MULTI-DIMENSIONAL ION MOBILITY SPECTROMETRY METHODS AND APPARATUS
    41.
    发明申请
    MULTI-DIMENSIONAL ION MOBILITY SPECTROMETRY METHODS AND APPARATUS 有权
    多维离子移动光谱测定方法和装置

    公开(公告)号:US20120126109A1

    公开(公告)日:2012-05-24

    申请号:US13360760

    申请日:2012-01-29

    Applicant: Ching Wu

    Inventor: Ching Wu

    CPC classification number: G01N27/622

    Abstract: Various embodiments of a multi-dimensional ion mobility analyzer are disclosed that have more than one drift chamber and can acquire multi-dimensional ion mobility profiles of substances. The drift chambers of this device can, for example, be operated under independent operational conditions to separate charged particles based on their distinguishable chemical/physical properties. The first dimension drift chamber of this device can be used either as a storage device, a reaction chamber, and/or a drift chamber according to the operational mode of the analyzer. Also presented are various methods of operating an ion mobility spectrometer including, but not limited to, a continuous first dimension ionization methods that can enable ionization of all chemical components in the sample regardless their charge affinity.

    Abstract translation: 公开了具有多于一个漂移室的多维离子迁移率分析仪的各种实施方案,并且可以获得物质的多维离子迁移谱。 该装置的漂移室可以例如在独立操作条件下操作,以根据其可区分的化学/物理性质分离带电粒子。 该装置的第一尺寸漂移室可以根据分析仪的操作模式用作存储装置,反应室和/或漂移室。 还提出了操作离子迁移谱仪的各种方法,包括但不限于连续的第一维电离方法,其能够使得样品中的所有化学组分电离,而不管其电荷亲和力如何。

    MEMS Sensor Package
    43.
    发明申请
    MEMS Sensor Package 审中-公开
    MEMS传感器封装

    公开(公告)号:US20120056280A1

    公开(公告)日:2012-03-08

    申请号:US12910394

    申请日:2010-10-22

    Abstract: A MEMS sensor package includes a support and a MEMS sensor chip having a mounting side adhered on the support by a point-shaped adhesive or a linear-shaped adhesive in such a way that the MEMS sensor chip has a free side opposite to the mounting and suspended above the support. Because the MEMS sensor chip has the free side that is not restrained on the support, the stress due to deformation of the support will not affect the accuracy of the MEMS sensor chip.

    Abstract translation: MEMS传感器封装包括支撑件和MEMS传感器芯片,其具有通过点状粘合剂或线状粘合剂粘附在支撑体上的安装侧,使得MEMS传感器芯片具有与安装相对的自由侧, 悬挂在支撑上方。 由于MEMS传感器芯片具有不受限于支撑件的自由侧,因此支撑件变形引起的应力不会影响MEMS传感器芯片的精度。

    Evaluation Device and Method for Providing a Transceiver System with Performance Information Thereof
    45.
    发明申请
    Evaluation Device and Method for Providing a Transceiver System with Performance Information Thereof 有权
    用于提供其性能信息的收发器系统的评估装置和方法

    公开(公告)号:US20110319033A1

    公开(公告)日:2011-12-29

    申请号:US12952691

    申请日:2010-11-23

    CPC classification number: H04B17/3911 H04B17/29

    Abstract: An evaluation device is adapted for providing a transceiver system with performance information thereof. The transceiver system models a channel between a transmitter and a receiver thereof using Nakagami distribution with a fading parameter. The evaluation device includes a threshold value computing module, a signal-to-noise ratio (SNR) setting module, a probability computing module, and an output module. The threshold value computing module is operable to compute a threshold value based upon a given capacity. The SNR setting module is operable to set an average SNR for the channel between the transmitter and the receiver of the transceiver system. The probability computing module is operable, based upon the fading parameter, the average SNR and the threshold value, to compute an outage probability of the transceiver system corresponding to the given capacity. The output module is operable to provide the transceiver system with the average SNR and the outage probability.

