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公开(公告)号：US20110200952A1
公开(公告)日：2011-08-18
申请号：US13024430
申请日：2011-02-10
CPC分类号： G03F7/3021
摘要： There is provided a developing apparatus and a developing method capable of rapidly forming a liquid film of a developing solution on an entire surface of a substrate while reducing a usage amount of the developing solution. The developing apparatus includes an airtightly sealed processing vessel that forms a processing atmosphere therein; a temperature control plate that is provided within the processing vessel and mounts the substrate thereon; an atmosphere gas supply unit that supplies an atmosphere gas including mist and vapor of a developing solution onto a surface of the substrate within the processing vessel; and a first temperature control unit that controls the temperature control plate to a temperature allowing the atmosphere gas to be condensed on the substrate. Here, an inner wall of the processing vessel is maintained at a temperature at which the atmosphere gas is hardly condensed on the inner wall.
摘要翻译： 提供了一种能够在减少显影液的使用量的同时在基板的整个表面上快速形成显影液的液膜的显影装置和显影方法。 显影装置包括在其中形成处理气氛的气密密封处理容器; 温度控制板，设置在处理容器内并将基板安装在其上; 气氛气体供给单元，其将包含显影液的雾和气体的气氛气体供给到所述处理容器内的所述基板的表面上; 以及第一温度控制单元，其将温度控制板控制为允许气氛气体在基板上冷凝的温度。 这里，处理容器的内壁保持在气氛气体几乎不凝结在内壁上的温度。
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公开(公告)号：US20100323307A1
公开(公告)日：2010-12-23
申请号：US12869446
申请日：2010-08-26
IPC分类号： G03F7/20
CPC分类号： H01L21/6715 , G03F7/3028
摘要： A developing apparatus for developing a substrate whose surface is coated with a coating solution and then exposed includes a substrate supporting unit for horizontally supporting the substrate, a rotation driving mechanism for rotating the substrate supporting unit forwardly or backwardly with respect to a vertical axis, a developer nozzle, disposed to face a surface of the substrate supported by the substrate supporting unit, having a strip-shaped injection opening extended along a direction extending from a periphery of the substrate toward a central portion thereof, a moving unit for moving the developer nozzle from an outer portion of the substrate toward the central portion thereof, and a controller for controlling operations such that while the substrate is rotated forwardly by the rotation driving mechanism, a developer is supplied through the injection opening to the surface of the substrate by moving the developer nozzle and, then, the substrate is rotated backwardly by the rotation driving mechanism.
摘要翻译： 用于显影表面被涂布溶液然后露出的基板的显影装置包括用于水平支撑基板的基板支撑单元，用于相对于垂直轴向前或向后旋转基板支撑单元的旋转驱动机构， 显影剂喷嘴，设置成面对由基板支撑单元支撑的基板的表面，具有沿着从基板的周边朝向其中心部分延伸的方向延伸的条形喷射口;移动单元，用于移动显影剂喷嘴 从基板的外部朝向其中央部分，以及控制器，用于控制操作，使得当基板通过旋转驱动机构向前旋转时，通过将喷射开口移动到基板的表面，将显影剂供应到基板的表面 显影剂喷嘴，然后基板由r向后旋转 驾驶机制
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公开(公告)号：US07806076B2
公开(公告)日：2010-10-05
申请号：US11201102
申请日：2005-08-11
IPC分类号： B05C11/10
CPC分类号： H01L21/6715 , G03F7/3028
摘要： A developing apparatus for developing a substrate whose surface is coated with a coating solution and then exposed includes a substrate supporting unit for horizontally supporting the substrate, a rotation driving mechanism for rotating the substrate supporting unit forwardly or backwardly with respect to a vertical axis, a developer nozzle, disposed to face a surface of the substrate supported by the substrate supporting unit, having a strip-shaped injection opening extended along a direction extending from a periphery of the substrate toward a central portion thereof, a moving unit for moving the developer nozzle from an outer portion of the substrate toward the central portion thereof, and a controller for controlling operations such that while the substrate is rotated forwardly by the rotation driving mechanism, a developer is supplied through the injection opening to the surface of the substrate by moving the developer nozzle and, then, the substrate is rotated backwardly by the rotation driving mechanism.
