Abstract:
A plasma treatment method comprising exhausting a process chamber so as to decompress the process chamber, mounting a wafer on a suscepter, supplying a process gas to the wafer through a shower electrode, applying high frequency power, which has a first frequency f.sub.1 lower than an inherent lower ion transit frequencies of the process gas, to the suscepter, and applying high frequency power, which has a second frequency f.sub.2 higher than an inherent upper ion transit frequencies of the process gas, whereby a plasma is generated in the process chamber and activated species influence the wafer.
Abstract:
A molding method and apparatus capable of reliably removing a molded product without deformation even if the product has a shape difficult to be removed, such as a shape having a plurality of vertical portions. The method of molding a product by using a film sheet, includes the steps of: adapting to operate a pair of film pushing rings disposed facing upper and lower metal molds of a molding apparatus for thermally molding a product by using a film sheet, independently from the upper and lower metal molds; attracting and attaching a molded product to one of the upper and lower metal molds; fixing the ring on the side of the one metal mold; attracting and attaching a pickup jig to the molded product in tight contact therewith, the pickup jig having a surface shape matching the surface shape of the molded product; releasing the attraction and attachment by the one metal mold and moving the pickup jig to displace the molded product from the one metal mold; and moving the fixed ring to an original position.
Abstract:
A volume ratio of conductive material to a voice coil is improved by using a tape coil wire, and a magnetic efficiency of the voice coil is improved by attaching magnetic material to conductive material of the coil wire. A tape coil wire having a predetermined width is wound about a voice coil bobbin to form a voice coil. The winding start portion of the voice coil is soldered to the exposed area of the voice coil bobbin. A projection of the voice coil bobbin forms the winding start terminal. A folded portion of the winding end portion of the voice coil forms the winding end terminal. Input signal lead wires on the damper are electrically connected to the winding start and end terminals to drive the cone paper by the voice coil.
Abstract:
A repulsion magnetic circuit type loudspeaker which is compact and easy to assemble, and a method of easily manufacturing such a repulsion magnetic circuit type loudspeaker by using conventional loudspeaker manufacturing lines. The repulsion magnetic circuit has two magnets magnetized in the thickness direction and disposed with the same polarity being faced each other, and a center plate being squeezed between the two magnets. A magnetic field is generated by repulsive fluxes at the outer peripheral area of the center plate. A voice coil is disposed in the magnetic field. In the manufacturing method, a coupling member of either a concave or a convex is formed at each of the contact planes of the magnets and center plate. The coupling members are engaged with each other to assemble the repulsion magnetic circuit. The repulsion magnetic circuit is mounted on a speaker frame with position alignment therebetween, by forming a convex or concave at the speaker frame, the convex or concave matching a concave or convex formed at the lower magnet.
Abstract:
A loudspeaker having a repulsion magnetic circuit capable of suppressing negative magnetic fluxes. The loudspeaker has magnets with the same poles being faced each other and an outer magnet magnetized in a direction different from the counter magnets is disposed outside of the counter magnets. A voice coil containing magnetic material is disposed outside of a magnet magnetized in a radial direction from the inner wall to the outer wall of the magnet, or outside of a magnet assembled by magnet pieces magnetized in a predetermined direction and arranged to take the same magnetization direction.
Abstract:
A film molding apparatus wherein a film is immersed in a vessel of a film supply unit, the film containing at least 50 weight % swelling agent relative to a polymer constituting the film, and the vessel being filled with soaking liquid which acts so as not to destroy a swelling condition of the film, and a film piece corresponding to one molded product is supplied from the film supply unit to a mold press.
Abstract:
A wiring structure of a loudspeaker includes first two conductive areas formed on a damper; second two conductive areas formed on the outer peripheral surface of a voice coil bobbin, the first and second two conductive areas serving as the conductor for supplying an audio signal to a voice coil; wherein the leads of the voice coil are electrically connected to the first two conductive areas, and the second two conductive areas are electrically connected to the first two conductive areas.
Abstract:
There is provided a method of manufacturing a loudspeaker damper having the steps of attaching a conductive material to a damper raw material at the top or bottom surface thereof, the damper raw material being made of a woven or unwoven cloth impregnated with thermosetting resin such as phenol resin and being made in a semi-dry state, and thermally molding the damper raw material with the conductive material to form concentric corrugation along which conductive material used as a conductive wire for a voice signal is formed, wherein the method further including the steps of: after attaching the conductive material to the damper raw material, coating creamy solder to the conductive material at a predetermined area, melting the creamy solder by the heat at the thermal molding step, detaching the damper raw material from a metal mold to cool and harden the creamy sodler, and forming preparatory solder at the end portion of the conductive material.
Abstract:
In a semiconductor differential amplifier comprising a differential pair of npn transistors having the emitters connected to the emitter of lateral transistors, the bases supplied with an input signal, and the collectors connected in common to one terminal of the voltage source so as to derive the output signal from the collector of the lateral transistor, the emitter voltage of each of the differential pair transistors is applied to the common base of the pnp lateral transistors through a constant voltage element consisting of a transistor or a diode. Therefore, the voltage applied between the base and the substrate of the lateral transistor is reduced and hence the tolerance to the reverse breakdown voltage is increased and simplification of the circuit structure becomes possible. Further, a sink current path is provided between the base of the pnp lateral transistor and the other terminal of the voltage source to allow a stabilized bias current to flow through the differential amplifier.
Abstract:
A diaphragm (1) of a light sound converter which has a high performance, is suitable for mass-production and has a slit (1s) formed therein. A light emitting element and a light receiving element are disposed at positions opposed to a reflective part (1a) of the diaphragm (1) having a pressure receiving surface part (1d) and the reflective part (1a), and light is radiated from the light emitting element to the reflective part (1a) of the diaphragm (1) and the reflected light from the reflective part (1a) is received by the light receiving element, whereby the position of the diaphragm (1) can be detected.