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公开(公告)号：US11009908B1
公开(公告)日：2021-05-18
申请号：US16655124
申请日：2019-10-16
Applicant: mCube, Inc.
Inventor： Cheng Pin Huang , Yan Zhong Zhang , Sanjay Bhandari
Abstract: A portable computing device includes a housing having a region with a plurality of physical features configured to be swiped by a user during a first period, a first accelerometer configured to determine first perturbations during the first period, a second accelerometer configured to determine second perturbations during the first period of time, and a processor coupled to the first and second accelerometer and configured to determine whether the user has swiped the region during the first period of time in response to the first perturbations and the second perturbations.
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公开(公告)号：US10913653B2
公开(公告)日：2021-02-09
申请号：US14658114
申请日：2015-03-13
Applicant: MCube Inc.
Abstract: A method for fabricating a MEMS sensor device. The method can include providing a substrate, forming an IC layer overlying the substrate, forming an oxide layer overlying the IC layer, forming a metal layer coupled to the IC layer through the oxide layer, forming a MEMS layer having a pair of designated sense electrode portions and a designated proof mass portion overlying the oxide layer, forming a via structure within each of the designated sense electrode portions, and etching the MEMS layer to form a pair of sense electrodes and a proof mass from the designated sense electrode portions and proof mass portions, respectively. The via structure can include a ground post and the proof mass can include a sense comb. The MEMS sensor device formed using this method can result is more well-defined edges of the proof mass structure.
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公开(公告)号：US10605823B2
公开(公告)日：2020-03-31
申请号：US15444162
申请日：2017-02-27
Applicant: mCube, Inc.
Inventor： Sanjay Bhandari , Ken Wang , Ben Lee
Abstract: A method for operating an electronic device comprising a first and second MEMS device and a semiconductor substrate disposed upon a mounting substrate includes subjecting the first MEMS device and the second MEMS device to physical perturbations, wherein the physical perturbations comprise first physical perturbations associated with the first MEMS device and second physical perturbations associated with the second MEMS device, wherein the first physical perturbations and the second physical perturbations are substantially contemporaneous, determining in a plurality of CMOS circuitry formed within the one or more semiconductor substrates, first physical perturbation data from the first MEMS device in response to the first physical perturbations and second physical perturbation data from the second MEMS device in response to the second physical perturbations, determining output data in response to the first physical perturbation data and to the second physical perturbation data, and outputting the output data.
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公开(公告)号：US10479676B2
公开(公告)日：2019-11-19
申请号：US16102592
申请日：2018-08-13
Applicant: mCube, Inc.
Inventor： Ben Lee , Ming Hong Kuo , Wen-Chih Chen , Wensen Tsai
Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.
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45.发明授权公开(公告)号：US10343896B2
公开(公告)日：2019-07-09
申请号：US14977481
申请日：2015-12-21
Applicant: mCube, Inc.
Inventor： Te-Hsi “Terrence” Lee
Abstract: A method for fabricating an integrated MEMS device and the resulting structure therefore. A control process monitor comprising a MEMS membrane cover can be provided within an integrated CMOS-MEMS package to monitor package leaking or outgassing. The MEMS membrane cover can separate an upper cavity region subject to leaking from a lower cavity subject to outgassing. Differential changes in pressure between these cavities can be detecting by monitoring the deflection of the membrane cover via a plurality of displacement sensors. An integrated MEMS device can be fabricated with a first and second MEMS device configured with a first and second MEMS cavity, respectively. The separate cavities can be formed via etching a capping structure to configure each cavity with a separate cavity volume. By utilizing an outgassing characteristic of a CMOS layer within the integrated MEMS device, the first and second MEMS cavities can be configured with different cavity pressures.
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Patent Agency Ranking
公开(公告)号：US10322926B1
公开(公告)日：2019-06-18
申请号：US14887737
申请日：2015-10-20
Applicant: mCube, Inc.
Inventor： Sudheer Sridharamurthy , Te-Hsi Terrence Lee , Wenhua Zhang
Abstract: A structure for a MEMS device includes a MEMS layer comprising a mass portion and a spring portion, a substrate coupled to the MEMS layer, wherein the substrate comprises a planar region and an stopper region, wherein the MEMS device and the substrate are oriented in a plurality of relative orientations in response to an external force, wherein the spring portion and the stopper region are configured to disengagingly impact when the external force exceeds a first threshold force, wherein the mass portion and the planar region are configured to disengagingly impact when the external force exceeds a second threshold force, and wherein the second threshold force exceeds the first threshold force.
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公开(公告)号：US20170283256A1
公开(公告)日：2017-10-05
申请号：US15479154
申请日：2017-04-04
Applicant: mCube, Inc.
