公开(公告)号：US20070287361A1

公开(公告)日：2007-12-13

申请号：US11423760

申请日：2006-06-13

Applicant: Brian Bottema

Inventor： Brian Bottema

IPC: B24B51/00 ,  B24B1/00 ,  B24B7/30

CPC classification number: B24B53/017 ,  B24B1/04

Abstract: A tool for forming a desired pattern on a polishing pad establishes a vibration that is coupled to the polishing pad. The vibration removes small portions of the polishing pad according to the desired pattern. The polishing pad is then used in a chemical mechanical polishing (CMP) step to polish a layer on a semiconductor device.

Abstract translation: 用于在抛光垫上形成所需图案的工具建立了耦合到抛光垫的振动。 该振动根据期望的图案去除抛光垫的小部分。 然后将抛光垫用于化学机械抛光（CMP）步骤以抛光半导体器件上的层。

公开(公告)号：US20070214640A1

公开(公告)日：2007-09-20

申请号：US11630052

申请日：2005-06-08

Applicant: Erwin Bayer ,  Thomas Peschke ,  Holger Polanetzki ,  Alexander Winkler ,  Thomas Dautl

Inventor： Erwin Bayer ,  Thomas Peschke ,  Holger Polanetzki ,  Alexander Winkler ,  Thomas Dautl

IPC: B24B39/00

CPC classification number: B24B1/04 ,  B24B39/006 ,  Y10T29/479 ,  Y10T29/49321 ,  Y10T29/49323 ,  Y10T29/49325

Abstract: The invention relates to a method and an apparatus for the surface blasting, especially for the ultrasonic shot peening, of gas turbine blades in the area of their blade roots. The apparatus encompasses at least one vibrator, especially at least one ultrasonic sonotrode (12), comprising an oscillating surface (13), whereby the or each vibrator is oriented in such a manner so that the oscillating surface (13) of the or each vibrator extends essentially in the horizontal direction, whereby a processing chamber (14), for receiving the or each blade root (15) to be processed, adjoins the or each oscillating surface (13). According to the invention, the processing chamber (14) is embodied in such a manner so that the or each gas turbine blade (11) is orientable in such a manner for the surface blasting so that during the blasting at least one profiled support surface, which is to be processed, of the or each blade root (15) extends at least temporarily essentially parallel to the oscillating surface (13) of the or each vibrator, especially the or each ultrasonic sonotrode.

Abstract translation: 本发明涉及一种用于在其叶片根部区域中的燃气轮机叶片的表面喷砂，特别是用于超声喷丸处理的方法和装置。 该装置包括至少一个振动器，特别是包括振荡表面（13）的至少一个超声波超声波发生器（12），由此该振动器或每个振动器以这样的方式定向，使得振动器或振动器的振动表面（13） 基本上在水平方向上延伸，由此用于接收待处理的叶片根部或每个叶根部（15）的处理室（14）与该振动表面（13）相邻。 根据本发明，处理室（14）以这样的方式实施，使得该燃气轮机叶片（11）可以以这种方式定向用于表面喷砂，使得在喷射至少一个成型支承表面期间， 每个叶片根部（15）的至少一个或多个叶片根部（15）至少临时延伸地基本平行于振动器的振动表面（13），特别是每个超声波超声波发生器。

公开(公告)号：US20070077871A1

公开(公告)日：2007-04-05

申请号：US11494613

申请日：2006-07-28

Applicant: Moo-Yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

Inventor： Moo-Yong Park ,  Tai-hyoung Kim ,  Choon-goang Kim ,  Dong-Il Kim

IPC: B24B1/00 ,  B24B29/00 ,  B24B21/18

CPC classification number: B24B53/017 ,  B24B1/04

Abstract: Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto a polishing pad attached to an upper surface of the rotating polishing table. The CMP device may include a pad conditioner assembly that conditions the polishing pad by supplying a pad conditioning liquid onto the polishing pad and simultaneously transferring a megasonic vibration to the pad conditioning liquid to remove foreign substances from a surface of the polishing pad.

