公开(公告)号：US08394716B2

公开(公告)日：2013-03-12

申请号：US12963241

申请日：2010-12-08

申请人： Sung-Min Hwang ,  Hansoo Kim ,  Wonseok Cho ,  Jaehoon Jang

发明人： Sung-Min Hwang ,  Hansoo Kim ,  Wonseok Cho ,  Jaehoon Jang

IPC分类号： H01L21/44

CPC分类号： H01L21/768 ,  H01L23/5226 ,  H01L27/11526 ,  H01L27/11548 ,  H01L27/11551 ,  H01L27/11556 ,  H01L2924/0002 ,  H01L2924/00

摘要： A three-dimensional semiconductor device may include a substrate including wiring and contact regions and a thin film structure on the wiring and contact regions of the substrate. The thin-film structure may include a plurality of alternating wiring layers and inter-layer insulating layers defining a terraced structure in the contact region so that each of the wiring layers includes a contact surface in the contact region that extends beyond others of the wiring layers more distant from the substrate. A plurality of contact structures may extend in a direction perpendicular to a surface of the substrate with each of the contact structures being electrically connected to a contact surface of a respective one of the wiring layers. Related methods are also discussed.

摘要翻译： 三维半导体器件可以包括在基板的布线和接触区域上包括布线和接触区域以及薄膜结构的基板。 薄膜结构可以包括在接触区域中限定梯形结构的多个交替布线层和层间绝缘层，使得每个布线层包括在接触区域中延伸超过其它布线层的接触表面 离衬底更远。 多个接触结构可以在垂直于衬底的表面的方向上延伸，其中每个接触结构电连接到相应的一个接线层的接触表面。 还讨论了相关方法。

公开(公告)号：US08362514B2

公开(公告)日：2013-01-29

申请号：US12943603

申请日：2010-11-10

申请人： Sung Min Hwang

发明人： Sung Min Hwang

IPC分类号： H01L27/15

CPC分类号： H01L33/44 ,  H01L27/15 ,  H01L33/0004 ,  H01L33/145 ,  H01L33/22 ,  H01L33/38 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12032 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A light emitting device is provided. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a first dielectric layer over a part of an upper surface of the light emitting structure, and a pad electrode over the first dielectric layer.

摘要翻译： 提供了一种发光器件。 发光器件包括发光结构，其包括第一导电半导体层，有源层和第二导电半导体层，在发光结构的上表面的一部分上的第一电介质层，以及位于 第一电介质层。

公开(公告)号：US08314422B2

公开(公告)日：2012-11-20

申请号：US12945409

申请日：2010-11-12

申请人： Sung Min Hwang

发明人： Sung Min Hwang

IPC分类号： H01L29/40 ,  H01L29/88

CPC分类号： H01L27/15 ,  H01L33/145 ,  H01L33/382 ,  H01L33/405 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device is provided. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a first dielectric layer over a cavity where a part of the light emitting structure is removed, a second electrode layer over the first dielectric layer, a second dielectric layer over the light emitting structure above the cavity, and a first electrode over the second dielectric layer.

摘要翻译： 提供了一种发光器件。 发光器件包括发光结构，其包括第一导电半导体层，有源层和第二导电半导体层，在去除发光结构的一部分的空腔上的第一电介质层， 第一电介质层，位于空腔上方的发光结构上的第二电介质层和位于第二介电层上的第一电极。

公开(公告)号：US20120091497A1

公开(公告)日：2012-04-19

申请号：US13330207

申请日：2011-12-19

申请人： Sung Min Hwang

发明人： Sung Min Hwang

IPC分类号： H01L33/02

CPC分类号： H01L33/14 ,  H01L27/15 ,  H01L33/0033 ,  H01L33/025 ,  H01L33/32 ,  H01L33/40 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12032 ,  H01L2924/00014 ,  H01L2924/00

摘要： Embodiments relate to a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises: a substrate; a light emitting structure over the substrate, the light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, wherein the first conductive type semiconductor layer is partially exposed; a first region having a first concentration and provided at a region of the second conductive type semiconductor layer; a second region having a second concentration and provided at another region of the second conductive type semiconductor layer; and a second electrode over the second conductive type semiconductor layer.

