comprised of a co-planar arrangement of LEDs. The lamps according to the present invention can also comprise thermal management features that provide for efficient dissipation of heat from the LEDs, which in turn allows the LEDs to operate at lower temperatures. The lamps can also comprise optical elements to help change the emission pattern from the generally directional (e.g. Lambertian) pattern of the LEDs to a more omni-directional pattern.

    摘要翻译： 公开了通常包括光源，一个或多个波长转换材料，相对于光源单独或远程定位的区域或多个层的不同组合和布置的灯泡和单独的扩散层。 这种布置允许制造高效，可靠和成本有效的灯和灯泡，并且可以提供基本上全方位的发射图案，即使由包括LED的共面布置的光源也是如此。 根据本发明的灯还可以包括热管理特征，其提供来自LED的热量的有效耗散，这又允许LED在较低温度下操作。 灯还可以包括光学元件，以帮助将发射图案从LED的大致定向（例如朗伯式）图案改变为更全面的图案。

    LED lamp incorporating remote phosphor and diffuser with heat dissipation features
    34.
    发明授权
    LED lamp incorporating remote phosphor and diffuser with heat dissipation features 有权
    配有远程荧光粉和扩散器的LED灯具具有散热功能

    公开(公告)号：US08632196B2

    公开(公告)日：2014-01-21

    申请号：US13029005

    申请日：2011-02-16

    申请人： Tao Tong ,  Ronan Letoquin ,  Bernd Keller ,  Eric Tarsa

    发明人： Tao Tong ,  Ronan Letoquin ,  Bernd Keller ,  Eric Tarsa

    IPC分类号： F21V9/16

    CPC分类号： H01L33/505 ,  F21K9/232 ,  F21K9/64 ,  F21V3/02 ,  F21V3/12 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can have a three-dimensional shape, and can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED light is converted by the phosphor carrier, with some lamp embodiments emitting a white light combination of LED and phosphor light. The phosphors in the phosphor carriers can be arranged to operate at a lower temperature to thereby operate at greater phosphor conversion efficiency and with reduced heat related damage to the phosphor. The lamps or bulbs can also comprise a diffuser over the phosphor carrier to distribute light and to conceal the phosphor carrier.

    摘要翻译： 公开了一种LED灯或灯泡，其包括光源，散热器结构和具有至少一种转换材料的远程荧光体载体。 荧光体载体可以远离光源并且安装到散热器，使得来自荧光体载体的热量扩散到散热器中。 荧光体载体可以具有三维形状，并且可以包括导热透明材料和荧光体层，其中基于LED的光源安装到散热器，使得来自光源的光通过荧光体载体。 至少一些LED光由荧光体载体转换，一些灯实施例发射LED和磷光体的白光组合。 荧光体载体中的荧光体可以被布置成在较低的温度下操作，从而以更高的荧光体转换效率和减少与荧光体相关的热损伤来操作。 灯泡或灯泡还可以包括荧光体载体上的漫射器以分配光并隐藏磷光体载体。

    LED LAMP INCORPORATING REMOTE PHOSPHOR AND DIFFUSER WITH HEAT DISSIPATION FEATURES
    35.
    发明申请
    LED LAMP INCORPORATING REMOTE PHOSPHOR AND DIFFUSER WITH HEAT DISSIPATION FEATURES 有权
    LED灯具配备远程磷光体和散热器，具有散热功能

    公开(公告)号：US20110215700A1

    公开(公告)日：2011-09-08

    申请号：US13029005

    申请日：2011-02-16

    申请人： TAO TONG ,  Ronan Letoquin ,  Bernd Keller ,  Eric Tarsa

    发明人： TAO TONG ,  Ronan Letoquin ,  Bernd Keller ,  Eric Tarsa

    IPC分类号： H01J61/52

    CPC分类号： H01L33/505 ,  F21K9/232 ,  F21K9/64 ,  F21V3/02 ,  F21V3/12 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and a remote phosphor carrier having at least one conversion material. The phosphor carrier can be remote to the light sources and mounted to the heat sink so that heat from the phosphor carrier spreads into the heat sink. The phosphor carrier can have a three-dimensional shape, and can comprise a thermally conductive transparent material and a phosphor layer, with an LED based light source mounted to the heat sink such that light from the light source passes through the phosphor carrier. At least some of the LED light is converted by the phosphor carrier, with some lamp embodiments emitting a white light combination of LED and phosphor light. The phosphors in the phosphor carriers can be arranged to operate at a lower temperature to thereby operate at greater phosphor conversion efficiency and with reduced heat related damage to the phosphor. The lamps or bulbs can also comprise a diffuser over the phosphor carrier to distribute light and to conceal the phosphor carrier.

