公开(公告)号：US06935922B2

公开(公告)日：2005-08-30

申请号：US10358106

申请日：2003-02-04

Applicant: Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

Inventor： Kurt Lehman ,  Charles Chen ,  Ronald L. Allen ,  Robert Shinagawa ,  Anantha Sethuraman ,  Christopher F. Bevis ,  Thanassis Trikas ,  Haiguang Chen ,  Ching Ling Meng

IPC: B24B37/04 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24D49/00

CPC classification number: B24B37/013 ,  B24B37/042 ,  B24B41/04 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12

Abstract: Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing are provided. One method includes scanning a specimen with a measurement device during polishing to generate output signals at measurement spots on the specimen. The method may also include determining a characteristic of polishing at the measurement spots from the output signals. In addition, the method may include determining relative or absolute locations of the measurement spots on the specimen. The method may further include generating a two-dimensional map of the characteristic at the relative or absolute locations of the measurement spots on the specimen. In some embodiments, the relative locations of the measurement spots may be determined from a representative scan path of the measurement device and an average spacing between starting points on individual scans.

Abstract translation: 提供了用于在抛光期间在样本上的测量点的相对或绝对位置处产生特征的二维图的方法和系统。 一种方法包括在抛光期间用测量装置扫描样品，以在样品上的测量点产生输出信号。 该方法还可以包括从输出信号确定测量点处的抛光特性。 此外，该方法可以包括确定样本上的测量点的相对或绝对位置。 该方法还可以包括在样本上的测量点的相对或绝对位置处生成特征的二维图。 在一些实施例中，测量点的相对位置可以从测量装置的代表性扫描路径和单个扫描上的起始点之间的平均间隔来确定。

公开(公告)号：US06917421B1

公开(公告)日：2005-07-12

申请号：US10266333

申请日：2002-10-08

Applicant: Tim Wihl ,  Stephen Hiebert ,  Richard Schmidley

Inventor： Tim Wihl ,  Stephen Hiebert ,  Richard Schmidley

IPC: G01B11/06 ,  G01N21/00 ,  G01N21/95

CPC classification number: G01N21/9501 ,  G01B11/0608

Abstract: Systems and methods for assessing a dimension of a feature on a specimen are provided. A system may include an illumination system configured to scan the specimen with light at multiple focal planes substantially simultaneously. The system may also include a collection system that may include multiple collectors. Approximately all light returned from one of the multiple focal planes may be collected by one of the multiple collectors. In addition, the system may include a processor configured to determine a relative intensity of the collected light. The processor may also be configured to assess a dimension of the feature on the specimen in a direction substantially perpendicular to an upper surface of the specimen using the relative intensity.

Abstract translation: 提供了用于评估试样上特征尺寸的系统和方法。 系统可以包括被配置为基本上同时在多个焦平面上用光扫描样本的照明系统。 系统还可以包括可以包括多个收集器的收集系统。 从多个焦平面中的一个返回的大致的所有光可以由多个收集器之一收集。 另外，该系统可以包括被配置为确定所收集的光的相对强度的处理器。 处理器还可以被配置为使用相对强度来评估样本上的特征在基本上垂直于样品的上表面的方向上的尺寸。

公开(公告)号：US09068917B1

公开(公告)日：2015-06-30

申请号：US11374711

申请日：2006-03-14

Applicant: Mehdi Vaez-Iravani ,  Eliezer Rosengaus

Inventor： Mehdi Vaez-Iravani ,  Eliezer Rosengaus

IPC: G01N21/00 ,  G01N21/88

CPC classification number: G01N21/00 ,  G01N21/88 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/8825

Abstract: Systems and methods for inspection of a specimen are provided. One system includes an illumination subsystem configured to illuminate the specimen by scanning a spot across the specimen. The system also includes a non-imaging detection subsystem configured to generate output signals responsive to light specularly reflected from the spot scanned across the specimen. In addition, the system includes a processor configured to generate images of the specimen using the output signals and to detect defects on the specimen using the images. In one embodiment, the non-imaging detection subsystem includes an objective and a detector. An NA of the objective does not match a pixel size of the detector. In another embodiment, the non-imaging detection subsystem includes an objective having an NA of greater than about 0.05. The system may be configured for multi-spot illumination and multi-channel detection. Alternatively, the system may be configured for single spot illumination and multi-channel detection.

