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    Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants
    32.
    发明申请
    Method for making a micromechanical device by removing a sacrificial layer with multiple sequential etchants 有权
    通过用多个顺序蚀刻剂去除牺牲层来制造微机械装置的方法

    公开(公告)号：US20020197761A1

    公开(公告)日：2002-12-26

    申请号：US10154150

    申请日：2002-05-22

    Applicant: REFLECTIVITY, INC.

    Inventor： Satyadev R. Patel ,  Andrew G. Huibers ,  Gregory P. Schaadt ,  Peter J. Heureux

    IPC: H01L021/00 ,  H01L021/302 ,  H01L021/461

    CPC classification number: B81C1/00476 ,  B81C1/00547 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/112 ,  B82Y30/00

    Abstract: An etching method, such as for forming a micromechanical device, is disclosed. One embodiment of the method is for releasing a micromechanical structure, comprising, providing a substrate; providing a sacrificial layer directly or indirectly on the substrate; providing one or more micromechanical structural layers on the sacrificial layer; performing a first etch to remove a portion of the sacrificial layer, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of the sacrificial layer; performing a second etch to remove additional sacrificial material in the sacrificial layer, the second etch comprising providing a gas that chemically but not physically etches the additional sacrificial material. Another embodiment of the method is for etching a silicon material on or within a substrate, comprising: performing a first etch to remove a portion of the silicon, the first etch comprising providing an etchant gas and energizing the etchant gas so as to allow the etchant gas to physically, or chemically and physically, remove the portion of silicon; performing a second etch to remove additional silicon, the second etch comprising providing an etchant gas that chemically but not physically etches the additional silicon.

    Abstract translation: 公开了一种诸如用于形成微机械装置的蚀刻方法。 该方法的一个实施例是用于释放微机械结构，包括：提供衬底; 在衬底上直接或间接提供牺牲层; 在所述牺牲层上提供一个或多个微机械结构层; 执行第一蚀刻以去除牺牲层的一部分，所述第一蚀刻包括提供蚀刻剂气体并激发蚀刻剂气体，以允许蚀刻剂气体在物理或化学和物理上移除牺牲层的该部分; 执行第二蚀刻以去除牺牲层中的附加牺牲材料，第二蚀刻包括提供化学上但不物理蚀刻附加牺牲材料的气体。 该方法的另一实施例是用于在衬底上或衬底内蚀刻硅材料，包括：执行第一蚀刻以去除硅的一部分，第一蚀刻包括提供蚀刻剂气体并激发蚀刻剂气体以允许蚀刻剂 物理或化学和物理的气体去除硅的部分; 执行第二蚀刻以去除附加的硅，第二蚀刻包括提供蚀刻剂气体，其化学地但不物理地蚀刻附加的硅。

    Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements
    33.
    发明授权
    Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements 有权

    公开(公告)号：US6046840A

    公开(公告)日：2000-04-04

    申请号：US160361

    申请日：1998-09-24

    Applicant: Andrew Huibers

    Inventor： Andrew Huibers

    IPC: G02B26/08

    CPC classification number: G02B26/0833 ,  G02B26/0841 ,  Y10S359/904

    Abstract: A spatial light modulator includes an upper optically transmissive substrate held above a lower substrate containing addressing circuitry. One or more electrostatically deflectable elements are suspended by hinges from the upper substrate. In operation, individual mirrors are selectively deflected and serve to spatially modulate light that is incident to, and then reflected back through, the upper substrate. Motion stops may be attached to the reflective deflectable elements so that the mirror does not snap to the bottom substrate. Instead, the motion stop rests against the upper substrate thus limiting the deflection angle of the reflective deflectable elements.

    Projection display
    34.
    发明授权
    Projection display 有权
    投影显示

    公开(公告)号：US07172296B2

    公开(公告)日：2007-02-06

    申请号：US10857519

    申请日：2004-05-28

    Applicant: Andrew G. Huibers

    Inventor： Andrew G. Huibers

    IPC: G03B21/14 ,  G03B21/28

    CPC classification number: G03B21/28 ,  G02B26/0841 ,  Y10S359/904

    Abstract: In order to minimize light diffraction along the direction of switching and more particularly light diffraction into the acceptance cone of the collection optics, in the present invention, micromirrors are provided which are not rectangular. Also, in order to minimize the cost of the illumination optics and the size of the display unit of the present invention, the light source is placed orthogonal to the rows (or columns) of the array, and/or the light source is placed orthogonal to a side of the frame defining the active area of the array. The incident light beam, though orthogonal to the sides of the active area, is not however, orthogonal to any substantial portion of sides of the individual micromirrors in the array. Orthogonal sides cause incident light to diffract along the direction of micromirror switching, and result in light ‘leakage’ into the ‘on’ state even if the micromirror is in the ‘off’ state. This light diffraction decreases the contrast ratio of the micromirror. The micromirrors of the present invention result in an improved contrast ratio, and the arrangement of the light source to micromirror array in the present invention results in a more compact system. Another feature of the invention is the ability of the micromirrors to pivot in opposite direction to on and off positions (the on position directing light to collection optics), where the movement to the on position is greater than movement to the off position. A further feature of the invention is a package for the micromirror array, the package having a window that is not parallel to the substrate upon which the micromirrors are formed. One example of the invention includes all the above features.