摘要翻译： 实施例涉及发光器件，发光器件封装和照明系统。 发光器件包括：衬底; 在所述基板上的发光结构，所述发光结构包括第一导电类型半导体层，第二导电类型半导体层和在所述第一导电类型半导体层和所述第二导电类型半导体层之间的有源层，其中所述第一导电 半导体层部分露出; 具有第一浓度并设置在所述第二导电型半导体层的区域的第一区域; 具有第二浓度并设置在所述第二导电类型半导体层的另一区域的第二区域; 以及位于第二导电类型半导体层上的第二电极。

公开(公告)号：US20120028090A1

公开(公告)日：2012-02-02

申请号：US13132767

申请日：2011-03-11

申请人： Oh Kyung-Su ,  Cha-Hun Ku ,  Yong-Su Choi ,  Sung-Jong Kim ,  Jung-Ah Lee ,  Jae-Dong Chang ,  Dong-Myung Kim ,  Jun-Yong Jeong ,  Sung-Min Hwang ,  Do-Gyun Kim ,  Sang-Bong Nam

发明人： Oh Kyung-Su ,  Cha-Hun Ku ,  Yong-Su Choi ,  Sung-Jong Kim ,  Jung-Ah Lee ,  Jae-Dong Chang ,  Dong-Myung Kim ,  Jun-Yong Jeong ,  Sung-Min Hwang ,  Do-Gyun Kim ,  Sang-Bong Nam

IPC分类号： H01M2/08 ,  H01M10/00 ,  H01M2/12

CPC分类号： H01M2/0413 ,  H01M2/1241 ,  H01M10/425

摘要： A secondary battery includes an electrode assembly in which a cathode plate and an anode plate are arranged with a separator being interposed therebetween, a case in which the electrode assembly is received, a cap assembly capable of sealing an open end of the case, a gasket interposed between the case and the cap assembly, and a leakage prevention portion formed at one surface of the gasket and/or one surface of the cap assembly, which is oriented toward the electrode assembly and contacted with the gasket.

摘要翻译： 二次电池包括电极组件，其中阴极板和阳极板布置有隔着隔板的电极组件，容纳电极组件的壳体，能够密封壳体的开口端的盖组件，垫圈 插入在壳体和盖组件之间，以及形成在垫圈的一个表面和/或盖组件的一个表面上的防漏部分，其朝向电极组件定向并与垫圈接触。

公开(公告)号：US20110248300A1

公开(公告)日：2011-10-13

申请号：US12945409

申请日：2010-11-12

申请人： Sung Min HWANG

发明人： Sung Min HWANG

IPC分类号： H01L33/48 ,  H01L33/60

CPC分类号： H01L27/15 ,  H01L33/145 ,  H01L33/382 ,  H01L33/405 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device is provided. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a first dielectric layer over a cavity where a part of the light emitting structure is removed, a second electrode layer over the first dielectric layer, a second dielectric layer over the light emitting structure above the cavity, and a first electrode over the second dielectric layer.

摘要翻译： 提供了一种发光器件。 发光器件包括发光结构，其包括第一导电半导体层，有源层和第二导电半导体层，在去除发光结构的一部分的空腔上的第一电介质层， 第一电介质层，位于空腔上方的发光结构上的第二电介质层和位于第二介电层上的第一电极。

公开(公告)号：US20110233602A1

公开(公告)日：2011-09-29

申请号：US13028808

申请日：2011-02-16

申请人： Sung Min HWANG

发明人： Sung Min HWANG

IPC分类号： H01L33/42 ,  H01L33/40

CPC分类号： H01L33/14 ,  H01L27/15 ,  H01L33/387 ,  H01L33/40 ,  H01L2224/48091 ,  H01L2924/12032 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a substrate; a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, which are formed on the substrate such that a part of the first conductive semiconductor layer is exposed upward; schottky contact regions on the second conductive semiconductor layer; a second electrode on the second conductive semiconductor layer; and a first electrode on the exposed first conductive semiconductor layer, wherein a distance between the schottky contact regions narrowed as the schottky contact regions are located closely to a mesa edge region.

