公开(公告)号：US20040245319A1

公开(公告)日：2004-12-09

申请号：US10454258

申请日：2003-06-03

申请人： ASM Assembly Automation Ltd.

发明人： Chi Wah Cheng ,  Ping Chun Benson Chong ,  Chin Pang Anson Chan

IPC分类号： B23K031/12

CPC分类号： B23K3/0607 ,  B23K2101/42

摘要： The invention provides a method and apparatus for aligning a substrate. The apparatus comprises a ball pick head for picking up a plurality of solder balls in a ball pick-up process and depositing them onto the substrate, and a vision system adapted to view and obtain positional information of the substrate. Furthermore, a carrier is provided to which the vision system is mountable, such that operation of the vision system is decoupled from movement of the ball pick head. Drivers responsive to said positional information viewed by the vision system are operative to align at least the substrate and the ball pick head for depositing solder balls onto the substrate.

摘要翻译： 本发明提供了一种用于对准衬底的方法和装置。 该装置包括用于在球拾取过程中拾取多个焊球并将其沉积到基板上的球形拾取头，以及适于观察和获得基板的位置信息的视觉系统。 此外，提供了可安装视觉系统的载体，使得视觉系统的操作与球拍头的移动脱离。 响应于由视觉系统观看的所述位置信息的驱动器可操作以至少对准基底和球形拾取头，以将焊球沉积到基底上。

公开(公告)号：US20040124228A1

公开(公告)日：2004-07-01

申请号：US10691961

申请日：2003-10-24

发明人： Hwan-Chia Chang

IPC分类号： B23K031/12

CPC分类号： B23K31/12 ,  B23K2101/36 ,  H05K1/0269 ,  H05K3/3421 ,  H05K3/3447 ,  H05K2203/161 ,  H05K2203/163 ,  Y02P70/613

摘要： A method for testing soldering quality is provided for determining the solder quality of pins, leads, a connector or an electronic component mounted on a circuit board. A soldering contact, soldered to the circuit board, is enclosed by melted solder during soldering and generate a different color from that before soldering. The color difference allows the soldering quality of the soldering contact to be determined by visual inspection and prevents inferior products from entering subsequent fabrication processes, thereby improving the soldering reliability.

摘要翻译： 提供了测试焊接质量的方法，用于确定安装在电路板上的销，引线，连接器或电子部件的焊料质量。 焊接到电路板的焊接接头在焊接期间被熔化的焊料包围，并产生与焊接之前不同的颜色。 色差允许通过目视检查来确定焊接接触的焊接质量，并防止劣质产品进入后续制造工艺，从而提高焊接可靠性。

公开(公告)号：US20040112940A1

公开(公告)日：2004-06-17

申请号：US10318764

申请日：2002-12-13

发明人： James Walter Caddell JR. ,  Robert Dale Lawrence

IPC分类号： B23K031/12

CPC分类号： B23P6/002 ,  B23K9/16 ,  B23K9/235 ,  F01D5/005 ,  Y02T50/67 ,  Y02T50/671

摘要： A welding apparatus includes a workpiece housing having a window therethrough and having a welding access therethrough for a welder to an interior of the workpiece housing. The workpiece housing is metallic with a heat insulation on an internal surface thereof. A lamp heat source is directed through the window and at the workpiece in the interior of the workpiece housing. A gas source delivers a controllable flow of a shielding gas to the interior of the workpiece housing. A temperature sensor senses a temperature of the workpiece within the interior of the workpiece housing. A feedback controller controls the power to the lamp heat source responsive to the temperature of the workpiece. To perform welding, the workpiece is placed into the interior of the workpiece housing so as to have its temperature sensed by the temperature sensor, and the gas source is operated to envelope the workpiece in the shielding gas. The workpiece is heated by powering the lamp heat source responsive to a setpoint input and to the temperature of the workpiece. The workpiece is welded using a welder operating through the welding access.

摘要翻译： 焊接设备包括具有穿过其中的窗口的工件壳体，并且具有穿过其的焊接通道，用于焊接器到工件外壳的内部。 工件壳体是金属的，其内表面具有绝热。 灯泡热源通过窗口和工件在工件外壳的内部引导。 气体源将保护气体的可控流量输送到工件外壳的内部。 温度传感器感测工件在工件外壳内部的温度。 反馈控制器响应于工件的温度来控制灯热源的功率。 为了进行焊接，将工件放置在工件壳体的内部，以便由温度传感器检测其温度，并且气体源被操作以将工件包围在保护气体中。 通过根据设定值输入和工件的温度对灯热源供电来加热工件。 使用通过焊接操作的焊工焊接工件。

公开(公告)号：US20040099710A1

公开(公告)日：2004-05-27

申请号：US10402460

申请日：2003-03-28

发明人： Bernd Sommer

IPC分类号： B23K031/12

CPC分类号： G01B11/0608

摘要： The ball attach step of grid array (BGA) devices requires precise control of the ball shape and height. All balls must have identical height within tight tolerances, to assure proper soldering to the PC board. Solution: A mechanism is proposed, involving a CCD camera, image processing system, and a specific optical setup to inspect the balls in a complete three-dimensional view to the camera. This-involves a dedicated micro-mirror module and an illumination arrangement. The ball XY position is measured in direct view, and the ball height is measured in the image from the micro mirrors. The camera can be either a standard video device, a very high resolution array camera, or even a line scan camera.

