On-chip electrically alterable resistor
    32.
    发明授权
    On-chip electrically alterable resistor 有权
    片上电可变电阻

    公开(公告)号:US07378895B2

    公开(公告)日:2008-05-27

    申请号:US10996312

    申请日:2004-11-23

    IPC分类号: H03L5/00

    CPC分类号: H03H11/24

    摘要: A programmable, electrically alterable (EA) resistor, an integrated circuit (IC) chip including the EA resistor and integrated analog circuits using on-chip EA resistors. Phase change storage media form resistors (EA resistors) on an IC that may be formed in an array of parallel EA resistors to set variable circuit bias conditions for circuits on the IC and in particular, bias on-chip analog circuits. The bias resistance is changed by changing EA resistor phase. Parallel connection of the parallel EA resistors may be dynamically alterable, switching one or more parallel resistors in and out digitally.

    摘要翻译: 一个可编程的,电气可变的(EA)电阻器,集成电路(IC)芯片,其中包括EA电阻器和使用片上EA电阻器的集成模拟电路。 相变存储介质在IC上形成电阻器(EA电阻器),其可以形成在并联EA电阻器阵列中,以设置IC上的电路的可变电路偏置条件,特别是片上模拟电路偏置。 通过改变EA电阻相位来改变偏置电阻。 并联EA电阻器的并联连接可以是动态可变的,以数字方式切换一个或多个并联电阻器。

    Reprogrammable electrical fuse
    33.
    发明授权
    Reprogrammable electrical fuse 有权
    可重复编程的电保险丝

    公开(公告)号:US09058887B2

    公开(公告)日:2015-06-16

    申请号:US11928258

    申请日:2007-10-30

    摘要: The present invention provides a reprogrammable electrically blowable fuse and associated design structure. The electrically blowable fuse is programmed using an electro-migration effect and is reprogrammed using a reverse electro-migration effect. The state (i.e., “opened” or “closed”) of the electrically blowable fuse is determined by a sensing system which compares a resistance of the electrically blowable fuse to a reference resistance.

    摘要翻译: 本发明提供了一种可再编程的电可熔熔丝和相关的设计结构。 电可熔熔丝使用电迁移效应进行编程,并使用反向电迁移效应重新编程。 可电熔熔丝的状态(即“打开”或“关闭”)由将电可电熔丝的电阻与参考电阻进行比较的感测系统确定。

    Flash memory structure with enhanced capacitive coupling coefficient ratio (CCCR) and method for fabrication thereof
    34.
    发明授权
    Flash memory structure with enhanced capacitive coupling coefficient ratio (CCCR) and method for fabrication thereof 失效
    具有增强的电容耦合系数比(CCCR)的闪存结构及其制造方法

    公开(公告)号:US08759175B2

    公开(公告)日:2014-06-24

    申请号:US13429556

    申请日:2012-03-26

    IPC分类号: H01L21/00

    摘要: A flash memory structure having an enhanced capacitive coupling coefficient ratio (CCCR) may be fabricated in a self-aligned manner while using a semiconductor substrate that has an active region that is recessed within an aperture with respect to an isolation region that surrounds the active region. The flash memory structure includes a floating gate that does not rise above the isolation region, and that preferably consists of a single layer that has a U shape. The U shape facilitates the enhanced capacitive coupling coefficient ratio.

    摘要翻译: 具有增强的电容耦合系数比(CCCR)的闪速存储器结构可以以自对准方式制造,同时使用半导体衬底,该半导体衬底具有相对于围绕有源区域的隔离区域在孔内凹入的有源区域 。 闪速存储器结构包括不在隔离区上方升起的浮栅,并且优选地由具有U形的单层组成。 U形增强了电容耦合系数比。

    Dual beta ratio SRAM
    36.
    发明授权
    Dual beta ratio SRAM 有权
    双倍比率SRAM

    公开(公告)号:US08339893B2

    公开(公告)日:2012-12-25

    申请号:US12566862

    申请日:2009-09-25

    IPC分类号: G11C8/00

    CPC分类号: G11C8/16 G11C11/412

    摘要: A static random access memory (SRAM) cell includes a first read port, the first read port having a first beta ratio; and a write port, the write port having a second beta ratio that is substantially lower than the first beta ratio. A static random access memory (SRAM) array includes a plurality of SRAM cells, an SRAM cell including a first read port, the first read port having a first beta ratio; and a write port, the write port having a second beta ratio that is substantially lower than the first beta ratio.

