Abstract:
A method of manufacturing an integrated semiconductor device having at least one non-volatile floating gate memory cell and at least one logic transistor. The method includes growing a first gate oxide layer over a silicon substrate, depositing a first polysilicon layer over the first gate oxide layer, selectively etching and removing the first polysilicon layer in order to define the floating gate of the memory cell, introducing dopant in order to obtain source and drain regions of the memory cell, depositing a dielectric layer, selectively etching and removing the dielectric layer and the first polysilicon layer in a region wherein the logic transistor will be formed, depositing a second polysilicon layer, selectively etching and removing the second polysilicon layer in order to define the gate of the logic transistor and the control gate of the memory cell. Between selectively etching the dielectric and depositing a second polysilicon layer, a first sub-step of removing the first gate oxide layer in the region for the logic transistor, and a second sub-step of growing a second oxide gate layer over the region, the second gate oxide layer having a different thickness than the first gate oxide layer.
Abstract:
A process that includes forming a metal layer on top of a wafer of semiconductor material; forming a mask having an appropriate geometry; defining the metal layer to form conductive lines in the metal layer according to the geometry of the mask; forming, on side walls of the mask a polymeric structure; selectively removing the mask; depositing, on the polymeric structure and on the conductive lines, an insulating material. The polymeric structure, made of an inorganic polymer, forms a nullsupporting bridgenull for the insulating material, preventing the latter from depositing in the gaps between the conductive lines. In these conditions, the gap between two adjacent conductive lines is occupied only by air, which has a very low dielectric constant. This results in a reduced capacitive coupling between the lines themselves.
Abstract:
Presented is an EEPROM circuit comprising: a program array of a matrix of EEPROM cells arranged in columns and rows, a data array of a matrix of EEPROM cells arranged in columns and rows, the cells of the program and data array capable of being written, read, and erased; a reference voltage circuit coupled to the program array capable of producing voltages used to write to and erase data from the program array; a current generation circuit coupled to the program array for supplying current to the program array in operation. Advantageously according to the invention, the reference voltage circuit and the current generation circuit are additionally coupled to the data array. Moreover, the EEPROM circuit further comprises means for selectively connecting at least one of the rows of the program array to one of the rows of the data array, and for selectively connecting at least one of the columns of the program array to one of the columns of the data array.
Abstract:
A switching control method for level shifter includes a phase of de-selection of a high voltage value at an output terminal of the shifter using a selection signal. The de-selection phase may include starting the de-selection by bringing the selection signal to a low value; de-activating by way of the selection signal, the generation of a high-voltage signal being supplied to the shifter, and a reference voltage signal; computing the difference between an internal voltage signal of the shifter and the reference voltage signal; generating a control signal when the difference is found to be less than a threshold voltage value; and applying the selection signal to an input terminal of the shifter in the presence of the control signal.
Abstract:
A contact structure for a ferroelectric memory device 13 integrated in a semiconductor substrate and includes an appropriate control circuitry and a matrix array of ferroelectric memory cells, wherein each cell includes a MOS device connected to a ferroelectric capacitor. The MOS device has first and second conduction terminals and is covered with an insulating layer. The ferroelectric capacitor has a lower plate formed on the insulating layer above the first conduction terminals and connected electrically to the latter, which lower plate is covered with a layer of a ferroelectric material and coupled capacitively to an upper plate. Advantageously, the contact structure comprises at least a plurality of plugs filled with a nonconductive material between the first conduction terminals and the ferroelectric capacitor, and comprises a plurality of plugs filled with a conductive material for the second conduction terminals or the control circuitry.
Abstract:
An inductive structure integrated in a semiconductor substrate, comprising at least a conductive element insulated from the substrate, comprising an insulating structure, which is formed inside said semiconductor substrate and built close to said conductor element, so that the resistance of said substrate is increased and the parasitic currents induced by the conductor element in the substrate are decreased. The insulating structure including a plurality of insulating elements each surrounding a respective one of a plurality of semiconductor islands of the substrate.
Abstract:
A word recognition device uses an associative memory to store a plurality of coded words in such a way that a weight is associated with each character of the alphabet of the stored words, wherein equal weights correspond to equal characters. To perform the recognition, a dictionary of words is first chosen; this is stored in the associative memory according to a pre-determined code; a string of characters which correspond to a word to be recognized is received; a sequence of weights corresponding to the string of characters received is supplied to the associative memory; the distance between the word to be recognized and at least some of the stored words is calculated in parallel as the sum of the difference between the weights of each character of the word to be recognized and the weights of each character of the stored words; the minimum distance is identified; and the word stored in the associative memory having the minimum distance is stored.
Abstract:
A non-volatile memory matrix architecture, having a virtual ground monolithically integrated on a semiconductor substrate, includes a plurality of memory cells organized into matrix blocks. The matrix blocks are placed on rows and columns and are associated with respective row and column decoding circuits. The memory blocks are separated from each other by at least one insulation stripe which is parallel to the columns. The non-volatile memory matrix architecture further includes a pass-transistor decoding circuit with a number of levels corresponding to the number of rows to select.
Abstract:
A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of each pin is also covered, as well as other surfaces of the frame, by a coating layer or multilayer of metals different from the metal of the die stamped frame. The coating layer or multilayer contains at least on its outer surface, a noble metal such as palladium or gold. The tip of the pins are not subject to cutting and/or trimming after plating the die stamped frame. The pins are not even cut or trimmed during separation of the patterned frame from the surrounding metal at the end of the encapsulation process, when the pins are then eventually bent into shape.
Abstract:
A feedback control circuit is for the current in a load formed by a winding in series with a current sensing resistor, coupled to a full-bridge output stage, an amplifier coupled to the terminals of the sensing resistor, and a controller fed with the output of the amplifier and with a voltage reference and producing a correction signal. The circuit has a PWM converter for generating a pair of control signals. The PWM converter includes an up/down counter producing a count value and logic circuitry that produces the twos-complement of the correction signal. A pair of registers are coupled to the outputs of the controller and of the logic circuitry. A first comparator coupled to the outputs of the counter and of the first register produces the first control signal, if the count signal exceeds the value stored in the first register. A second comparator coupled to the counter and to the second register produces the second control signal, if the count signal overcomes the value stored in the second register.