摘要翻译： 网格阵列（BGA）装置的球连接步骤需要精确控制球形和高度。 所有的球必须在严格的公差范围内具有相同的高度，以确保正确焊接到PC板。 解决方案：提出一种机制，涉及CCD相机，图像处理系统和特定的光学设置，以完整的三维视图来检查相机的球。 这涉及专用微镜模块和照明装置。 球XY位置是直接测量的，球的高度是从微镜的图像中测量出来的。 相机可以是标准视频设备，非常高分辨率阵列相机，甚至是行扫描相机。

公开(公告)号：US20030062397A1

公开(公告)日：2003-04-03

申请号：US10256137

申请日：2002-09-27

发明人： Nobuyoshi Komai ,  Fujimitsu Masuyama ,  Masahiro Kobayashi

IPC分类号： B23K031/12

CPC分类号： G01N23/2251 ,  G01N17/006

摘要： The present invention provides a high-precision method for evaluating creep damage of high tension heat resistant steel used in high temperature exposing apparatuses comprising comparing particle size behavior varying with creep damage progress of crystal grains having a crystal orientation difference of about 2 degrees or more, preferably 3 degrees or more at an evaluated part on the basis of a working curve or a working map prepared in advance by looking for the relation of grain sizes to creep damage extents, and also provides a high-precision apparatus for evaluating creep damage of high tension heat resistant steel used in high temperature exposing apparatuses comprising a measuring means for measuring particle size variation behavior of crystal grains or sub grains having a crystal orientation difference of about 2 degrees or more with regard to a specimen at the evaluated part of high tension heat resistant steel and a working curve or a working map prepared in advance by looking for the relation of the grain sizes with respect to the creep damage extents (including creep damage rates) at every level of loaded stress wherein a creep damage extent is evaluated by comparing the grain size variation behavior measured by the measuring means with a working curve or a working map selected on the basis of a loaded stress.

摘要翻译： 本发明提供了一种用于评估在高温曝光装置中使用的高张力耐热钢的蠕变损伤的高精度方法，其包括比较晶体取向差为约2度以上的晶粒的蠕变损伤进展变化的粒径特性， 优选为3度以上，基于通过寻找粒度与蠕变损伤范围的关系而预先制备的工作曲线或工作图，并且还提供用于评估高蠕变损伤的高精度装置 在高温曝光装置中使用的耐张力钢，其特征在于，包括：测定装置，用于测定在所述高张力热评价部位的试样的晶粒取向差为约2度以上的晶粒或亚晶粒的粒径变化特性 耐磨钢和工作曲线或工作图由预先准备的lookin g，其中通过将由测量装置测量的晶粒尺寸变化行为与工作曲线进行比较来评估蠕变损伤程度，其中，所述晶粒尺寸相对于蠕变损伤程度（包括蠕变损伤率）在每个载荷应力水平处的关系， 或基于加载的应力选择的工作图。

公开(公告)号：US20020190098A1

公开(公告)日：2002-12-19

申请号：US10217498

申请日：2002-08-14

发明人： Masafumi Ozawa

IPC分类号： B23K031/12

CPC分类号： H01L33/40 ,  H01L33/38 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/06102 ,  H01L2224/48091 ,  H01L2933/0016 ,  H01S5/02212 ,  H01S5/0224 ,  H01S5/02272 ,  H01L2924/00014

摘要： To offer a semiconductor light-emitting device capable of preventing a short circuit failure caused by adhesion of the solder, change of a beam shape, and decrease of a beam output. A semiconductor laser device 1 is manufactured by overlaying a laser tip having a p-side electrode and a n-side electrode in a crystalline substrate and a mounting plate having a first solder film and a second solder film in a supporting body. The laser tip has a level difference A such that the p-side electrode is projected beyond the n-side electrode. The mounting plate has a level difference B such that the first solder film is projected beyond the second solder film. The level difference B of the mounting plate is determined as higher than the level difference A of the laser tip. Therefore, when the mounting plate is overlaid to the laser tip, first, the n-side electrode contacts with the second solder film, and then, the p-side electrode contacts the first solder film. Accordingly, even if the solder is squeezed out in the vicinity of the n-side electrode, the solder is hardly squeezed out in the vicinity of the p-side electrode. The pn junction part is generally positioned in the vicinity of the p-side electrode, which controls the solder to adhesion to the pn junction part.

