公开(公告)号：US06283323B1

公开(公告)日：2001-09-04

申请号：US09469539

申请日：1999-12-22

申请人： Tadashi Endo ,  Takao Kashiwazaki ,  Shuichi Kubota ,  Koji Okawa ,  Masato Tanino ,  Akira Kabeshita

发明人： Tadashi Endo ,  Takao Kashiwazaki ,  Shuichi Kubota ,  Koji Okawa ,  Masato Tanino ,  Akira Kabeshita

IPC分类号： B65H528

CPC分类号： B65H75/22 ,  B65H2701/1942 ,  H05K13/0417

摘要： A receiving reel 10 comprises a receiving ratchet 11 and a detachable receiving cap 12 that is set in the receiving ratchet 11 and on which a covering tape 1c is wound, and is provided with contact members 13 and 14 that are provided on the area of engagement of the receiving cap 12 and the receiving ratchet 11. The contact members make contact in the direction of rotation and prevent the receiving cap 12 from coming loose. Mutually contacting concave and convex members 15 and 16 are provided on the contact surfaces along the direction of rotation of the contact members 13 and 14 to make it simple to detach the receiving cap 12 and to prevent it from coming loose and falling off.

摘要翻译： 接收卷轴10包括接收棘轮11和设置在接收棘轮11中并且其上缠绕有覆盖带1c的可拆卸接收帽12，并且设置有接合部件13和14，接触部件13和14设置在接合区域 接触帽12和接收棘轮11.接触构件在旋转方向上接触，并防止接收帽12松动。 沿着接触构件13和14的旋转方向在接触表面上设置相互接触的凹形和凸形构件15和16，使得容易拆卸接收盖12并防止其松动脱落。

公开(公告)号：US06206066B1

公开(公告)日：2001-03-27

申请号：US09091104

申请日：1998-06-12

申请人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

发明人： Makoto Imanishi ,  Akira Kabeshita ,  Kohei Enchi ,  Satoshi Shida

IPC分类号： B32B3500

CPC分类号： H01L24/27 ,  H01L21/563 ,  H01L24/29 ,  H01L24/743 ,  H01L2224/11005 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01082 ,  H05K13/0465 ,  H05K13/0469 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T156/17 ,  Y10T156/1798 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of and apparatus for mounting an electronic component at a specified position of an object. The method includes applying a sealant in a first application process. The sealant is quickly, sufficiently and forcibly applied in the first application process simply by avoiding electrodes at the arrangement position, and tightly contacting the arranged electronic component and the object. Then the bonding of the electrodes is performed in the usual manner. A second application process is carried out by applying a sealant to the periphery of the electronic component in the same manner as in the convention method, which is sufficient to cause the sealant to flow to the sealant previously applied under the electronic component. The second application process can be accordingly conducted speedily and sufficiently. Air bubbles will not be trapped between the electronic component and the object, with the result that mounting failures due to breakage or corrosion of the electronic component can be reduced. Only a short period of time is required to apply the sealant even though it is applied twice, so that production time is shortened and production efficiency is improved.

摘要翻译： 一种用于将电子部件安装在物体的指定位置的方法和装置。 该方法包括在第一施加过程中施加密封剂。 密封剂通过在布置位置避免电极，并且紧密接触布置的电子部件和物体，在第一施加过程中快速，充分且强制地施加。 然后以通常的方式进行电极的接合。 通过以与常规方法相同的方式将密封剂施加到电子部件的周边来进行第二施加过程，该方法足以使密封剂流动到先前施加在电子部件下方的密封剂。 可以相应地进行第二次应用程序的充分进行。 气泡不会被夹在电子部件和物体之间，结果是由于电子部件的断裂或腐蚀导致的安装故障可以减少。 即使施加两次，也只需要很短的时间来施加密封剂，从而缩短生产时间并提高生产效率。

公开(公告)号：US5012388A

公开(公告)日：1991-04-30

申请号：US425840

申请日：1989-10-20

申请人： Akira Kabeshita ,  Tokuhito Hamane ,  Yoshifumi Kitayama

发明人： Akira Kabeshita ,  Tokuhito Hamane ,  Yoshifumi Kitayama

IPC分类号： H01G4/12 ,  H01C1/012 ,  H01C7/00 ,  H01C17/00 ,  H01G2/06 ,  H01G4/252 ,  H05K1/18 ,  H05K3/34 ,  H05K3/40

CPC分类号： H01G2/065 ,  H01C17/006 ,  H05K3/3442 ,  H05K2201/09154 ,  H05K2201/10636 ,  H05K3/4092 ,  Y02P70/611 ,  Y02P70/613

摘要： A chip type electronic component includes a main body having opposite first and second end surfaces and a lower surface defining a first plane. First and second electrode portions are respectively connected to the first and second end surfaces of the main body. Each of the first and second electrode portions includes a lower surface. Each lower surface of the first and second electrode portions includes a first planar face extending adjacent the main body in a second plane which is parallel to the first plane defined by the main body, and a second planar face extending adjacent the first planar face in a third plane which extends upwardly at an angle relative the second plane away from the main body. Accordingly, upon mounting of the chip type electronic component to a planar circuit board, a space is provided between the second planar face of each of the first and second electrode portions for accommodating solder materials.