    Abstract translation: 评估装置适于向收发器系统提供其性能信息。 收发机系统使用具有衰落参数的Nakagami分布来对发射机和接收机之间的信道建模。 评估装置包括阈值计算模块,信噪比(SNR)设置模块,概率计算模块和输出模块。 阈值计算模块可操作以基于给定的容量来计算阈值。 SNR设置模块可操作以设置收发器系统的发射机和接收机之间的信道的平均SNR。 概率计算模块可基于衰落参数,平均SNR和阈值来操作,以计算对应于给定容量的收发器系统的中断概率。 输出模块可操作以向收发器系统提供平均SNR和中断概率。

    Yield evaluating apparatus and method thereof
    46.
    发明授权
    Yield evaluating apparatus and method thereof 有权
    产量评价装置及其方法

    公开(公告)号:US08051394B2

    公开(公告)日:2011-11-01

    申请号:US12264227

    申请日:2008-11-03

    CPC classification number: G06F17/5081 G06F2217/10

    Abstract: A yield evaluating apparatus and a method thereof are provided. The yield evaluating apparatus includes a spatial correlation module. The spatial correlation module receives at least one process-related data and a plurality of circuit layouts and obtains a correlation coefficient between unit elements in the circuit layouts according to the process-related data. The spatial correlation module calculates a spatial correlation between elements in each of the circuit layouts according to the correlation coefficient and selects one of the circuit layouts according to the spatial correlations.

    Abstract translation: 提供了一种产量评估装置及其方法。 产量评估装置包括空间相关模块。 空间相关模块接收至少一个处理相关数据和多个电路布局,并且根据处理相关数据获得电路布局中单元元件之间的相关系数。 空间相关模块根据相关系数计算每个电路布局中的元件之间的空间相关性,并根据空间相关性选择一个电路布局。

    MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME
    47.
    发明申请
    MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAME 审中-公开
    微电子机电传感器装置及其制造方法

    公开(公告)号:US20110140210A1

    公开(公告)日:2011-06-16

    申请号:US12834386

    申请日:2010-07-12

    Abstract: A microelectromechanical sensor device package includes a substrate, a microelectromechanical sensor device and a cap. The substrate has a surface on which a circuit pattern having a plurality of first conductive contacts is provided. The device is mounted on the surface of the substrate and has an active surface on which a plurality of second conductive contacts are provided. A plurality of bonding wires are used to electrically connect the first conductive contacts to the second conductive contacts respectively. The cap is made of an electrically insulating material and attached on the surface of the substrate in a way that the cap covers the microelectromechanical sensor device and a space is formed between the cap and the microelectromechanical sensor device.

    Abstract translation: 微机电传感器装置封装包括基板,微机电传感器装置和盖。 衬底具有其上设置有具有多个第一导电触点的电路图案的表面。 该装置安装在基板的表面上并且具有一个有效表面,多个第二导电触点设置在该有源表面上。 多个接合线用于将第一导电触点分别电连接到第二导电触头。 盖由电绝缘材料制成,并以盖子覆盖微机电传感器装置并且在盖和微机电传感器装置之间形成空间的方式附着在基板的表面上。

    Practical ion mobility spectrometer apparatus and methods for chemical and/or biological detection
    48.
    发明授权
    Practical ion mobility spectrometer apparatus and methods for chemical and/or biological detection 有权
    实际的离子迁移光谱仪装置和化学和/或生物检测方法

    公开(公告)号:US07943901B2

    公开(公告)日:2011-05-17

    申请号:US11946679

    申请日:2007-11-28

    Applicant: Ching Wu

    Inventor: Ching Wu

    CPC classification number: G01N27/622 H01J49/004

    Abstract: This invention describes an ion mobility spectrometer system for chemical detection in the field. The system allows: a high throughput operation, an interface to new ionization methods, and an interface to a mass spectrometer.

    Abstract translation: 本发明描述了一种用于现场化学检测的离子迁移谱仪系统。 该系统允许:高通量操作,与新离子化方法的接口以及与质谱仪的接口。

    Lamp driving structure for backlight module
    49.
    发明授权
    Lamp driving structure for backlight module 失效
    背光模组的灯驱动结构

    公开(公告)号:US07884796B2

    公开(公告)日:2011-02-08

    申请号:US11852385

    申请日:2007-09-10

    CPC classification number: H05B41/2824 Y02B20/186

    Abstract: A lamp driving structure for backlight module includes a backlight module implemented for disposing a first circuit board and a second circuit board thereon, the first circuit board couples with the second circuit board through a transmission line; the structure further includes at least a square wave controller, two square wave switches, a mutually coupled transformer, a plurality of driving transformers and a plurality of connectors disposed selectively on the first circuit board and the second circuit board, thereby reducing the number of driving transformers and connectors and the area of circuit boards to further reduce the manufacturing cost of the lamp driving device.

    Abstract translation: 一种用于背光模组的灯驱动结构包括:一个实现用于在其上设置第一电路板和第二电路板的背光模块,第一电路板通过传输线与第二电路板耦合; 该结构还包括至少一个方波控制器,两个方波开关,相互耦合的变压器,多个驱动变压器和选择性地布置在第一电路板和第二电路板上的多个连接器,从而减少驱动次数 变压器和连接器以及电路板的面积,以进一步降低灯驱动装置的制造成本。

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