Abstract translation: 提供了用于检查样本的系统和方法。 一个系统包括照明子系统，该照明子系统被配置为通过扫描样品上的斑点照射样本。 该系统还包括非成像检测子系统，其被配置为响应于从穿过样本扫描的点镜面反射的光产生输出信号。 另外，该系统包括处理器，该处理器被配置为使用输出信号产生样本的图像，并使用该图像来检测样本上的缺陷。 在一个实施例中，非成像检测子系统包括物镜和检测器。 目标的NA与检测器的像素尺寸不匹配。 在另一个实施例中，非成像检测子系统包括具有大于约0.05的NA的物镜。 该系统可以被配置用于多点照明和多通道检测。 或者，该系统可以被配置用于单点照明和多通道检测。

公开(公告)号：US08582094B1

公开(公告)日：2013-11-12

申请号：US11110383

申请日：2005-04-20

Applicant: David Shortt ,  Stephen Biellak ,  Christian Wolters

Inventor： David Shortt ,  Stephen Biellak ,  Christian Wolters

IPC: G01N21/00 ,  G01J4/00

CPC classification number: G01N21/9501

Abstract: Systems and methods for inspecting a specimen are provided. One system includes an illumination subsystem configured to direct light to the specimen at an oblique angle of incidence. The light is polarized in a plane that is substantially parallel to the plane of incidence. The system also includes a detection subsystem configured to detect light scattered from the specimen. The detected light is polarized in a plane that is substantially parallel to the plane of scattering. In addition, the system includes a processor configured to detect defects on the specimen using signals generated by the detection subsystem. In one embodiment, such a system may be configured to detect defects having a size that is less than half of a wavelength of the light directed to the specimen.

Abstract translation: 提供了检查样本的系统和方法。 一个系统包括被配置为以倾斜入射角将光引导到样本的照明子系统。 光在基本上平行于入射平面的平面中极化。 该系统还包括检测子系统，其被配置为检测从样本散射的光。 检测到的光在基本上平行于散射平面的平面中极化。 另外，该系统包括配置成使用由检测子系统产生的信号来检测样本上的缺陷的处理器。 在一个实施例中，这样的系统可以被配置为检测具有小于指向样本的光的波长的一半的尺寸的缺陷。

公开(公告)号：US08502979B2

公开(公告)日：2013-08-06

申请号：US13467042

申请日：2012-05-09

Applicant: Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

Inventor： Ady Levy ,  Kyle A. Brown ,  Rodney Smedt ,  Gary Bultman ,  Mehrdad Nikoonahad ,  Dan Wack ,  John Fielden ,  Ibrahim Abdul-Halim

IPC: G01B11/00 ,  G01B11/30 ,  G01B11/14 ,  G01B11/28

CPC classification number: G01N21/27 ,  G01N21/211 ,  G01N21/47 ,  G01N21/636 ,  G01N21/64 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/646 ,  G01N2021/8825 ,  G03F7/70616 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/7065 ,  G03F7/70658 ,  G03F7/707 ,  G03F7/70708 ,  H01J2237/31701 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Methods and systems for monitoring semiconductor fabrication processes are provided. A system may include a stage configured to support a specimen and coupled to a measurement device. The measurement device may include an illumination system and a detection system. The illumination system and the detection system may be configured such that the system may be configured to determine multiple properties of the specimen. For example, the system may be configured to determine multiple properties of a specimen including: but not limited to, critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device may perform multiple optical and/or non-optical metrology and/or inspection techniques.

Abstract translation: 提供了用于监测半导体制造工艺的方法和系统。 系统可以包括被配置为支撑样本并耦合到测量装置的台。 测量装置可以包括照明系统和检测系统。 照明系统和检测系统可以被配置为使得系统可以被配置为确定样本的多个属性。 例如，系统可以被配置为确定样本的多个属性，包括但不限于临界尺寸和重叠错位; 缺陷和薄膜特性; 临界尺寸和缺陷; 临界尺寸和薄膜特性; 临界尺寸，薄膜特性和缺陷; 宏观缺陷和微缺陷; 平整度，薄膜特性和缺陷; 重叠错位和平整度; 植入物特征和缺陷; 附着力和厚度。 以这种方式，测量装置可以执行多个光学和/或非光学测量和/或检查技术。

公开(公告)号：US08384887B2

公开(公告)日：2013-02-26

申请号：US12796047

申请日：2010-06-08

Applicant: Steve R. Lange ,  Paul Frank Marella ,  Nat Ceglio ,  Shiow-Hwei Hwang ,  Tao-Yi Fu