    摘要翻译: 静态随机存取存储器(SRAM)单元包括第一读取端口,第一读取端口具有第一β比率; 和写入端口,所述写入端口具有基本上低于所述第一β比率的第二β比率。 静态随机存取存储器(SRAM)阵列包括多个SRAM单元,包括第一读取端口的SRAM单元,第一读取端口具有第一β比率; 和写入端口,所述写入端口具有基本上低于所述第一β比率的第二β比率。

    FLASH MEMORY STRUCTURE WITH ENHANCED CAPACITIVE COUPLING COEFFICIENT RATIO (CCCR) AND METHOD FOR FABRICATION THEREOF
    38.
    发明申请
    FLASH MEMORY STRUCTURE WITH ENHANCED CAPACITIVE COUPLING COEFFICIENT RATIO (CCCR) AND METHOD FOR FABRICATION THEREOF 失效
    具有增强电容耦合系数(CCCR)的闪存存储器结构及其制造方法

    公开(公告)号:US20120184076A1

    公开(公告)日:2012-07-19

    申请号:US13429556

    申请日:2012-03-26

    IPC分类号: H01L21/336

    摘要: A flash memory structure having an enhanced capacitive coupling coefficient ratio (CCCR) may be fabricated in a self-aligned manner while using a semiconductor substrate that has an active region that is recessed within an aperture with respect to an isolation region that surrounds the active region. The flash memory structure includes a floating gate that does not rise above the isolation region, and that preferably consists of a single layer that has a U shape. The U shape facilitates the enhanced capacitive coupling coefficient ratio.

    摘要翻译: 具有增强的电容耦合系数比(CCCR)的闪速存储器结构可以以自对准方式制造,同时使用半导体衬底,该半导体衬底具有相对于围绕有源区域的隔离区域在孔内凹入的有源区域 。 闪速存储器结构包括不在隔离区上方升起的浮栅,并且优选地由具有U形的单层组成。 U形有助于增强电容耦合系数比。

    Laser annealing for 3-D chip integration
    39.
    发明授权
    Laser annealing for 3-D chip integration 有权
    激光退火3-D芯片集成

    公开(公告)号:US08138085B2

    公开(公告)日:2012-03-20

    申请号:US13093798

    申请日:2011-04-25

    IPC分类号: H01L21/44

    摘要: A laser annealing method for annealing a stacked semiconductor structure having at least two stacked layers is disclosed. A laser beam is focused on a lower layer of the stacked layers. The laser beam is then scanned to anneal features in the lower layer. The laser beam is then focused on an upper layer of the stacked layers, and the laser beam is scanned to anneal features in the upper layer. The laser has a wavelength of less than one micrometer. The beam size, depth of focus, energy dosage, and scan speed of the laser beam are programmable. Features in the lower layer are offset from features in the upper layer such that these features do not overlap along a plane parallel to a path of the laser beam. Each of the stacked layers includes active devices, such as transistors. Also, the first and second layers may be annealed simultaneously.

    摘要翻译: 公开了一种用于退火具有至少两个堆叠层的层叠半导体结构的激光退火方法。 激光束聚焦在堆叠层的下层。 然后扫描激光束以退火下层中的特征。 然后将激光束聚焦在堆叠层的上层上,并且激光束被扫描以退火上层中的特征。 激光器的波长小于1微米。 激光束的光束尺寸,焦深,能量投射和扫描速度是可编程的。 较低层中的特征偏离上层中的特征,使得这些特征不沿着与激光束的路径平行的平面重叠。 堆叠层中的每一个包括诸如晶体管的有源器件。 此外,第一层和第二层可以同时退火。