METHOD OF MEASURING BY ELECTRICAL IMPEDANCE TOMOGRAPHY

    公开(公告)号:US20240184010A1

    公开(公告)日:2024-06-06

    申请号:US18551338

    申请日:2022-03-25

    IPC分类号: G01V3/06

    CPC分类号: G01V3/06

    摘要: An electrical impedance tomography method for the measurement of a body comprising a cylindrical part containing a fluid, the method comprising arranging a number of electrodes around a periphery of the cylindrical part of the body, simultaneously exciting each of the electrodes, each electrode being excited by a potential of a selected form, measuring the electrical properties of the body using electrodes, and processing the data from measuring step so as to obtain a signed data matrix representative of an image.

    Electromechanical microsystem
    33.
    发明授权

    公开(公告)号:US11999613B2

    公开(公告)日:2024-06-04

    申请号:US17828091

    申请日:2022-05-31

    IPC分类号: B81B3/00 B81C1/00

    摘要: An electromechanical microsystem including an electromechanical transducer, a deformable diaphragm and a cavity hermetically containing a deformable medium keeping a constant volume under the action of an external pressure change. The deformable diaphragm forms a wall of the cavity and has at least one free area so as to be elastically deformed. The electromechanical transducer is configured so that its movement depends on the change in the external pressure, and vice versa. The free area cooperates with an external member so that its deformation induces, or is induced by, a movement of the external member. Thus, the electromechanical microsystem is adapted to displace the external member or to detect a movement of this member, the electromechanical microsystem includes at least one pin, configured to bear on a peripheral portion of the free area so that a deformation of the free rea causes an inclination of the pin.

    Method for coating chips
    40.
    发明授权

    公开(公告)号:US11955585B2

    公开(公告)日:2024-04-09

    申请号:US17435102

    申请日:2020-03-02

    IPC分类号: H01L33/44 G03F7/11 G03F7/16

    CPC分类号: H01L33/44 G03F7/11 G03F7/162

    摘要: A method for coating chips resting, by a rear face opposite to a front face, on a main face of a support substrate, and separated from each other by an inter-chip space, includes a step of forming a photosensitive coating film covering the front faces and the inter-chip spaces. The method further includes a first photolithographic sequence which comprises an insolation sub-step, and a dissolution sub-step. The sequence leads to a partial removal of the photosensitive coating film so as to maintain the film exclusively at the inter-chip spaces and, advantageously recessed relative to the front faces.