Inventor： Steve R. Lange ,  Paul Frank Marella ,  Nat Ceglio ,  Shiow-Hwei Hwang ,  Tao-Yi Fu

IPC: G01N21/00

CPC classification number: G01N21/9501 ,  G01N21/8806

Abstract: Methods and systems for inspection of a specimen using different parameters are provided. One computer-implemented method includes determining optimal parameters for inspection based on selected defects. This method also includes setting parameters of an inspection system at the optimal parameters prior to inspection. Another method for inspecting a specimen includes illuminating the specimen with light having a wavelength below about 350 nm and with light having a wavelength above about 350 nm. The method also includes processing signals representative of light collected from the specimen to detect defects or process variations on the specimen. One system configured to inspect a specimen includes a first optical subsystem coupled to a broadband light source and a second optical subsystem coupled to a laser. The system also includes a third optical subsystem configured to couple light from the first and second optical subsystems to an objective, which focuses the light onto the specimen.

Abstract translation: 提供了使用不同参数检查试样的方法和系统。 一种计算机实现的方法包括基于所选择的缺陷来确定用于检查的最佳参数。 该方法还包括在检查之前将检查系统的参数设置为最佳参数。 用于检查样品的另一种方法包括用波长低于约350nm的光和波长高于约350nm的光照射样品。 该方法还包括处理代表从样品收集的光的信号，以检测样品上的缺陷或过程变化。 配置成检查样本的一个系统包括耦合到宽带光源的第一光学子系统和耦合到激光器的第二光学子系统。 该系统还包括配置成将来自第一和第二光学子系统的光耦合到物镜的第三光学子系统，其将光聚焦到样本上。

公开(公告)号：US08135204B1

公开(公告)日：2012-03-13

申请号：US11859342

申请日：2007-09-21

Applicant: Chien-Huei (Adam) Chen ,  Barry Becker ,  Hong Chen ,  Michael Van Riet ,  Chris Maher ,  Stephanie Chen ,  Suryanarayana Tummala ,  Yong Zhang

Inventor： Chien-Huei (Adam) Chen ,  Barry Becker ,  Hong Chen ,  Michael Van Riet ,  Chris Maher ,  Stephanie Chen ,  Suryanarayana Tummala ,  Yong Zhang

IPC: G06K9/00

CPC classification number: G01N21/9501 ,  G01N21/956 ,  G01N2021/95676

Abstract: Computer-implemented methods, carrier media, and systems for creating a defect sample for use in selecting one or more parameters of an inspection recipe are provided. One method includes separating defects into bins based on regions in which the defects are located, defect types, and values of the defects for parameter(s) of a detection algorithm. The method also includes determining a number of the defects to be selected from each bin by distributing a user-specified target number of defects across the bins. In addition, the method includes selecting defects from the bins based on the determined numbers thereby creating a defect sample for use in selecting values of parameter(s) of the detection algorithm for use in the inspection recipe.

Abstract translation: 提供了计算机实现的方法，载体介质和用于创建用于选择检查配方的一个或多个参数的缺陷样本的系统。 一种方法包括基于缺陷所在的区域，缺陷类型和检测算法的参数缺陷值将缺陷分离成箱体。 该方法还包括通过在用户区间分配用户指定的目标数量的缺陷来确定要从每个仓库中选择的缺陷的数量。 此外，该方法包括基于确定的数量从箱中选择缺陷，从而创建用于选择用于检查配方的检测算法的参数的值的缺陷样本。

公开(公告)号：US08111900B2

公开(公告)日：2012-02-07

申请号：US12780864

申请日：2010-05-15

Applicant: Kenong Wu ,  David Randall ,  Kourosh Nafisi ,  Ramon Ynzunza ,  Ingrid B. Peterson ,  Ariel Tribble ,  Michal Kowalski ,  Lisheng Gao ,  Ashok Kulkarni

Inventor： Kenong Wu ,  David Randall ,  Kourosh Nafisi ,  Ramon Ynzunza ,  Ingrid B. Peterson ,  Ariel Tribble ,  Michal Kowalski ,  Lisheng Gao ,  Ashok Kulkarni

IPC: G06K9/00 ,  G01R31/26 ,  G21K5/00 ,  G06F17/50

CPC classification number: G03F1/84 ,  G01N21/95607 ,  G01N2021/95676 ,  G03F7/7065 ,  G03F7/70666

Abstract: Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority information associated with individual defects in combination with one or more characteristics of a region proximate the individual defects. The priority information corresponds to modulation levels associated with the individual defects. The inspection data is generated by comparing images of the reticle generated for different values of a lithographic variable. The images include at least one reference image and at least one modulated image. A composite reference image can be generated from two or more reference images. The method also includes assigning one or more identifiers to the defects of interest. The identifier(s) may include, for example, a defect classification and/or an indicator identifying if the defects of interest are to be used for further processing.