    Abstract translation: 为了最小化沿着切换方向的光衍射，并且更特别地，将光衍射最小化到收集光学器件的接收锥体中，在本发明中，提供了不是矩形的微镜。 此外，为了最小化本发明的照明光学器件的成本和显示单元的尺寸，将光源与阵列的行（或列）正交放置，和/或将光源正交 到帧的定义阵列的有效区域的一侧。 然而，入射光束虽然正交于有源区域的侧面，但是不是与阵列中的各个微镜的任何相当大部分的侧面正交。 正交侧使得入射光沿着微镜切换的方向衍射，并且即使微镜处于“关闭”状态，也导致光“泄漏”进入“打开”状态。 该光衍射降低了微镜的对比度。 本发明的微反射镜导致对比度提高，并且在本发明中光源到微镜阵列的布置导致更紧凑的系统。 本发明的另一个特征是微镜能够相对于打开和关闭位置（将光引导到收集光学器件）的相对方向枢转，其中到打开位置的移动大于移动到关闭位置。 本发明的另一个特征是用于微镜阵列的封装，该封装具有不与形成微反射镜的基板平行的窗口。 本发明的一个实例包括所有上述特征。

    Asymmetric spatial light modulator in a package
    36.
    发明授权
    Asymmetric spatial light modulator in a package 有权
    封装中的非对称空间光调制器

    公开(公告)号：US07034985B1

    公开(公告)日：2006-04-25

    申请号：US10969300

    申请日：2004-10-19

    Applicant: Andrew Huibers ,  Regis Grasser

    Inventor： Andrew Huibers ,  Regis Grasser

    IPC: G02B26/00 ,  G02B26/08

    CPC classification number: G02B26/0833 ,  Y10S359/904

    Abstract: Disclosed herein is a micromirror package having a micromirror being attached to a supporting surface of a package substrate, and sealed between the package substrate and a package cover, whereas the micromirror array is placed offset the center of the supporting surface.

    Abstract translation: 本文公开了一种微镜封装，其具有附接到封装基板的支撑表面的微镜，并且密封在封装基板和封装盖之间，而微镜阵列被放置在支撑表面的中心偏移位置。

    Etching method used in fabrications of microstructures
    37.
    发明授权
    Etching method used in fabrications of microstructures 有权
    用于微结构制造中的蚀刻方法

    公开(公告)号：US07027200B2

    公开(公告)日：2006-04-11

    申请号：US10666002

    申请日：2003-09-17

    Applicant: Hongqin Shi ,  Gregory P. Schaadt ,  Andrew G. Huibers ,  Satyadev R. Patel

    Inventor： Hongqin Shi ,  Gregory P. Schaadt ,  Andrew G. Huibers ,  Satyadev R. Patel

    IPC: G02B26/00

    CPC classification number: H01L21/67069 ,  B81C1/00595 ,  B81C2201/0132 ,  G02B26/0841

    Abstract: The present invention discloses a method and apparatus for removing the sacrificial materials in fabrications of microstructures using a vapor phase etchant recipe having a spontaneous vapor phase chemical etchant. The vapor phase etchant recipe has a mean-free-path corresponding to the minimum thickness of the sacrificial layers between the structural layers of the microstructure. This method is of particular importance in removing the sacrificial layers underneath the structural layers of the microstructure.

    Abstract translation: 本发明公开了一种使用具有自发气相化学蚀刻剂的气相蚀刻剂配方去除微结构制造中的牺牲材料的方法和装置。 气相蚀刻剂配方具有对应于微结构的结构层之间的牺牲层的最小厚度的平均自由程。 该方法在去除微结构结构层下面的牺牲层时尤其重要。

    Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements
    38.
    发明授权
    Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements 有权

    公开(公告)号：US07009754B2

    公开(公告)日：2006-03-07

    申请号：US11090800

    申请日：2005-03-24

    Applicant: Andrew G. Huibers

    Inventor： Andrew G. Huibers

    IPC: G02B26/00 ,  G02B26/08

    CPC classification number: G02B26/0833 ,  G02B26/08 ,  G02B26/0841 ,  Y10S359/904

    Abstract: A spatial light modulator includes an upper optically transmissive substrate held above a lower substrate containing addressing circuitry. One or more electrostatically deflectable elements are suspended by hinges from the upper substrate. In operation, individual mirrors are selectively deflected and serve to spatially modulate light that is incident to, and then reflected back through, the upper substrate. Motion stops may be attached to the reflective deflectable elements so that the mirror does not snap to the bottom substrate. Instead, the motion stop rests against the upper substrate thus limiting the deflection angle of the reflective deflectable elements.

    Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements
    40.
    发明授权
    Double substrate reflective spatial light modulator with self-limiting micro-mechanical elements 有权

    公开(公告)号：US06975444B2

    公开(公告)日：2005-12-13

    申请号：US11089692

    申请日：2005-03-24

    Applicant: Andrew G. Huibers

    Inventor： Andrew G. Huibers

    IPC: G02B26/08 ,  G02B26/00

    CPC classification number: G02B26/0833 ,  G02B26/08 ,  G02B26/0841 ,  Y10S359/904

    Abstract: A spatial light modulator includes an upper optically transmissive substrate held above a lower substrate containing addressing circuitry. One or more electrostatically deflectable elements are suspended by hinges from the upper substrate. In operation, individual mirrors are selectively deflected and serve to spatially modulate light that is incident to, and then reflected back through, the upper substrate. Motion stops may be attached to the reflective deflectable elements so that the mirror does not snap to the bottom substrate. Instead, the motion stop rests against the upper substrate thus limiting the deflection angle of the reflective deflectable elements.

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