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    BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION
    33.
    发明申请
    BALL CONTACT COVER FOR COPPER LOSS REDUCTION AND SPIKE REDUCTION 审中-公开
    用于铜减少和减少焦距的球接触罩

    公开(公告)号：US20070096315A1

    公开(公告)日：2007-05-03

    申请号：US11555588

    申请日：2006-11-01

    申请人： Antoine Manens ,  Alain Duboust ,  Donald Olgado ,  Yan Wang ,  Jose Salas-Vernis ,  Shou-Sung Chang

    发明人： Antoine Manens ,  Alain Duboust ,  Donald Olgado ,  Yan Wang ,  Jose Salas-Vernis ,  Shou-Sung Chang

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

    CPC分类号： B24B37/16 ,  B23H5/08 ,  H01L21/32125

    摘要： Embodiments of the invention generally provide a method and apparatus for processing a substrate in an electrochemical mechanical planarizing system. In one embodiment, a contact assembly for electrochemically processing a substrate includes a housing having a ball disposed in a passage formed through the housing. The ball is adapted to extend partially from the housing to contact the substrate during processing. The housing comprises a conductive material. In another embodiment, the housing comprises a lower housing and a contact cover wherein the contact cover comprises a conductive material.

    摘要翻译： 本发明的实施方案通常提供用于在电化学机械平面化系统中处理基底的方法和装置。 在一个实施例中，用于电化学处理衬底的接触组件包括具有设置在通过壳体形成的通道中的球的壳体。 该球适于在加工过程中从壳体部分延伸以接触基底。 壳体包括导电材料。 在另一个实施例中，壳体包括下壳体和接触盖，其中接触盖包括导电材料。

    SYSTEM AND METHOD FOR IN-SITU HEAD RINSE
    36.
    发明申请
    SYSTEM AND METHOD FOR IN-SITU HEAD RINSE 审中-公开
    用于现场头部冲洗的系统和方法

    公开(公告)号：US20080003931A1

    公开(公告)日：2008-01-03

    申请号：US11562811

    申请日：2006-11-22

    申请人： Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Yan Wang ,  Shi-Ping Wang ,  Zhihong Wang ,  Andrew Nagengast ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    发明人： Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Yan Wang ,  Shi-Ping Wang ,  Zhihong Wang ,  Andrew Nagengast ,  Wei-Yung Hsu ,  Liang-Yuh Chen

    IPC分类号： B24B53/007

    CPC分类号： B24B37/30 ,  B24B55/00 ,  H01L21/67219

    摘要： A carrier head and a method of cleaning the carrier head are disclosed. The carrier head may have one or more openings through a sidewall that extend into a cavity within the carrier head using a fluid passage. The openings may each have a lip. The lip may have a chamfered edge. Additionally, a fluid passage may slope generally downward from the openings to the cavity. The chamfered lips and the sloped fluid passage reduce back splashing and help ensure that sufficient rinsing fluid reaches the cavity to rinse polishing fluid and particles from the carrier head. The present invention relates to carrier heads for polishing or planarizing semiconductor substrates by chemical mechanical polishing (CMP) or electrochemical mechanical polishing (ECMP). The cavities in the carrier head are cleaned by rinsing fluid (i.e., liquid or gas) from inside the cavity towards a substrate receiving side of the carrier head.

    摘要翻译： 公开了载体头和清洁载体头的方法。 载体头部可以具有穿过侧壁的一个或多个开口，该侧壁使用流体通道延伸到载体头部内的空腔中。 开口可以各自具有唇缘。 唇缘可以具有倒角边缘。 此外，流体通道可以从开口大致向下倾斜到空腔。 倒角的唇缘和倾斜的流体通道减少了飞溅，并有助于确保足够的冲洗流体到达腔体以从载体头部漂洗抛光液和颗粒。 本发明涉及用于通过化学机械抛光（CMP）或电化学机械抛光（ECMP）对半导体衬底进行抛光或平面化的载体头。 载体头部中的空腔通过从空腔内部朝向承载头的基板接收侧的冲洗流体（即，液体或气体）来清洁。

    RETAINING RING WITH CONDUCTIVE PORTION
    39.
    发明申请
    RETAINING RING WITH CONDUCTIVE PORTION 审中-公开
    带导电部件的保持环

    公开(公告)号：US20080038999A1

    公开(公告)日：2008-02-14

    申请号：US11865303

    申请日：2007-10-01

    申请人： Antoine Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

    发明人： Antoine Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

    IPC分类号： H01L21/302 ,  B24B5/00

    CPC分类号： B23H5/08 ,  B24B37/32

    摘要： A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.

    摘要翻译： 描述了一种用于电化学机械加工的保持环。 保持环具有形成有导电部分和非导电部分的大致环形体。 非导电部分在抛光期间接触基板。 导电部分在抛光期间被电偏置以减少常规电化学机械处理系统倾向于发生的边缘效应。