摘要翻译： 用于显影表面被涂布溶液然后露出的基板的显影装置包括用于水平支撑基板的基板支撑单元，用于相对于垂直轴向前或向后旋转基板支撑单元的旋转驱动机构， 显影剂喷嘴，设置成面对由基板支撑单元支撑的基板的表面，具有沿着从基板的周边朝向其中心部分延伸的方向延伸的条形喷射口;移动单元，用于移动显影剂喷嘴 从基板的外部朝向其中央部分，以及控制器，用于控制操作，使得当基板通过旋转驱动机构向前旋转时，通过将喷射开口移动到基板的表面，将显影剂供应到基板的表面 显影剂喷嘴，然后基板由r向后旋转 驾驶机制
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公开(公告)号：US20100216078A1
公开(公告)日：2010-08-26
申请号：US12710510
申请日：2010-02-23
申请人： Taro YAMAMOTO , Kousuke Yoshihara , Yuichi Yoshida
发明人： Taro YAMAMOTO , Kousuke Yoshihara , Yuichi Yoshida
IPC分类号： G03C7/407
CPC分类号： H01L21/027 , G03F7/3021 , H01L21/67051 , H01L21/6715
摘要： Disclosed is a developing method that develops a substrate, which has a surface coated with a resist having been exposed, while the substrate is held horizontally and is rotating about a vertical axis. The method includes supplying a developing liquid from a discharge port of a developer nozzle onto the surface of the substrate, while moving the developer nozzle, disposed above the substrate, from a central portion of the substrate toward a peripheral portion of the substrate, and supplying a first rinse liquid from a discharge port of a first rinse nozzle onto the surface of the substrate, while moving the first rinse nozzle, disposed above the substrate, from the central portion of the substrate toward the peripheral portion of the substrate. The supplying of the developing liquid and the supplying the first rinse liquid are performed concurrently, while the first rinse nozzle is maintained nearer to a center of the substrate than the developer nozzle.
摘要翻译： 公开了一种显影方法，其显影方法是在基板被水平地保持并且围绕垂直轴线旋转的同时，使具有被曝光的抗蚀剂的表面被覆的基板。 该方法包括将显影剂喷嘴的排出口的显影液从衬底的中心部分朝向衬底的周边部分移动，将显影剂喷嘴的显影剂供给到衬底的表面上， 将第一冲洗喷嘴的第一冲洗液从第一冲洗喷嘴的排出口喷射到基板的表面上，同时将基板上方的第一冲洗喷嘴从基板的中心部朝向基板的周边部分移动。 同时进行显影液的供给和供给第一冲洗液，同时第一冲洗喷嘴比显影剂喷嘴更靠近基板的中心。
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公开(公告)号：US20090130614A1
公开(公告)日：2009-05-21
申请号：US10584264
申请日：2004-12-24
CPC分类号： H01L21/67051 , G03F7/3021 , H01L21/6708 , H01L21/6715 , H01L21/6719 , Y10S134/902
摘要： A developer nozzle is moved from a periphery of a wafer toward the central portion while an exposed substrate held at a spin chuck is being rotated about a vertical axis and while a developing solution is being discharged from the developer nozzle, and this way the developing solution is supplied to the surface of the wafer, the developer nozzle having a slit-like ejection port whose longitudinal direction is oriented to the direction perpendicular to the radial direction of the wafer. The movement speed of the nozzle is higher than a case where a nozzle with a small-diameter circular nozzle is used, and this enables a development time to be reduced. Further, the thickness of a developing solution on a substrate can be reduced, so that the developing solution can be saved.
