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    FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
    41.
    发明申请
    FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE 审中-公开

    公开(公告)号：US20190304877A1

    公开(公告)日：2019-10-03

    申请号：US16461949

    申请日：2017-11-17

    Applicant: SAMTEC INC.

    Inventor： Tim MOBLEY ,  Roupen Leon KEUSSEYAN

    IPC: H01L23/48 ,  H01L23/498 ,  H01L23/15

    Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

    CAGE WITH AN ATTACHED HEATSINK
    42.
    发明申请
    CAGE WITH AN ATTACHED HEATSINK 审中-公开

    公开(公告)号：US20190239392A1

    公开(公告)日：2019-08-01

    申请号：US15929123

    申请日：2019-04-11

    Applicant: Samtec, Inc.

    Inventor： Thomas A. HALL, III ,  Kevin R. MEREDITH

    IPC: H05K7/20 ,  G02B6/42

    CPC classification number: H05K7/20418 ,  G02B6/42 ,  H05K7/2049

    Abstract: A transceiver assembly includes a cage and a heatsink. The cage includes first and second spaced apart walls and a third wall that spans the first and second walls. The third wall defines an opening, and the third wall includes two spring arms that each extend into the opening. The heatsink includes a heatsink body including a first surface and a protrusion that extends from the first surface of the heatsink body and a pair of spring-arm receivers positioned on the first surface of the heatsink body. Each of the pair of spring-arm engagement portions is configured to engage with a corresponding one of the two spring arms of the cage when the heatsink is attached to the cage.

    Cage with an attached heatsink
    43.
    发明授权
    Cage with an attached heatsink 有权

    公开(公告)号：US10306806B2

    公开(公告)日：2019-05-28

    申请号：US15866967

    申请日：2018-01-10

    Applicant: Samtec, Inc.

    Inventor： Thomas A. Hall, III ,  Kevin R. Meredith

    IPC: H05K7/20 ,  G02B6/42

    Abstract: A transceiver assembly includes a cage and a heatsink. The cage includes first and second spaced apart walls and a third wall that spans the first and second walls. The third wall defines an opening, and the third wall includes two spring arms that each extend into the opening. The heatsink includes a heatsink body including a first surface and a protrusion that extends from the first surface of the heatsink body and a pair of spring-arm receivers positioned on the first surface of the heatsink body. Each of the pair of spring-arm engagement portions is configured to engage with a corresponding one of the two spring arms of the cage when the heatsink is attached to the cage.

    OPTICAL BLOCK WITH TEXTURED SURFACE
    47.
    发明申请
    OPTICAL BLOCK WITH TEXTURED SURFACE 审中-公开
    具有纹理表面的光学块

    公开(公告)号：US20160282572A1

    公开(公告)日：2016-09-29

    申请号：US15078162

    申请日：2016-03-23

    Applicant: Samtec, Inc.

    Inventor： Jignesh H. SHAH ,  William J. KOZLOVSKY ,  David A. LANGSAM ,  Raymond J. LEE ,  R. Brad BETTMAN ,  Eric Jean ZBINDEN

    IPC: G02B6/42 ,  G02B5/02

    CPC classification number: G02B6/4206 ,  G02B6/4214 ,  G02B6/4257

    Abstract: An optical block includes a first surface that receives light entering the optical block, a second surface through which the light exits the optical block, and a reflector that reflects light from the first surface towards the second surface. The reflector includes a textured surface that scatters or absorbs some of the light received from the first surface to attenuate the light exiting the optical block through the second surface.

    Abstract translation: 光学块包括接收进入光学块的光的第一表面，光离开光学块的第二表面，以及将来自第一表面的光朝向第二表面反射的反射器。 反射器包括纹理表面，其散射或吸收从第一表面接收的一些光，以衰减通过第二表面离开光学块的光。

    OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP
    48.
    发明申请
    OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP 审中-公开
    光学模块，包括硅胶片和耦合芯片

    公开(公告)号：US20160266322A1

    公开(公告)日：2016-09-15

    申请号：US15067542

    申请日：2016-03-11

    Applicant: Samtec, Inc.

    Inventor： Marc EPITAUX ,  Joshua Rajiv CORNELIUS ,  John L. NIGHTINGALE

    IPC: G02B6/30 ,  G02B6/42 ,  G02B6/12

    CPC classification number: G02B6/4292 ,  G02B6/12007 ,  G02B6/1228 ,  G02B6/124 ,  G02B6/138 ,  G02B6/2938 ,  G02B6/3652 ,  G02B6/4214 ,  G02B6/428

    Abstract: An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.

    Abstract translation: 光学模块包括传输光信号的波导互连; 调制光信号的硅光子芯片，检测光信号，或调制并检测光信号; 连接到硅光子芯片和波导互连的耦合器芯片，使得光信号沿着硅光子芯片和波导互连之间的光路传输; 并且其中一个硅光子芯片和耦合器芯片包括第一，第二和第三对准突起。 耦合器芯片和硅光子芯片中的另一个包括点接触，线性接触和平面接触。 点接触不提供第一对准突起的移动。 线性接触为第二对准突起提供线性运动。 平面接触为第三对准突起提供平面运动。

    EDGECARD CONNECTOR WITH COMMON-END DATUM TO REDUCE MISALIGNMENT TOLERANCES
    50.
    发明申请
    EDGECARD CONNECTOR WITH COMMON-END DATUM TO REDUCE MISALIGNMENT TOLERANCES 有权
    带有通用端口的EDGECARD连接器，以减少MISALIGNMENT公差

    公开(公告)号：US20160056562A1

    公开(公告)日：2016-02-25

    申请号：US14463721

    申请日：2014-08-20

    Applicant: Samtec, Inc.

    Inventor： John Allen MONGOLD ,  Brian R. VICICH ,  Donald Christopher KNOWLDEN

    IPC: H01R12/91 ,  H01R12/72

    CPC classification number: H01R12/91

    Abstract: A connector includes a body, a slot within the body configured to receive a substrate and including a first end and a second end, contacts arranged along the slot between the first end and the second end, and a biasing mechanism arranged at the first end to align the substrate as the substrate is inserted into the slot so that substrate is in contact with the second end when the substrate is fully inserted into the slot.

    Abstract translation: 连接器包括主体，主体内的狭槽，构造成接收基板并且包括第一端和第二端，沿着第一端和第二端之间的槽布置的接触件，以及偏置机构，其布置在第一端 当衬底被插入槽中时，对准衬底，使得当衬底完全插入槽中时，衬底与第二端接触。

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