THIN FILM TRANSISTOR SUBSTRATE, DISPLAY DEVICE HAVING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY DEVICE
    41.
    发明申请
    THIN FILM TRANSISTOR SUBSTRATE, DISPLAY DEVICE HAVING THE SAME AND METHOD OF MANUFACTURING THE DISPLAY DEVICE 有权
    薄膜晶体管基板,具有该基板的显示装置和制造显示装置的方法

    公开(公告)号:US20120003769A1

    公开(公告)日:2012-01-05

    申请号:US13233399

    申请日:2011-09-15

    CPC classification number: H01L29/7869 H01L27/1225

    Abstract: A thin film transistor substrate includes an insulating plate; a gate electrode disposed on the insulating plate; a semiconductor layer comprising a metal oxide, wherein the metal oxide has oxygen defects of less than or equal to 3%, and wherein the metal oxide comprises about 0.01 mole/cm3 to about 0.3 mole/cm3 of a 3d transition metal; a gate insulating layer disposed between the gate electrode and the semiconductor layer; and a source electrode and a drain electrode disposed on the semiconductor layer. Also described is a display substrate. The metal oxide has oxygen defects of less than or equal to 3%, and is doped with about 0.01 mole/cm3 to about 0.3 mole/cm3 of 3d transition metal. The metal oxide comprises indium oxide or titanium oxide. The 3d transition metal includes at least one 3d transition metal selected from the group consisting of chromium, cobalt, nickel, iron, manganese, and mixtures thereof.

    Abstract translation: 薄膜晶体管基板包括绝缘板; 设置在绝缘板上的栅电极; 包含金属氧化物的半导体层,其中所述金属氧化物具有小于或等于3%的氧缺陷,并且其中所述金属氧化物包含约0.01mol / cm 3至约0.3mol / cm 3的3d过渡金属; 设置在所述栅极电极和所述半导体层之间的栅极绝缘层; 以及设置在半导体层上的源电极和漏电极。 还描述了显示基板。 金属氧化物具有小于或等于3%的氧缺陷,并且掺杂有约0.01摩尔/ cm3至约0.3摩尔/ cm3的3d过渡金属。 金属氧化物包括氧化铟或二氧化钛。 3d过渡金属包括选自铬,钴,镍,铁,锰及其混合物中的至少一种3d过渡金属。

    Thin film transistor substrate, display device having the same and method of manufacturing the display device
    44.
    发明授权
    Thin film transistor substrate, display device having the same and method of manufacturing the display device 有权
    薄膜晶体管基板,具有相同的显示装置和制造显示装置的方法

    公开(公告)号:US08035100B2

    公开(公告)日:2011-10-11

    申请号:US12197573

    申请日:2008-08-25

    CPC classification number: H01L29/7869 H01L27/1225

    Abstract: A thin film transistor substrate includes an insulating plate; a gate electrode disposed on the insulating plate; a semiconductor layer comprising a metal oxide, wherein the metal oxide has oxygen defects of less than or equal to 3%, and wherein the metal oxide comprises about 0.01 mole/cm3 to about 0.3 mole/cm3 of a 3d transition metal; a gate insulating layer disposed between the gate electrode and the semiconductor layer; and a source electrode and a drain electrode disposed on the semiconductor layer. Also described is a display substrate. The metal oxide has oxygen defects of less than or equal to 3%, and is doped with about 0.01 mole/cm3 to about 0.3 mole/cm3 of 3d transition metal. The metal oxide comprises indium oxide or titanium oxide. The 3d transition metal includes at least one 3d transition metal selected from the group consisting of chromium, cobalt, nickel, iron, manganese, and mixtures thereof.

    Abstract translation: 薄膜晶体管基板包括绝缘板; 设置在绝缘板上的栅电极; 包含金属氧化物的半导体层,其中所述金属氧化物具有小于或等于3%的氧缺陷,并且其中所述金属氧化物包含约0.01mol / cm 3至约0.3mol / cm 3的3d过渡金属; 设置在所述栅极电极和所述半导体层之间的栅极绝缘层; 以及设置在半导体层上的源电极和漏电极。 还描述了显示基板。 金属氧化物具有小于或等于3%的氧缺陷,并且掺杂有约0.01摩尔/ cm3至约0.3摩尔/ cm3的3d过渡金属。 金属氧化物包括氧化铟或二氧化钛。 3d过渡金属包括选自铬,钴,镍,铁,锰及其混合物中的至少一种3d过渡金属。

    THIN FILM TRANSITOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
    46.
    发明申请
    THIN FILM TRANSITOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    薄膜传输器基板及其制造方法

    公开(公告)号:US20110183463A1

    公开(公告)日:2011-07-28

    申请号:US12961170

    申请日:2010-12-06

    CPC classification number: H01L29/78618 H01L29/458 H01L29/66765 H01L29/7869

    Abstract: A method of manufacturing a thin film transistor (“TFT”) substrate includes forming a first conductive pattern group including a gate electrode on a substrate, forming a gate insulating layer on the first conductive pattern group, forming a semiconductor layer and an ohmic contact layer on the gate insulating layer by patterning an amorphous silicon layer and an oxide semiconductor layer, forming a second conductive pattern group including a source electrode and a drain electrode on the ohmic contact layer by patterning a data metal layer, forming a protection layer including a contact hole on the second conductive pattern group, and forming a pixel electrode on the contact hole of the protection layer. The TFT substrate including the ohmic contact layer formed of an oxide semiconductor is further provided.