摘要翻译： 显影剂喷嘴从晶片的周边朝向中心部分移动，同时保持在旋转卡盘处的暴露的基板围绕垂直轴线旋转并且显影液从显影剂喷嘴排出，并且以这种方式，显影液 被提供到晶片的表面，显影剂喷嘴具有狭缝状喷射口，其纵向方向定向为垂直于晶片的径向的方向。 喷嘴的移动速度高于使用具有小直径圆形喷嘴的喷嘴的情况，这使得能够减少显影时间。 此外，可以减少基板上的显影液的厚度，从而可以节省显影液。
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36.发明申请COATING AND DEVELOPING METHOD, COATING AND DEVELOPING SYSTEM AND STORAGE MEDIUM 有权涂料与开发方法，涂料和开发体系和储存介质公开(公告)号：US20070184392A1
公开(公告)日：2007-08-09
申请号：US11623481
申请日：2007-01-16
IPC分类号： G03C5/00
CPC分类号： G03F7/2041 , G03F7/11 , G03F7/38
摘要： A resist film formed on a substrate is coated with a water-repellent protective film and the substrate is subjected to a developing process after the substrate has been processed by an immersion exposure process. The protective film is removed from the substrate after the resist film has been processed by the immersion exposure process, the substrate is processed by a heating process, and then the substrate is subjected to a developing process. The surface of the substrate is cleaned with a cleaning liquid before the protective film is removed and after the substrate has been processed by the immersion exposure process or the surface of the substrate is cleaned with a cleaning liquid after removing the protective film and before the substrate is subjected to the heating process.
摘要翻译： 在基板上形成的抗蚀剂膜涂覆有防水保护膜，并且在通过浸没曝光工艺处理基板之后对基板进行显影处理。 在通过浸渍曝光工艺处理了抗蚀剂膜之后，从基板上除去保护膜，通过加热工艺处理基板，然后对基板进行显影处理。 在除去保护膜之前，用浸渍曝光工序处理基板后，用清洗液清洗基板的表面，在除去保护膜之后和基板之前用清洗液清洗基板的表面 进行加热处理。
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37.发明授权公开(公告)号：US06811962B2
公开(公告)日：2004-11-02
申请号：US10227814
申请日：2002-08-27
申请人： Kousuke Yoshihara , Keiichi Tanaka , Taro Yamamoto , Hideharu Kyouda , Hirofumi Takeguchi , Atsushi Ookouchi
发明人： Kousuke Yoshihara , Keiichi Tanaka , Taro Yamamoto , Hideharu Kyouda , Hirofumi Takeguchi , Atsushi Ookouchi
IPC分类号： G03F730
CPC分类号： H01L21/6715 , G03D3/06 , G03F7/3021
摘要： In a developing processing of a wafer having a resist film low in the dissolving rate in a developing solution formed thereon and subjected to an exposure treatment, a developing solution of a low concentration is supplied first onto a wafer and the wafer is left to stand for a prescribed time to permit a developing reaction to proceed, followed by further supplying a developing solution having a concentration higher than that of the developing solution supplied first onto the wafer, leaving the substrate to stand and subsequently rinsing the wafer, thereby improving the uniformity of the line width in the central portion and the peripheral portion of the wafer.
