Abstract:
A method is provided for controlling a converter of the multiphase interleaving type. According to the method, there is detected when a change of the load applied to an output terminal of the converter occurs by detecting the derivative of a voltage signal of the output terminal. All the phases of the converter are simultaneously driven by zeroing a driving interleaving phase shift on the basis of the detected load transient, and the driving interleaving phase shift is recovered to restart a normal operation of the converter. A controller for carrying out such a method is also provided.
Abstract:
A method is provided for controlling a converter of the multiphase interleaving type. According to the method, there is detected when a change of the load applied to an output terminal of the converter occurs. All the phases of the converter are simultaneously turned off, and a driving interleaving phase shift is recovered so as to restart a normal operation of the converter. A controller for carrying out such a method is also provided.
Abstract:
A device of a plug-and-play type, which can be integrated in a home network having at least one audio-video Media-Server device or else at least one audio-video Media-Renderer device. The device can be activated for selectively configuring parameters and devices for setting up audio-video calls for connection between the home network and a packet network, such as the Internet. Preferentially, the device is based upon UPnP (Universal Plug-and-Play) technology and uses either a signaling protocol on IP packet network, such as the Session Initiation Protocol (SIP) and ITU-T H.323, or else mobile communications systems, such as the Universal Mobile Telecommunications System (UMTS). The device is able to redirect audio-video streams in the context of a plurality of devices capable of reproducing them and/or to selectively acquire said audio-video streams from a plurality of devices capable of supplying them.
Abstract:
An integrated transistor device is formed in a chip of semiconductor material having an electrical-insulation region delimiting an active area accommodating a bipolar transistor of vertical type and a MOSFET of planar type, contiguous to one another. The active area accommodates a collector region; a bipolar base region contiguous to the collector region; an emitter region within the bipolar base region; a source region, arranged at a distance from the bipolar base region; a drain region; a channel region arranged between the source region and the drain region; and a well region. The drain region and the bipolar base region are contiguous and form a common base structure shared by the bipolar transistor and the MOSFET. Thereby, the integrated transistor device has a high input impedance and is capable of driving high currents, while only requiring a small integration area.
Abstract:
A memory architecture includes a memory including a Command Set, and a serial peripheral interface (SPI) for connecting the memory to a generic host device. The SPI includes a data in line for supplying output data from the host device to inputs of the memory; a data out line for supplying output data from the memory to input of the host device; a clock line driven by the host device; and an enable line that allows the memory to be turned on and off by the host device. The memory is a NAND Flash Memory. The SPI includes an I/O registers block, including an SPI label register and a data register for driving separately data, commands and addresses directed to the memory from the corresponding SPI label registers.
Abstract:
A control device for a switching converter has an input terminal and an output terminal; the converter includes a half-bridge of a first and a second transistor coupled between the input terminal and a reference voltage. The control device detects a signal on the output terminal of the converter, integrates the detected signal and imposes a predefined minimum frequency of the detected signal. The control device regulates the average value of the detected signal by comparison with a reference signal and drives the first and second transistors in during the regulation. The control device turns off an integrator when the predefined minimum frequency is imposed.
Abstract:
An embodiment of the present invention relates to a alignment measurement system for measuring alignment between a plurality of chips of a device, the chips being assembled in a three-dimensional stacking configuration and equipped with at least an integrated capacitive sensor, comprising a multiple-capacitor structure integrated in said capacitive sensor, at least a sensing circuit connected to said multiple-capacitor structure which issues an output voltage, proportional to a variation of a capacitive value of the multiple-capacitor structure of the integrated capacitive sensor of the device and corresponding to a measured misalignment between the chips of the device.
Abstract:
A method realizes an electric connection between a nanometric circuit and standard electronic components. The method includes: providing, above a semiconductor substrate, a seed having a notched wall substantially perpendicular to the substrate, the wall having n recesses spaced apart from one another; and realizing n conductive nanowires alternated with insulating nanowires. Each realization of a conductive nanowire fills a corresponding recess by a respective elbow-like portion of the conductive nanowire, and partially fills the other recesses by respective notched profile portions, thereby forming the nanometric circuit. The method forms, above the nanometric circuit, an insulating layer; opens, in the insulating layer, n windows respectively corresponding with the recesses, thereby exposing the respective elbow-like portions; and realizes, above the insulating layer, n conductive dies addressed towards the standard electronic components and respectively overlapping the windows, thereby forming n contacts realizing the electric connection.
Abstract:
A memory includes a phase change memory element having a memory layer of a calcogenide material and a glue layer of an alloy of the form TiaXbNc where X is selected in the group comprising silicon, aluminum, carbon, or boron, and c may be 0. The nitrogen and silicon are adapted to reduce the diffusion of titanium toward the chalcogenide layer.
Abstract translation:存储器包括相变存储元件,该相变存储元件具有硫化物质材料的存储层和形式为Ti x N b N c C的合金的胶层, / SUB>其中X选自硅,铝,碳或硼,c可以为0.氮和硅适于减少钛向硫族化物层的扩散。
Abstract:
An array of non-volatile memory cells includes a row with N cells and M cells. In a partial-storage step, a datum is stored in a first portion of the N cells of the row. A second portion of the N cells of the row are in an “erase” state. A first error correction code associated with the datum is stored in the M cells along with a first enable bit or guard-cell which is indicative of whether the first error correction code is active. The number of M cells, adjacent to the N cells of the row, is defined on the basis of the number N of cells. In the event the datum stored in the first portion of the N cells of the row is subsequently updated or manipulated, a second error correction code associated with the updated or manipulated datum is determined and stored in the second portion of the N cells of the row along with a second enable bit or guard-cell which is indicative of whether the second error correction code is active. At that point, the first enable bit or guard-cell is modified to indicate that the first error correction code is not active.