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39 条记录 (耗时 0.036 秒)

    LED Arrangement
    33.
    发明申请
    LED Arrangement 有权
    LED排列

    公开(公告)号：US20070166853A1

    公开(公告)日：2007-07-19

    申请号：US11686525

    申请日：2007-03-15

    申请人： Ewald Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

    发明人： Ewald Guenther ,  Gunter Waitl ,  Herbert Brunner ,  Jorg Strauss

    IPC分类号： H01L21/52

    CPC分类号： H01L33/56 ,  H01L25/0753 ,  H01L33/505 ,  H01L33/54 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is decoupled. Arranged on the radiation decoupling surface is at least one phosphor layer for converting the electromagnetic radiation generated in the LED chip. A housing envelops portions of the LED chip and the phosphor layer.

    摘要翻译： 本发明涉及一种具有至少一个LED芯片的LED装置，其包括辐射去耦表面，通过该辐射去耦表面在LED芯片中产生的大部分电磁辐射被去耦合。 布置在辐射去耦表面上的是用于转换在LED芯片中产生的电磁辐射的至少一个磷光体层。 壳体包围LED芯片和荧光体层的部分。

    Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components
    34.
    发明授权
    Conductor frame and housing for a radiation-emitting component, radiation-emitting component and display and/or illumination system using radiation-emitting components 有权
    用于辐射发射部件的导体框架和壳体，辐射发射部件以及使用辐射发射部件的显示和/或照明系统

    公开(公告)号：US07193299B2

    公开(公告)日：2007-03-20

    申请号：US10487576

    申请日：2002-08-02

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Gunter Waitl

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Gunter Waitl

    IPC分类号： H01L23/495 ,  H01L31/0203

    CPC分类号： H01L33/62 ,  H01L33/483 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

    摘要： A leadframe for a surface-mountable radiation-emitting component, preferably a light-emitting diode component, having at least one chip connection region and at least one external connection strip. The leadframe is formed in planar fashion and a deformation element, preferably a spring element, is arranged between the chip connection region and the external connection strip. The deformation element enables an elastic or plastic deformation of the leadframe in the plane of the leadframe. A housing, a surface-mountable component and an arrangement having a plurality of such components are furthermore specified.

    摘要翻译： 用于可表面安装的辐射发射部件的引线框架，优选地是具有至少一个芯片连接区域和至少一个外部连接条的发光二极管部件。 引线框架以平面方式形成，并且在芯片连接区域和外部连接带之间布置有变形元件，优选弹簧元件。 变形元件使得引线框架在引线框平面中的弹性或塑性变形。 进一步规定了外壳，表面安装部件和具有多个这种部件的布置。

    Light-emitting component provided with a luminescence conversion element
    35.
    发明申请
    Light-emitting component provided with a luminescence conversion element 审中-公开
    配有发光转换元件的发光元件

    公开(公告)号：US20070018102A1

    公开(公告)日：2007-01-25

    申请号：US10564071

    申请日：2004-07-07

    申请人： Bert Braune ,  Gunter Waitl

    发明人： Bert Braune ,  Gunter Waitl

    IPC分类号： G01T1/00

    CPC分类号： H01L33/44 ,  H01L33/50 ,  H01L33/507 ,  H01L2224/48091 ,  H01L2924/00014

    摘要： The invention encompasses a light-emitting component having at least one primary radiation source that in operation emits an electromagnetic primary radiation, and at least one luminescence conversion element by means of which at least a portion of the primary radiation is converted into a radiation of altered wavelength. Disposed after the luminescence conversion element in a radiation direction of the component is a filter element comprising a plurality of nanoparticles, said nanoparticles comprising a filter substance which by absorption selectively reduces the radiation intensity of at least one spectral subregion of an unwanted radiation.

    摘要翻译： 本发明包括具有至少一个主要辐射源的发光组件，其在操作中发射电磁初级辐射，以及至少一个发光转换元件，通过该发光转换元件将至少一部分主辐射转换成改变的辐射 波长。 在组件的辐射方向上的发光转换元件之后设置的是包括多个纳米颗粒的滤光元件，所述纳米颗粒包含过滤物质，其通过吸收选择性地降低不想要的辐射的至少一个光谱子区域的辐射强度。

    Optoelectronic component
    36.
    发明申请
    Optoelectronic component 有权
    光电元件

    公开(公告)号：US20060049477A1

    公开(公告)日：2006-03-09

    申请号：US10535794

    申请日：2003-11-27

    申请人： Karlheinz Arndt ,  Georg Bogner ,  Gunter Waitl ,  Matthias Winter

    发明人： Karlheinz Arndt ,  Georg Bogner ,  Gunter Waitl ,  Matthias Winter

    IPC分类号： H01L31/0203

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00

    摘要： The invention relates to an optoelectronic component containing an optoelectronic chip (1) and containing a chip carrier (2) that has a central region (3) on which the chip is fixed and that comprises terminals (41, 42, 43, 44) extending outwardly from the central region of the chip carrier (2) to the outside, wherein the chip and portions of the chip carrier are enveloped by a body (5) and wherein the projection of the body and that of each of the longitudinal axes of the terminals onto the contact plane between the chip and the chip carrier are substantially point-symmetrical with respect to the central point of the chip. The invention further relates to an arrangement comprising said component. The advantage of the symmetrical configuration of the component is that the risk of thermomechanically induced failures of the component is reduced.

    摘要翻译： 本发明涉及一种含有光电子芯片（1）并包含芯片载体（2）的光电子部件，芯片载体（2）具有芯片固定在其上的中心区域（3），并且包括端子（41,42,43,44） 向外从芯片载体（2）的中心区域延伸至外部，其中芯片和芯片载体的部分被主体（5）包围，并且其中主体的突起和纵向轴线的突出部分 在芯片和芯片载体之间的接触平面上的端子相对于芯片的中心点基本上是点对称的。 本发明还涉及包括所述部件的装置。 组件的对称构型的优点在于降低了组织的热力学诱导故障的风险。

    Method for producing an optoelectronic semiconductor component
    39.
    发明授权
    Method for producing an optoelectronic semiconductor component 失效

    公开(公告)号：US5985696A

    公开(公告)日：1999-11-16

    申请号：US48561

    申请日：1998-03-26

    申请人： Herbert Brunner ,  Heinz Haas ,  Gunter Waitl

    发明人： Herbert Brunner ,  Heinz Haas ,  Gunter Waitl

    IPC分类号： H01L31/0203 ,  H01L33/48 ,  H01L33/58 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L27/15

    CPC分类号： H01L33/483 ,  H01L31/0203 ,  H01L33/58 ,  H01L2224/48247

    摘要： The optoelectronic semiconductor component has an optoelectronic semiconductor chip disposed on a chip carrier with an approximately planar chip carrier surface. The semiconductor chip is fastened with predetermined alignment of its optical axis. A plastic base part supports the chip carrier. The semiconductor chip is electrically conductively connected to at least two electrode terminals routed through the base part, and a lens is disposed above the semiconductor chip on top of the base part. The lens is formed with an independently configured cap produced from plastic material. The cap is mechanically form-locked to a support of the base part. When the cap is placed onto the base part, a holder of the cap and the support engage with one another. The holder and the support are configured such that when the cap is placed onto the base part, the two parts are automatically positioned with respect to one another in such a way that the optical axes of the lens and of the semiconductor chip coincide.