摘要翻译： 在其上形成的显影液中的溶解速度低的抗蚀剂膜的显影处理中，首先将低浓度的显影液供给到晶片上，并将晶片放置在 规定的时间以允许显影反应进行，然后进一步提供浓度高于首先提供的显影溶液的显影溶液的显影溶液到晶片上，使基板静置并随后冲洗晶片，由此提高均匀性 晶片的中心部分和周边部分的线宽度。
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38.发明授权公开(公告)号：US09162247B2
公开(公告)日：2015-10-20
申请号：US13448526
申请日：2012-04-17
IPC分类号： B05C11/00 , B05C13/02 , B05C5/00 , B05C11/02 , B05D1/00 , H01L21/67 , G03F7/16 , B05D3/12 , H01L21/00 , H01L51/00
CPC分类号： H01L21/0337 , B05C11/023 , B05D1/005 , G03F7/162 , G06F19/00 , H01L21/0271 , H01L21/6715 , H01L51/0003 , H01L2224/03418
摘要： A coating treatment apparatus supplying a coating solution to a front surface of a rotated substrate and diffusing the supplied coating solution to an outer periphery side of the substrate to thereby apply the coating solution on the front surface of the substrate includes: a substrate holding part holding a substrate; a rotation part rotating the substrate held on the substrate holding part; a supply part supplying a coating solution to a front surface of the substrate held on the substrate holding part; and an airflow control plate provided at a predetermined position above the substrate held on the substrate holding part for locally changing an airflow above the substrate rotated by the rotation part at an arbitrary position.
摘要翻译： 一种涂布处理装置，其将涂布溶液供给到旋转的基板的前表面，并将供给的涂布溶液扩散到基板的外周侧，从而将涂布液涂布在基板的前表面上，包括：保持基板 底物; 旋转部，旋转保持在所述基板保持部上的所述基板; 供给部，其向保持在所述基板保持部的所述基板的前表面供给涂布液; 以及气流控制板，其设置在保持在所述基板保持部上的所述基板上方的预定位置，用于在任意位置局部地改变由所述旋转部旋转的所述基板上方的气流。
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公开(公告)号：US08505479B2
公开(公告)日：2013-08-13
申请号：US12877187
申请日：2010-09-08
申请人： Kousuke Yoshihara , Tomohiro Iseki
发明人： Kousuke Yoshihara , Tomohiro Iseki
CPC分类号： H01L21/6715 , G03F7/162
摘要： A resist coating apparatus supplies a resist solution to substantially the center of a target substrate to be processed while rotating the target substrate at a first rotational speed, then decelerates the rotation of the substrate to a second rotational speed lower than the first rotational speed, or until rotational halt, makes the deceleration smaller in the deceleration step as the rotational speed becomes closer to the second rotational speed or the rotational halt, and accelerates the rotation of the substrate to a third rotational speed higher than the second rotational speed to spin off a residue of the resist solution.
摘要翻译： 抗蚀涂层装置在以第一转速旋转目标基板的同时将抗蚀剂溶液基本上提供到待加工的目标基板的中心，然后使基板的旋转减速到低于第一转速的第二转速，或 直到旋转停止，随着转速变得更接近于第二转速或转动停止，减速步骤中的减速度变小，并且将基板的旋转加速到高于第二转速的第三转速，以使其脱离 抗蚀剂溶液的残留物。
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40.发明授权Coating treatment method, coating treatment apparatus, and computer-readable storage medium 有权涂布处理方法，涂布处理装置和计算机可读存储介质公开(公告)号：US08414972B2
公开(公告)日：2013-04-09
申请号：US12530345
申请日：2008-02-28
IPC分类号： B05D3/12
CPC分类号： H01L21/02104 , B05D1/005 , G03F7/162 , H01L21/02282 , H01L21/6715
摘要： In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.
摘要翻译： 在涂布步骤中，基板高速旋转，并且在该状态下，将抗蚀剂溶液从第一喷嘴排出到基板的中心部分，以将抗蚀剂溶液涂覆在基板上。 随后，在平坦化步骤中，基板的旋转减速，并且基板以低速旋转以使基板上的抗蚀剂溶液平坦化。 在这种情况下，在涂布步骤中，通过第一喷嘴对抗蚀剂溶液的排出进行到平坦化阶段的中间，并且当在平坦化步骤中完成抗蚀剂溶液的排出时，第一喷嘴移动 抗蚀剂溶液从衬底的中心部分的放电位置。 根据本发明，能够将抗蚀剂溶液均匀地涂布在基板内。
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