摘要翻译： 提供能够防止焊料粘附引起的短路故障的半导体发光装置，光束形状的变化和光束输出的减少。 半导体激光器件1通过将具有p侧电极和n侧电极的激光尖端覆盖在结晶衬底中，以及在支撑体中具有第一焊料膜和第二焊料膜的安装板来制造。 激光尖端具有电平差A，使得p侧电极突出超过n侧电极。 安装板具有水平差B，使得第一焊料膜突出超过第二焊料膜。 安装板的电平差B被确定为高于激光尖端的电平差A。 因此，当安装板与激光尖端重叠时，首先，n侧电极与第二焊料膜接触，然后p侧电极与第一焊料膜接触。 因此，即使焊料在n侧电极附近被挤出，在p侧电极附近难以挤出焊料。 pn接合部通常位于p侧电极附近，该p侧接合部控制焊料与pn接合部的粘附。

公开(公告)号：US20020190097A1

公开(公告)日：2002-12-19

申请号：US10144796

申请日：2002-05-15

发明人： Ola Pettersen

IPC分类号： B23K031/12

CPC分类号： B23K1/00 ,  B23K2101/26

摘要： The present invention (FIG. 1) relates to a new method for brazing a connecting piece of electrically conducting material, for example of metal, to a metal surface by means of a new type of temperature-controlled brazing whereby for certain types of material, for example steel, a martensite-free brazing is obtained, i.e. a brazing without deleterious structural changes (martensite formation). A brazing is obtained that is completely free of martensite underneath the brazed joint in for example railway track and/or pipework. The invention also relates to an arrangement for carrying out the said method.

摘要翻译： 本发明（图1）涉及一种用于通过新型温度控制钎焊将金属导电材料的连接片钎焊到金属表面的新方法，由此对于某些类型的材料， 例如钢，获得不含马氏体的钎焊，即没有有害结构变化（马氏体形成）的钎焊。 获得在例如铁路轨道和/或管道中的钎焊接头之下完全没有马氏体的钎焊。 本发明还涉及一种用于执行所述方法的装置。

公开(公告)号：US20020170945A1

公开(公告)日：2002-11-21

申请号：US09860163

申请日：2001-05-17

申请人： Intel Corporation

发明人： Shafarin Shafie

IPC分类号： B23K031/12 ,  B23K001/20 ,  B23Q015/00

CPC分类号： B23K3/0623 ,  H01L21/4853 ,  H05K3/3478

摘要： A solder ball attachment system for manufacturing an integrated circuit or the like is disclosed. The solder ball attachment system includes a flux station adapted to apply flux onto a substrate and a solder ball placement station adapted to place solder balls onto the flux. A conveyor assembly is included to move the substrate between the flux station and the solder ball placement station.

摘要翻译： 公开了一种用于制造集成电路等的焊球附着系统。 焊球安装系统包括适于将焊剂施加到衬底上的焊剂站和适于将焊球放置在焊剂上的焊球放置台。 包括输送机组件以在焊剂站和焊球放置台之间移动衬底。

公开(公告)号：US20020134816A1

公开(公告)日：2002-09-26

申请号：US09851853

申请日：2001-05-09

发明人： Xiao Chen ,  Yi Dong ,  Edward T. Martin ,  Zhishang Yang ,  Wayne Tanner

IPC分类号： B23K031/12 ,  B23K031/02 ,  B21D039/00

CPC分类号： B23K31/003 ,  B23K31/02 ,  B23K37/04 ,  B23K37/0426

摘要： A method for designing a weld fixture. The method includes modeling a set of distortions produced by applied mechanical forces on a material to be welded, modeling a set of distortions produced by applied thermal forces on the material to be welded, determining a set of reaction forces at a series of locations on a simulated weld fixture as a function of the modeled distortions, and designing a weld fixture as a function of the set of reaction forces.

摘要翻译： 一种焊接夹具的设计方法。 该方法包括对在待焊接的材料上施加的机械力产生的一组失真进行建模，对被焊接的材料上施加的热力产生的一组变形进行建模，确定一系列位置上的一组反作用力 模拟焊接夹具作为模型变形的函数，并且设计作为一组反作用力的函数的焊接夹具。

公开(公告)号：US20020104872A1

公开(公告)日：2002-08-08

申请号：US10120243

申请日：2002-04-10

发明人： Richard Alden DeFelice ,  Paul A. Sullivan

IPC分类号： B23K031/02 ,  B23K031/12

CPC分类号： H01L23/57 ,  G06F21/86 ,  G11C7/24 ,  H01L2224/05554 ,  H01L2224/16145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2225/06513 ,  H01L2924/01067 ,  H01L2924/10253 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/3025 ,  Y10S257/922 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method and apparatus for protecting the stored information on an integrated circuit from being compromised through reverse engineering. To do so, the method and apparatus splits the functionality of an integrated circuit into two separate integrated circuits, which are then connected in an interlocking manner. A detection circuit monitors the interconnection of the two separate integrated circuits. Upon detection of a break in the interconnection of the two circuits, the detection circuit destroys the data stored in the two separate integrated circuits. The two integrated circuits are connected in a flip-chip fashion, thereby preventing access to the underlying conduction paths and charge storage sites which are normally used in reverse engineering an integrated circuit.