Abstract translation: 提供化学机械抛光（CMP）装置，垫调节器组件和抛光垫调节方法。 CMP装置通过将具有安装在载体的下表面上的晶片的载体旋转在旋转的抛光台上，同时将浆料提供到附接到旋转的抛光台的上表面的抛光垫上来平坦化晶片。 CMP装置可以包括垫调节器组件，其通过将抛光垫调节液提供到抛光垫上来调节抛光垫，同时将兆声波振动传送到衬垫调节液以从抛光垫的表面去除异物。

公开(公告)号：US20070066188A1

公开(公告)日：2007-03-22

申请号：US11519800

申请日：2006-09-13

Applicant: Yuji Nitta ,  Yuichi Shimizu

Inventor： Yuji Nitta ,  Yuichi Shimizu

IPC: B24B7/30 ,  B24B9/00

CPC classification number: B24B1/04 ,  B24B27/06 ,  B28D5/022 ,  B28D5/047 ,  H01L21/67092 ,  H05K1/0306 ,  H05K3/0044 ,  Y10S83/956 ,  Y10S451/91 ,  Y10T83/0572

Abstract: The invention provides a cutting method and a cutting apparatus that cuts without chipping a composite material consisting of laminated layers of crystal material and amorphous material, in which the amorphous material is cut with an ultrasonically vibrated cutting blade and the crystal material is cut with a cutting blade that does not ultrasonically vibrate. With such a method and apparatus, the crystal material portion and the amorphous material portion of the composite material can be cut cleanly without chipping.

Abstract translation: 本发明提供一种切割方法和切割装置，其切割而不会破碎由晶体材料和无定形材料的层压层组成的复合材料，其中非晶材料用超声波振动的切割刀切割，并且晶体材料被切割 没有超声振动的刀片。 通过这样的方法和装置，复合材料的晶体材料部分和无定形材料部分可以被干净地切割而不会碎裂。

公开(公告)号：US20070000130A1

公开(公告)日：2007-01-04

申请号：US11170198

申请日：2005-06-29

Applicant: Roman Cisek ,  Jeffrey Finn

Inventor： Roman Cisek ,  Jeffrey Finn

IPC: B23P15/14

CPC classification number: B23P15/14 ,  B23P9/00 ,  B24B1/04 ,  B24B31/06 ,  Y10T29/49462

Abstract: Pinion gears for planetary gear transmissions are hobbed, heat treated, and then ground to get better control of the leads/profiles on all the gear teeth. Then a light shot peening is applied to the tooth flanks to achieve the desired compressive residual stresses on the tooth surface. By applying the process in the controlled manner specified, the surface is not over-cold worked. Next, a chemically assisted isotropic surface treatment is applied over the pinion gears to improve the surface finish on the gear teeth. For low speed applications the surface finish improves the lambda ratio, allowing for a good oil film thickness on the surface of the gear teeth.

Abstract translation: 用于行星齿轮传动装置的齿轮齿轮进行滚动，热处理，然后进行磨削，以更好地控制所有齿轮齿上的导线/型材。 然后将轻度喷丸硬化施加到齿面以实现在牙齿表面上的期望的压缩残余应力。 通过以指定的受控方式应用该过程，表面不会过冷。 接下来，在小齿轮上施加化学辅助各向同性表面处理以改善齿轮齿上的表面光洁度。 对于低速应用，表面光洁度提高了λ比值，从而在齿轮齿表面形成良好的油膜厚度。

公开(公告)号：US07008299B2

公开(公告)日：2006-03-07

申请号：US10230667

申请日：2002-08-29

Applicant: Nagasubramaniyan Chandrasekaran

Inventor： Nagasubramaniyan Chandrasekaran

IPC: B24B1/00

CPC classification number: B24B37/04 ,  B24B1/04

Abstract: Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for polishing a workpiece includes determining an estimated frequency of serial defects in a workpiece, pressing the workpiece against a polishing pad and moving the workpiece relative to the pad. The method further includes vibrating the workpiece and/or the pad at a frequency that is greater than the estimated frequency of the serial defects. In one aspect of this embodiment, determining the estimated frequency of serial defects can include: determining a relative velocity between the workpiece and the polishing pad; estimating the length of a mark on the workpiece; estimating the time a particle in a planarizing solution is in contact with the workpiece; and estimating the number of cracks in the workpiece.

公开(公告)号：US20060032332A1

公开(公告)日：2006-02-16

申请号：US11253710

申请日：2005-10-20

Applicant: Kazumasa Ohnishi

Inventor： Kazumasa Ohnishi

IPC: B23D63/00

CPC classification number: B28D5/022 ,  B24B1/04 ,  B24D5/12

Abstract: A cutting disc blade having a center hole is equipped with a ultrasonic transducer in the form of ring which is coaxially fixed onto one or both surfaces of the disc blade, to give a cutting tool which can be efficiently vibrated with ultrasonic wave.