摘要翻译： 芯片型电子部件包括具有相对的第一和第二端面的主体和限定第一平面的下表面。 第一电极部分和第二电极部分分别连接到主体的第一和第二端面。 第一电极部分和第二电极部分中的每一个包括下表面。 第一电极部分和第二电极部分的每个下表面包括在平行于由主体限定的第一平面的第二平面中相对于主体延伸的第一平面和与第一平面相邻延伸的第二平面， 第三平面，其以相对于第二平面离开主体的一角度向上延伸。 因此，在芯片型电子部件安装在平面电路基板上时，在第一和第二电极部分的第二平面之间设置有容纳焊料的空间。

公开(公告)号：US4720914A

公开(公告)日：1988-01-26

申请号：US841865

申请日：1986-03-10

申请人： Yukio Maeda ,  Shinichi Kudou ,  Akira Kabeshita

发明人： Yukio Maeda ,  Shinichi Kudou ,  Akira Kabeshita

IPC分类号： H05K3/12 ,  H05K3/20

CPC分类号： H05K3/1241 ,  H05K2203/0126 ,  Y10T29/49155

摘要： The present invention relates to method and apparatus for forming a thick film circuit by discharging a thick film paste from a paste discharging hole of a drawing nozzle and drawing a desired pattern on a substrate. The paste discharging hole has a substantially wide configuration and the drawing nozzle is rotated about its axis of rotation so that the longitudinal direction of the elongated cross-section of the paste discharging hole is substantially normal to the direction in which the drawing nozzle is moved with respect to the substrate.

摘要翻译： PCT No.PCT / JP84 / 00380 Sec。 371日期：1986年3月10日 102（e）1986年3月10日PCT PCT。1984年7月26日PCT公布。 出版物WO86 / 日本特愿1986年2月13日。本发明涉及通过从拉丝喷嘴的浆料排出孔排出厚膜浆料并在基材上拉伸所需图案来形成厚膜回路的方法和装置。 糊剂排出孔具有基本上宽的构造，并且拉伸喷嘴绕其旋转轴线旋转，使得糊料排出孔的细长横截面的纵向方向基本上垂直于拉伸喷嘴移动的方向 相对于底物。

公开(公告)号：US08528196B2

公开(公告)日：2013-09-10

申请号：US13143587

申请日：2010-01-08

申请人： Kazuaki Kosaka ,  Akira Kabeshita ,  Nobuhiko Muraoka ,  Syozo Kadota

发明人： Kazuaki Kosaka ,  Akira Kabeshita ,  Nobuhiko Muraoka ,  Syozo Kadota

IPC分类号： H05K3/30 ,  B23P19/00

CPC分类号： H05K13/0452

摘要： A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

摘要翻译： 一种用于将元件安装在沿着基板边缘部分的方向的第一方向上放置在基板的边缘部分上的多个安装区域上的部件安装装置，包括用于保持放置在部件传送位置的部件的部件放置单元， 在与第一方向正交的第二方向上与基板的边缘部分间隔开，沿着第二方向移动被保持的部件，并将部件放置在安装区域上，用于将部件顺序地供给到间隔开的部件供给位置的部件供给单元 以及用于保持馈送到部件供给位置的部件的元件传送单元，移动保持的部件，以及将部件放置在部件传送位置。 因此，能够以良好的工作效率将部件均匀地配置在大的基板上。

公开(公告)号：US20110289772A1

公开(公告)日：2011-12-01

申请号：US13143587

申请日：2010-01-08

申请人： Kazuaki Kosaka ,  Akira Kabeshita ,  Nobuhiko Muraoka ,  Syozo Kadota

发明人： Kazuaki Kosaka ,  Akira Kabeshita ,  Nobuhiko Muraoka ,  Syozo Kadota

IPC分类号： H05K13/04

CPC分类号： H05K13/0452

摘要： A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

摘要翻译： 一种用于将元件安装在沿着基板边缘部分的方向的第一方向上放置在基板的边缘部分上的多个安装区域上的部件安装装置，包括用于保持放置在部件传送位置的部件的部件放置单元， 在与第一方向正交的第二方向上与基板的边缘部分间隔开，沿着第二方向移动被保持的部件，并将部件放置在安装区域上，用于将部件顺序地供给到间隔开的部件供给位置的部件供给单元 以及用于保持馈送到部件供给位置的部件的元件传送单元，移动保持的部件，以及将部件放置在部件传送位置。 因此，能够以良好的工作效率将部件均匀地配置在大的基板上。

