公开(公告)号：US20160329154A1

公开(公告)日：2016-11-10

申请号：US14705950

申请日：2015-05-06

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu

IPC: H01G9/035 ,  H01G9/00 ,  H01G9/04 ,  H01G9/145

CPC classification number: H01G9/035 ,  H01G9/0029 ,  H01G9/02 ,  H01G9/04 ,  H01G9/145

Abstract: A capacitor and a manufacturing method thereof are provided. The capacitor includes a porous substrate, an electrolyte composition, and a pair of electrodes. The porous substrate has a plurality of holes. The electrolyte composition is located in the holes of the porous substrate, and the electrolyte composition includes an electrolyte solution and a nano carbon material dispersed in the electrolyte solution. The electrodes are respectively located on two opposite surfaces of the porous substrate.

Abstract translation: 提供电容器及其制造方法。 电容器包括多孔基底，电解质组合物和一对电极。 多孔基材具有多个孔。 电解质组合物位于多孔基材的孔中，电解质组合物包含分散在电解液中的电解质溶液和纳米碳材料。 电极分别位于多孔基材的两个相对的表面上。

公开(公告)号：US09377596B2

公开(公告)日：2016-06-28

申请号：US14337248

申请日：2014-07-22

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/43 ,  G02B6/42 ,  H01L31/0232

CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。

公开(公告)号：US09288917B2

公开(公告)日：2016-03-15

申请号：US14073873

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4679 ,  H05K1/0268 ,  H05K3/4652 ,  H05K2201/09063 ,  H05K2201/09918 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，提供具有彼此相对的两个表面的基板和连接在其间的通孔。 接下来，通过使用通孔作为对准对象，在每个表面上形成图案化电路层。 每个图案化电路层包括同心圆图案。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 接着，在第一层叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。

公开(公告)号：US20160025944A1

公开(公告)日：2016-01-28

申请号：US14337248

申请日：2014-07-22

Applicant: Unimicron Technology Corp.

Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

IPC: G02B6/43 ,  H01L31/0232 ,  G02B6/42

CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。

公开(公告)号：US09198303B2

公开(公告)日：2015-11-24

申请号：US14073869

申请日：2013-11-07

Applicant: Unimicron Technology Corp.

Inventor： Pei-Chang Huang ,  Cheng-Po Yu ,  Han-Pei Huang ,  Ai-Hwa Lim

IPC: B05D5/12 ,  H05K3/40 ,  H05K3/46 ,  H05K1/02 ,  B05D7/00 ,  C23C18/16 ,  H05K1/11 ,  H05K3/24 ,  H05K3/12

CPC classification number: H05K3/4038 ,  B05D5/12 ,  B05D7/50 ,  C23C18/1655 ,  H05K1/0269 ,  H05K1/0298 ,  H05K1/111 ,  H05K3/0032 ,  H05K3/0097 ,  H05K3/12 ,  H05K3/244 ,  H05K3/46 ,  H05K3/4644 ,  H05K3/4679 ,  H05K2203/107 ,  H05K2203/1536 ,  Y10T29/49165

Abstract: A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed.

Abstract translation: 多层电路板的制造方法包括以下步骤。 首先，将两个芯层压缩以形成具有彼此相对的两个表面的基板。 然后，形成连接表面的通孔。 然后通过使用通孔作为对准靶，在每个表面上形成包括同心圆图案的图案化电路层。 接下来，在每个表面上形成第一层叠层。 然后，形成第一层叠层的第一贯通孔和从同心圆图案的中心的第一同心圆正交地突出的基板。 然后在每个第一堆叠层上形成第二层叠层。 之后，形成第一，第二堆叠层和基板的第二通孔穿透区域，其中同心圆图案的中心的第二同心圆正交地突出在其上。