    Abstract translation: 制造薄膜晶体管(“TFT”)基板的方法包括在基板上形成包括栅电极的第一导电图案组,在第一导电图案组上形成栅极绝缘层,形成半导体层和欧姆接触层 通过图案化非晶硅层和氧化物半导体层,在栅极绝缘层上,通过图案化数据金属层,在欧姆接触层上形成包括源电极和漏电极的第二导电图案组,形成包括接触的保护层 并且在保护层的接触孔上形成像素电极。 还提供了包括由氧化物半导体形成的欧姆接触层的TFT基板。

    Deposition method of insulating layers having low dielectric constant of semiconductor device, a thin film transistor substrate using the same and a method of manufacturing the same
    49.
    发明授权
    Deposition method of insulating layers having low dielectric constant of semiconductor device, a thin film transistor substrate using the same and a method of manufacturing the same 有权
    具有低介电常数的半导体器件的绝缘层的沉积方法,使用其的薄膜晶体管基板及其制造方法

    公开(公告)号:US07902549B2

    公开(公告)日:2011-03-08

    申请号:US11950476

    申请日:2007-12-05

    Abstract: The present invention relates to a process for vapor depositing a low dielectric insulating film, a thin film transistor using the same, and a preparation method thereof, and more particularly to a process for vapor deposition of low dielectric insulating film that can significantly improve a vapor deposition speed while maintaining properties of the low dielectric insulating film, thereby solving parasitic capacitance problems to realize a high aperture ratio structure, and can reduce a process time by using silane gas when vapor depositing an insulating film by a CVD or PECVD method to form a protection film for a semiconductor device. The present invention also relates to a thin film transistor using the process and preparation method thereof.

    Abstract translation: 本发明涉及一种用于气相沉积低介电绝缘膜的方法,使用其的薄膜晶体管及其制备方法,更具体地涉及可以显着改善蒸气的低介电绝缘膜的气相沉积方法 同时保持低介电绝缘膜的性能,从而解决了寄生电容问题,以实现高开口率结构,并且通过使用硅烷气体通过CVD或PECVD方法蒸镀绝缘膜时可以减少处理时间,以形成 用于半导体器件的保护膜。 本发明还涉及使用该方法及其制备方法的薄膜晶体管。

    THIN FILM TRANSISTOR ARRAY PANEL AND METHOD OF MANUFACTURING THE SAME
    50.
    发明申请
    THIN FILM TRANSISTOR ARRAY PANEL AND METHOD OF MANUFACTURING THE SAME 有权
    薄膜晶体管阵列及其制造方法

    公开(公告)号:US20100127961A1

    公开(公告)日:2010-05-27

    申请号:US12537702

    申请日:2009-08-07

    CPC classification number: G02F1/136227 G02F2001/134345 G02F2001/136222

    Abstract: A thin film transistor array panel including a substrate, gate lines formed on the substrate and extending in a first direction, data lines formed on the substrate and extending in a second direction, wherein the data lines cross and are insulated from the gate lines, and thin film transistors each with a control terminal, an input terminal, and an output terminal. The control and input terminals of the thin film transistor are connected to the gate and data lines. A barrier rib is formed on the gate lines, the data lines, and the thin film transistors. The barrier rib has the same pattern as the gate lines, the data lines, and the thin film transistors. Color filters fill regions demarcated by the barrier rib. Pixel electrodes are formed on the color filters. The output terminal of the thin film transistor has an opening, and a portion of the barrier rib formed on the output terminal has an output opening. The barrier rib output terminal portion has the same pattern as the output terminal. With the thin film transistor array panel, a barrier rib for forming contact holes is formed through exposing a positive photosensitive organic layer formed on a passivation layer to light from the backside of a substrate by using drain electrodes with openings as a light blocking film.

    Abstract translation: 一种薄膜晶体管阵列面板,包括基板,形成在基板上并沿第一方向延伸的栅极线,形成在基板上并沿第二方向延伸的数据线,其中数据线交叉并与栅极线绝缘,以及 薄膜晶体管分别具有控制端子,输入端子和输出端子。 薄膜晶体管的控制和输入端子连接到栅极和数据线。 在栅极线,数据线和薄膜晶体管上形成障壁。 阻挡肋具有与栅极线,数据线和薄膜晶体管相同的图案。 彩色滤光片填充由障壁划分的区域。 像素电极形成在滤色器上。 薄膜晶体管的输出端子具有开口,并且形成在输出端子上的阻挡肋的一部分具有输出开口。 隔壁输出端子部分具有与输出端子相同的图案。 利用薄膜晶体管阵列面板,通过使用具有开口的漏极作为遮光膜,形成用于形成接触孔的阻挡肋,其通过将形成在钝化层上的正性光敏有机层暴露于来自衬底背面的光而形成。

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