公开(公告)号：US07231709B2

公开(公告)日：2007-06-19

申请号：US11431751

申请日：2006-05-11

申请人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

发明人： Noriaki Yoshida ,  Takeshi Takeda ,  Akira Kabeshita

IPC分类号： B23P19/00

CPC分类号： H05K13/0413 ,  H05K13/0815 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/53052 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： In accordance with a component mounting apparatus, a component stored in a component feeder is held by a component holding member and is then mounted in a mounting position on an object. The apparatus functions to, when a mounting posture of the component in which the component is mounted onto the object is inclined with respect to a basic posture of the component by a mounting angle, hold the component from the component feeder by the component holding member that has preliminarily been rotated to the mounting angle in such a direction as to depart from a reference posture of the component holding member prior to the mounting of the component on the object. And afterwards, the component holding member is rotated in a specified direction to finally return the component holding member to the reference posture, and then the component is mounted on the object.

摘要翻译： 根据部件安装装置，存储在部件供给器中的部件由部件保持部件保持，然后安装在物体上的安装位置。 该装置用于当将部件安装到物体上的部件的安装姿势相对于部件的基本姿势倾斜安装角度时，通过部件保持部件将部件从部件供给器保持， 在将部件安装在物体上之前，已经预先沿着防止部件保持部件的基准姿势的方向旋转到安装角度。 然后，使部件保持部件沿指定方向旋转，最终将部件保持部件返回到基准姿势，然后将部件安装在被检体上。

公开(公告)号：US07219787B2

公开(公告)日：2007-05-22

申请号：US11035952

申请日：2005-01-18

申请人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

发明人： Akira Kabeshita ,  Osamu Okuda ,  Naoto Mimura

IPC分类号： B65G43/08

CPC分类号： H05K13/0069 ,  H05K13/0061 ,  H05K13/0452 ,  Y10T29/49124

摘要： In a component mounting work area, two electronic circuit boards are placed in a zigzag manner and components are mounted independently on each board. Two sets of working drive units, board conveying/holding devices, recognition cameras and so forth are also arranged in the work area. The board conveying/holding devices for holding boards are moved to positions close to component feed units, and components are mounted in respective mounting areas.

摘要翻译： 在组件安装工作区域中，两个电子电路板以锯齿形的方式放置，并且组件独立地安装在每个板上。 工作区域还设有两套工作驱动单元，板式输送/保持装置，识别照相机等。 用于保持板的板传送/保持装置移动到靠近分量供给单元的位置，并且部件安装在相应的安装区域中。

公开(公告)号：US20070101572A1

公开(公告)日：2007-05-10

申请号：US10564275

申请日：2004-08-25

申请人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

发明人： Akira Kabeshita ,  Kurayasu Hamasaki ,  Noriyuki Tani ,  Shozo Minamitani ,  Yoichi Makino

IPC分类号： H05K3/30 ,  B23P19/00

CPC分类号： H01L21/67144 ,  H01L21/67132 ,  H01L2221/68322 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191

摘要： A component mounting apparatus is provided with a board holding device for holding a board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.

摘要翻译： 元件安装装置具有用于将板保持在板保持位置的板保持装置，用于保持和取出从第一部件供给位置馈送的部件的第一安装头，并将部件安装在保持在板上的板上 保持位置的第二安装头，用于保持和取出从第二部件供给位置供给的部件并将部件安装在保持板上的第二安装头，以及具有用于保持各个部件的晶片的晶片保持台的部件供给装置 进给，使得晶片保持台可以在第一部件供给位置和第二部件供给位置之间往复运动。

公开(公告)号：US20060016067A1

公开(公告)日：2006-01-26

申请号：US11232993

申请日：2005-09-23

申请人： Noriaki Yoshida ,  Osamu Okuda ,  Akira Kabeshita ,  Takeyuki Kawase

发明人： Noriaki Yoshida ,  Osamu Okuda ,  Akira Kabeshita ,  Takeyuki Kawase

IPC分类号： B23P19/00

CPC分类号： H05K13/0452 ,  H05K13/0404 ,  H05K13/041 ,  H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49137 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53196

摘要： When two mounting units for performing a series of component mounting operations constituted of component holding, component recognition, and component placing are arranged, operational control is executed so that, while a component recognition or board recognition operation is performed in either one of the two mounting units, the component placing or component holding operation is not performed in the other of the mounting units.

摘要翻译： 当安装两个用于执行由部件保持，部件识别和部件放置构成的一系列部件安装操作的安装单元时，执行操作控制，使得在两个安装中的任一个中执行部件识别或板识别操作 在另一个安装单元中不执行部件放置或部件保持操作。