摘要:
Scratch-resistant coatings for protecting front-side microelectromechanical and semiconductor device features during backside processing are provided, along with methods of using the same. The coatings are non-photosensitive, removable, and tolerate high processing temperatures. These coatings also eliminate the need for a separate etch stop layer in the device design. The coatings are formed from a composition comprising a component dissolved or dispersed in a solvent system. The component is selected from the group consisting of styrene-acrylonitrile copolymers and aromatic sulfone polymers.
摘要:
This invention provides methods of creating via or trench structures on a developer-soluble hardmask layer using a multiple exposure-development process. The hardmask layer is patterned while the imaging layer is developed. After the imaging layer is stripped using organic solvents, the same hardmask can be further patterned using subsequent exposure-development processes. Eventually, the pattern can be transferred to the substrate using an etching process.
摘要:
New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.
摘要:
A transparent two-layer electrostatic dissipating coating includes a first layer comprising a transparent first binder polymer and a first intrinsically conducting polymer (ICP) in an amount sufficient to provide the first layer with a surface resistance of from about 103 to about 105Ω/□; and a second layer in direct contact with the first layer and comprising a transparent second binder polymer and a second ICP in an amount sufficient to provide the second layer with a surface resistance of from about 106 to about 1010Ω/□, wherein the coating has a light transmission of at least about 70% at a wavelength of 600 nm. Methods of making and using the coating are also described.
摘要:
A transparent two-layer electrostatic dissipating coating includes a first layer comprising a transparent first binder polymer and a first intrinsically conducting polymer (ICP) in an amount sufficient to provide the first layer with a surface resistance of from about 103 to about 105Ω/□; and a second layer in direct contact with the first layer and comprising a transparent second binder polymer and a second ICP in an amount sufficient to provide the second layer with a surface resistance of from about 106 to about 1010Ω/□, wherein the coating has a light transmission of at least about 70% at a wavelength of 600 nm. Methods of making and using the coating are also described.
摘要:
A composition is derived from an addition polymerizable organotitanium polymer which upon exposure to an oxygen plasma or baking in air, is converted to titanium dioxide (titania) or is converted to a mixed, titanium-containing metal oxide. The metal oxide formed in situ imparts etch-resistant action to a patterned photoresist layer. The composition may also be directly deposited and patterned into permanent metal oxide device features by a photolithographic process.
摘要:
A composition and a method for forming an anti-reflective layer for DUV microlithographic processes is disclosed. The compositions of the present invention includes a polymer dissolved in a suitable solvent. The polymers are polysulfone and polyurea polymers which possess inherent light absorbing properties at deep ultraviolet wavelengths. In accordance with the method of the present invention, these compositions are applied to a substrate to form an anti-reflective coating, and thereafter a photoresist material that is compatible with the anti-reflective coating is applied.
摘要:
THFA (tetrahydrofurfuryl alcohol) is employed as the active component of edge bead removal compositions negating the need for N-methylpyrrolidone and providing unexpected effectiveness for multilayer microelectronic edge beads having at least one highly polar aromatic polymer layer, particularly when such layer is adjacent to an acid-catalyzed photoresist.
摘要:
New compositions and methods of using those compositions as bonding compositions for temporary wafer bonding are provided. The compositions are used to temporarily bond an active wafer to a carrier wafer or substrate in microelectronic fabrication using an in situ polymerization reaction of the components of the bonding composition to yield the bonding layer. The compositions form polymerized bonding layers that are mechanically strong and thermally resistant, but allow the wafers to be separated at the appropriate stage in the fabrication process. The bonding layer also retains its solubility so that residue can be cleaned from the debonded wafers using simple wet methods rather than etching or other harsh treatments.
摘要:
New compositions and methods of using those compositions as protective layers during the production of semiconductor and MEMS devices are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to form layers that protect a substrate during acid etching and other processing and handling. The protective layer can be photosensitive or non-photosensitive, and can be used with or without a primer layer beneath the protective layer. Preferred primer layers comprise a basic polymer in a solvent system.