公开(公告)号：US20060163716A1

公开(公告)日：2006-07-27

申请号：US11388646

申请日：2006-03-24

Applicant: Yaping Zhou ,  Chu-Chung Lee

Inventor： Yaping Zhou ,  Chu-Chung Lee

IPC: H01L23/52

CPC classification number: H01L24/85 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45166 ,  H01L2224/45184 ,  H01L2224/45565 ,  H01L2224/45684 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/78 ,  H01L2924/00

Abstract: A semiconductor package uses various forms of conductive traces that connect to die bond pads via bond wires. In one form, adjacent bond wires are intentionally crossed around midpoints thereof to reduce self-inductance of the conductors and to minimize self-inductance. In another form, bond wires associated with bond pads having intervening, unrelated bond pads are crossed. Additionally, conductive traces are divided into separate sections and electrically connected by crossed jumper wires or bond wires. Any number of separate sections may be formed for each trace, but an even number is preferable. In another form, one trace is continuous and divides a second trace into two or more sections. The multiple sections are connected by an overlying bond wire. Either insulated or non-insulated bond wire may be used.

Abstract translation: 半导体封装使用各种形式的导电迹线，其通过接合线连接到管芯接合焊盘。 在一种形式中，相邻的接合线有意地绕其中点越过，以减少导体的自感并且使自感最小化。 在另一种形式中，与具有中间的，不相关的键合焊盘的接合焊盘相关联的接合线交叉。 另外，导电迹线被分成单独的部分，并通过交叉的跳线或接合线电连接。 可以为每个迹线形成任何数量的分开的部分，但是偶数是优选的。 在另一种形式中，一条迹线是连续的，并将第二条迹线划分成两个或多个部分。 多个部分通过上覆的接合线连接。 可以使用绝缘或非绝缘的接合线。

公开(公告)号：US06933599B2

公开(公告)日：2005-08-23

申请号：US10694146

申请日：2003-10-27

Applicant: Bennett A. Joiner ,  Yaping Zhou ,  Ben W. Herberg

Inventor： Bennett A. Joiner ,  Yaping Zhou ,  Ben W. Herberg

IPC: H01L20060101 ,  H01L23/48 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L23/50 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49052 ,  H01L2224/49174 ,  H01L2224/49175 ,  H01L2224/49176 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A semiconductor device has a die (10) overlying and electrically connected to a support structure (11), such as a substrate or a lead frame, via a plurality of interconnects. Aggressor interconnects (32, 38) are noise sources to victim interconnects (29, 59) carrying sensitive signals. An arrangement of shield interconnects (51-58) surround the victim interconnect (29, 59) in a cage-like structure to significantly block noise from the aggressor interconnect. In one form the shield interconnects are ground or power supply and the victim interconnect may be, for example, a clock signal or an RF signal. The number of shield interconnects and the number of protected victim interconnects varies depending upon design requirements. Either wire bonding or other interconnect technology (e.g. bump) is applicable.

Abstract translation: 半导体器件具有经由多个互连件覆盖并电连接到诸如衬底或引线框架的支撑结构（11）的管芯（10）。 侵入者互连（32,38）是携带敏感信号的受害互连（29,59）的噪声源。 屏蔽互连（51-58）的布置以笼状结构围绕受害互连（29,59），以显着地阻止来自侵扰者互连的噪声。 在一种形式中，屏蔽互连是接地或电源，并且受害互连可以是例如时钟信号或RF信号。 屏蔽互连的数量和受保护的受干扰互连的数量根据设计要求而变化。 引线接合或其他互连技术（例如凸块）都可应用。