Abstract translation: 具有中心孔的切割盘片装备有环形形式的超声波换能器，其同轴地固定在盘片的一个或两个表面上，以产生能够用超声波有效地振动的切割工具。

公开(公告)号：US20050236358A1

公开(公告)日：2005-10-27

申请号：US10832030

申请日：2004-04-26

Applicant: Shen Buswell

Inventor： Shen Buswell

IPC: B23B37/00 ,  B23K26/00 ,  B23K26/38 ,  B24B1/04 ,  B24B37/04 ,  B41J2/14 ,  B41J2/16 ,  B81C1/00 ,  G11B5/127 ,  H01L21/8242

CPC classification number: B41J2/1632 ,  B24B1/04 ,  B24B37/042 ,  B41J2/14145 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1634

Abstract: A method of forming fluid handling slots in a semiconductor substrate having a thickness defined by a first side and a second side is provided. The method comprises ultrasonic grinding, utilizing an abrasive material, into the semiconductor substrate from a first side to form a first trench, and removing semiconductor substrate material from the backside to form a second trench, wherein at least a portion of the first and second trenches intersect to form a feature through the semiconductor substrate.

Abstract translation: 提供了一种在具有由第一侧和第二侧限定的厚度的半导体衬底中形成流体处理槽的方法。 该方法包括从第一侧将研磨材料超声磨削到半导体衬底中以形成第一沟槽，以及从背面去除半导体衬底材料以形成第二沟槽，其中第一和第二沟槽的至少一部分 相交以形成通过半导体衬底的特征。

公开(公告)号：US20050026545A1

公开(公告)日：2005-02-03

申请号：US10930191

申请日：2004-08-31

Applicant: Jason Elledge ,  Nagasubramaniyan Chandrasekaran

Inventor： Jason Elledge ,  Nagasubramaniyan Chandrasekaran

IPC: B24B37/005 ,  B24B37/20 ,  B24B49/00 ,  B24B49/18 ,  B24B53/007 ,  B24B53/017 ,  B24B1/00 ,  B24B51/00

CPC classification number: B24B37/20 ,  B24B1/04 ,  B24B37/005 ,  B24B49/003 ,  B24B49/18 ,  B24B53/017

Abstract: Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing pad and determining a status of the characteristic based on a measurement of the ultrasonic energy applied to the polishing pad. In one aspect of this embodiment, applying ultrasonic energy includes applying ultrasonic energy from a transducer. The transducer can be carried by a conditioner, a fluid arm, a micro-device workpiece carrier, or a table. In another aspect of this embodiment, determining the status of the characteristic includes determining a thickness, density, surface contour, roughness, or texture of the polishing pad.

公开(公告)号：US20040259481A1

公开(公告)日：2004-12-23

申请号：US10617679

申请日：2003-07-14

Applicant: CHUNG SHAN INSTITUTE OF SCIENCE & TECHNOLOGY

Inventor： Wen-Chueh Pan ,  Jer-Shyong Lai ,  Yih-Hsing Wang ,  Yang-Jiann Fann ,  Chih-Wei Chu ,  Hsing-Liao Chung ,  Chaug-Liang Hsu ,  Ming-Tseh Tsay ,  Yeau-Ren Jeng ,  Meng-Shiun Tsai

IPC: B24B001/00

CPC classification number: B24B37/042 ,  B24B1/04 ,  H01L21/3212

Abstract: A method of polishing metal and barrier layer interconnect integrated with an extremely low dielectric constant material includes steps of (A) preparing a wafer composed of a copper layer and the extremely low dielectric constant material, (B) treating the copper layer chemically to produce a hard and brittle surface residual formed on the surface of the copper layer, (C) keeping polishing the surface residual by ultrasonic waves, (D) polishing a barrier layer of wafer by the ultrasonic waves, thereby polishing the wafer successfully.

Abstract translation: 一种抛光与极低介电常数材料结合的金属和阻挡层布线的方法包括以下步骤：（A）制备由铜层和极低介电常数材料构成的晶片，（B）化学处理铜层以产生 在铜层的表面上形成硬脆的表面残留物，（C）通过超声波保持抛光表面残留，（D）通过超声波研磨晶片的阻挡层，从而成功研磨晶片。