摘要翻译： 公开了一种发光器件，发光器件封装和照明系统。 发光器件包括衬底; 形成在基板上的发光结构，其包括第一导电半导体层，有源层和第二导电半导体层，使得第一导电半导体层的一部分向上露出; 第二导电半导体层上的肖特基接触区域; 在所述第二导电半导体层上的第二电极; 以及在所述暴露的第一导电半导体层上的第一电极，其中所述肖特基接触区域之间的距离随着所述肖特基接触区域紧密地位于台面边缘区域而变窄。

公开(公告)号：US20110233515A1

公开(公告)日：2011-09-29

申请号：US13026384

申请日：2011-02-14

申请人： Sung Min Hwang

发明人： Sung Min Hwang

IPC分类号： H01L33/06 ,  H01L33/48

CPC分类号： H01L33/38 ,  H01L27/15 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate; a light emitting structure including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, which are formed on the substrate such that a part of the first conductive semiconductor layer is exposed; a dielectric layer formed from a top surface of the second conductive semiconductor layer to an exposed top surface of the first conductive semiconductor layer; a second electrode on the second conductive semiconductor layer; and a first electrode on the exposed top surface of the first conductive semiconductor layer while making contact with a part of the dielectric layer on the second conductive semiconductor layer.

摘要翻译： 公开了一种发光器件，发光器件封装和照明系统。 发光装置包括：基板; 形成在所述基板上的第一导电半导体层，有源层和第二导电半导体层的发光结构，使得所述第一导电半导体层的一部分露出; 电介质层，由所述第二导电半导体层的顶表面形成到所述第一导电半导体层的暴露的顶表面; 在所述第二导电半导体层上的第二电极; 以及在第一导电半导体层的暴露的顶表面上与第二导电半导体层上的介电层的一部分接触的第一电极。

公开(公告)号：US20110180941A1

公开(公告)日：2011-07-28

申请号：US13012485

申请日：2011-01-24

申请人： Sung-Min Hwang ,  Hansoo Kim ,  Wonseok Cho ,  Jaehoon Jang

发明人： Sung-Min Hwang ,  Hansoo Kim ,  Wonseok Cho ,  Jaehoon Jang

IPC分类号： H01L23/52 ,  H01L21/28

CPC分类号： H01L21/768 ,  H01L27/11575 ,  H01L27/11578 ,  H01L27/11582

摘要： Provided is a three-dimensional semiconductor device and method for fabricating the same. The device includes a first electrode structure and a second electrode structure stacked sequentially on a substrate. The first and second electrode structures include stacked first electrodes and stacked second electrodes, respectively. Each of the first and second electrodes includes a horizontal portion parallel with the substrate and an extension portion extending from the horizontal portion along a direction penetrating an upper surface of the substrate. Here, the substrate may be closer to top surfaces of the extension portions of the first electrodes than to the horizontal portion of at least one of the second electrodes.

摘要翻译： 提供一种三维半导体器件及其制造方法。 该装置包括依次堆叠在基板上的第一电极结构和第二电极结构。 第一和第二电极结构分别包括堆叠的第一电极和堆叠的第二电极。 第一和第二电极中的每一个包括平行于基板的水平部分和从穿过基板的上表面的方向从水平部分延伸的延伸部分。 这里，衬底可以比第一电极的延伸部分的顶表面更靠近至少一个第二电极的水平部分。

公开(公告)号：US20110095306A1

公开(公告)日：2011-04-28

申请号：US12909184

申请日：2010-10-21

申请人： Sung Min Hwang ,  Hyun Don Song

发明人： Sung Min Hwang ,  Hyun Don Song

IPC分类号： H01L33/00

CPC分类号： H01L33/38 ,  H01L33/22 ,  H01L2224/48091 ,  H01L2933/0091 ,  H01L2924/00014

摘要： Disclosed are a light emitting device, a light emitting device package and a lighting system. The light emitting device of the embodiment includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a second electrode under the second conductive semiconductor layer; a first texture over a first region of the first conductive semiconductor layer; an A-electrode over the first region of the first conductive semiconductor layer; and a B-electrode over a second region of the first conductive semiconductor layer, wherein the B-electrode includes a pad electrode connected to a wire.

摘要翻译： 公开了一种发光器件，发光器件封装和照明系统。 本实施例的发光器件包括发光结构，其包括第一导电半导体层，第二导电半导体层和在第一和第二导电半导体层之间的有源层; 在第二导电半导体层下方的第二电极; 在所述第一导电半导体层的第一区域上的第一纹理; 在所述第一导电半导体层的所述第一区域上方的A电极; 以及在所述第一导电半导体层的第二区域上的B电极，其中所述B电极包括连接到导线的焊盘电极。