    摘要翻译： 公开了一种LED灯或灯泡，其包括光源，散热器结构和具有至少一种转换材料的远程荧光体载体。 荧光体载体可以远离光源并且安装到散热器，使得来自荧光体载体的热量扩散到散热器中。 荧光体载体可以具有三维形状，并且可以包括导热透明材料和荧光体层，其中基于LED的光源安装到散热器，使得来自光源的光通过荧光体载体。 至少一些LED光由荧光体载体转换，一些灯实施例发射LED和磷光体的白光组合。 荧光体载体中的荧光体可以被布置成在较低的温度下操作，从而以更高的荧光体转换效率和减少与荧光体相关的热损伤来操作。 灯泡或灯泡还可以包括荧光体载体上的漫射器以分配光并隐藏磷光体载体。

    Semiconductor Light Emitting Device Packages Including Submounts
    39.
    发明申请
    Semiconductor Light Emitting Device Packages Including Submounts 有权
    半导体发光装置包括底座

    公开(公告)号：US20100109029A1

    公开(公告)日：2010-05-06

    申请号：US12685883

    申请日：2010-01-12

    申请人： Ban P. Loh ,  Nicholas Medendorp, JR. ,  Bernd Keller

    发明人： Ban P. Loh ,  Nicholas Medendorp, JR. ,  Bernd Keller

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/19107 ,  H01L2924/00014

    摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.

    摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。

    Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same
    40.
    发明授权
    Submounts for semiconductor light emitting device packages and semiconductor light emitting device packages including the same 有权
    用于半导体发光器件封装的底座以及包括其的半导体发光器件封装

    公开(公告)号：US07655957B2

    公开(公告)日：2010-02-02

    申请号：US11412381

    申请日：2006-04-27

    申请人： Ban P. Loh ,  Nicholas Medendorp, Jr. ,  Bernd Keller

    发明人： Ban P. Loh ,  Nicholas Medendorp, Jr. ,  Bernd Keller

    IPC分类号： H01L29/22 ,  H01L23/48

    CPC分类号： H01L25/0753 ,  F21K9/00 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/19107 ,  H01L2924/00014

    摘要： A submount for a solid state lighting package includes a support member having upper and lower surfaces, a first side surface, and a second side surface opposite the first side surface, a first electrical bondpad on the upper surface of the support member and having a first bonding region proximate the first side surface of the support member and a second bonding region extending toward the second side surface of the support member, and a second electrical bondpad on the upper surface of the support member having a die mounting region proximate the first side surface of the support member and an extension region extending toward the second side surface of the support member. The die mounting region of the second electrical bondpad may be configured to receive an electronic device. The submount further includes a third electrical bondpad on the upper surface of the support member and positioned between the second side surface of the support member and the die mounting region of the second electrical bondpad.

    摘要翻译： 一种用于固体照明包装的基座，包括具有上表面和下表面的支撑构件，第一侧表面和与第一侧表面相对的第二侧表面，位于支撑构件的上表面上的第一电接合垫， 接合区域靠近支撑构件的第一侧表面，以及第二接合区域，其朝着支撑构件的第二侧表面延伸，并且在支撑构件的上表面上的第二电接合板具有靠近第一侧表面的模具安装区域 并且延伸到所述支撑构件的第二侧表面的延伸区域。 第二电接合板的管芯安装区域可以被配置为接收电子设备。 底座还包括位于支撑构件的上表面上并位于支撑构件的第二侧表面和第二电接合垫的模具安装区域之间的第三电接合板。