Abstract translation: 提供了各种计算机实现的方法。 用于对掩模版的设计图案中的缺陷进行排序的一种方法包括使用与各个缺陷相关联的优先级信息，结合邻近各个缺陷的区域的一个或多个特征来搜索检查数据中的缺陷。 优先级信息对应于与各个缺陷相关联的调制级别。 通过比较为不同的光刻变量值生成的掩模版的图像来生成检查数据。 图像包括至少一个参考图像和至少一个调制图像。 可以从两个或更多个参考图像生成复合参考图像。 该方法还包括将一个或多个标识符分配给感兴趣的缺陷。 标识符可以包括例如缺陷分类和/或识别感兴趣的缺陷是否用于进一步处理的指示符。

公开(公告)号：US08045786B2

公开(公告)日：2011-10-25

申请号：US11552471

申请日：2006-10-24

Applicant: Amir Widmann ,  Mark Ghinovker ,  Dror Francis

Inventor： Amir Widmann ,  Mark Ghinovker ,  Dror Francis

IPC: G06K9/00

CPC classification number: G03F7/70633 ,  G03F7/70508 ,  G03F7/70625

Abstract: Disclosed are apparatus and methods for optimizing a metrology tool, such as an optical or scanning electron microscope so that minimum human intervention is achievable during the optimization. In general, a set of specifications and an initial input data are initially provided for a particular target. The specifications provide limits for characteristics of images that are to be measured by the metrology tool. The metrology tool is then automatically optimized for measuring the particular target so as to meet one or more of the provided specifications without further significant human intervention with respect to the metrology tool. In one aspect, the input data provided prior to the automated optimization procedure includes a plurality of target locations and a synthetic image of the particular target.

Abstract translation: 公开了用于优化诸如光学或扫描电子显微镜的计量工具的装置和方法，使得在优化期间可以实现最小的人为干预。 通常，最初为特定目标提供一组规范和初始输入数据。 这些规格对由计量工具测量的图像的特性提供了限制。 然后，度量工具自动优化用于测量特定目标，以满足一个或多个所提供的规格，而不会对计量工具进行更多的人为干预。 在一个方面，在自动优化过程之前提供的输入数据包括多个目标位置和特定目标的合成图像。

公开(公告)号：US08041103B2

公开(公告)日：2011-10-18

申请号：US11759607

申请日：2007-06-07

Applicant: Ashok Kulkarni ,  Brian Duffy ,  Kais Maayah ,  Gordon Rouse ,  Eugene Shifrin

Inventor： Ashok Kulkarni ,  Brian Duffy ,  Kais Maayah ,  Gordon Rouse ,  Eugene Shifrin

IPC: G06K9/00

CPC classification number: G06F17/5045 ,  G06T7/0006 ,  G06T7/33 ,  G06T2207/30148 ,  H01L21/67005

Abstract: Various methods and systems for determining a position of inspection data in design data space are provided. One computer-implemented method includes determining a centroid of an alignment target formed on a wafer using an image of the alignment target acquired by imaging the wafer. The method also includes aligning the centroid to a centroid of a geometrical shape describing the alignment target. In addition, the method includes assigning a design data space position of the centroid of the alignment target as a position of the centroid of the geometrical shape in the design data space. The method further includes determining a position of inspection data acquired for the wafer in the design data space based on the design data space position of the centroid of the alignment target.

Abstract translation: 提供了用于确定设计数据空间中检查数据位置的各种方法和系统。 一种计算机实现的方法包括使用通过对晶片成像获得的对准目标的图像来确定形成在晶片上的对准目标的质心。 该方法还包括将质心对准描述对准目标的几何形状的质心。 此外，该方法包括将对准目标的质心的设计数据空间位置分配为设计数据空间中几何形状的质心的位置。 该方法还包括基于对准目标的质心的设计数据空间位置确定在设计数据空间中为晶片获取的检查数据的位置。