Inventor： Ben LEE , Ming Hong KUO , Wen-Chih CHEN , Wensen TSAI
CPC classification number: B81C99/0045 , B81C99/005 , G01R1/0433 , G01R31/2607 , H01L21/67132
Abstract: A method for a MEMS device includes receiving a diced wafer having a plurality devices disposed upon an adhesive substrate and having an associated known good device data, removing a first set of devices from the plurality of devices from the adhesive substrate in response to the known good device data, picking and placing a first set of the devices into a plurality of sockets within a testing platform, testing the first set of integrated devices includes while physically stressing the first set of devices, providing electrical power to the first set of devices and receiving electrical response data from the first set of devices, determining a second set of devices from the first set of devices, in response to the electrical response data, picking and placing the second set of devices into a transport tape media.
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公开(公告)号：US09738510B1
公开(公告)日：2017-08-22
申请号：US14750820
申请日：2015-06-25
Applicant: mCube, Inc.
Inventor： Chien Chen Lee
CPC classification number: B81C1/00134 , B81B3/0035 , B81B3/0062 , B81B3/0072 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/012 , B81C1/00158 , B81C1/0023 , B81C2203/0792 , G01C19/5719 , G01C19/5783 , G01L9/0042 , G01L19/147 , H04R31/00 , H04R2201/003
Abstract: A method and structure for a PLCSP (Package Level Chip Scale Package) MEMS package. The method includes providing a MEMS chip having a CMOS substrate and a MEMS cap housing at least a MEMS device disposed upon the CMOS substrate. The MEMS chip is flipped and oriented on a packaging substrate such that the MEMS cap is disposed above a thinner region of the packaging substrate and the CMOS substrate is bonding to the packaging substrate at a thicker region, wherein bonding regions on each of the substrates are coupled. The device is sawed to form a package-level chip scale MEMS package.
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公开(公告)号：US09651473B2
公开(公告)日：2017-05-16
申请号：US14222575
申请日：2014-03-21
Applicant: mCube Inc.
Inventor： Raymond Merrill, Jr. , David Paul Jensen
CPC classification number: G01N19/02 , B81C99/005
Abstract: A wafer level centrifuge (WLC) system and method of testing MEMS devices using the system. The wafer level centrifuge (WLC) system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system. The method can include applying a smooth and continuous acceleration profile to two or more MEMS wafers via the base centrifuge system. Each of the two or more MEMS wafers can have one or more MEMS devices formed thereon. The two or more MEMS wafers can be provided in two or more wafer holding cassettes configured on the cassette mounting hub. The method can also include identifying one or more target MEMS wafers, which can include identifying stiction in one or more MEMS devices on the one or more MEMS wafers.
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50.发明授权公开(公告)号：US09340414B2
公开(公告)日：2016-05-17
申请号：US14311034
申请日：2014-06-20
Applicant: mCube Inc.
Inventor： Shingo Yoneoka , Anthony F. Flannery, Jr.
CPC classification number: B81C1/00246 , B81B7/02 , B81B2201/0264 , B81C1/00269 , B81C2203/0742 , G01L9/0042 , G01L9/0045 , G01L9/0054 , G01L9/0073 , G01L19/0084 , G01L19/143
Abstract: An integrated pressure sensing device and method of fabrication thereof are disclosed. The method can include providing a substrate member having a surface region and forming a CMOS IC layer overlying the substrate and forming an oxide layer overlying the CMOS IC layer. A portion of the oxide layer can be removed to form a cavity region. A single crystalline silicon wafer can be bonded overlying the oxide surface region to seal the cavity region. The bonding process can include a fusion bonding or eutectic bonding process. The wafer can be thinned to a desired thickness and portions can be removed and filled with metal materials to form via structures. A pressure sensor device can be formed from the wafer, and can be co-fabricated with another sensor from the wafer. The pressure sensor and the other sensor can share a cavity pressure or have separate cavity pressures.
Abstract translation: 公开了一种集成的压力感测装置及其制造方法。 该方法可以包括提供具有表面区域的衬底构件，并且形成覆盖衬底的CMOS IC层并形成覆盖在CMOS IC层上的氧化物层。 可以去除氧化物层的一部分以形成空腔区域。 可以将单晶硅晶片粘合在氧化物表面区域上以密封空腔区域。 接合工艺可以包括熔接或共熔粘合工艺。 可以将晶片减薄到所需的厚度，并且可以去除部分并用金属材料填充以形成通孔结构。 压力传感器装置可以由晶片形成，并可与来自晶片的另一传感器共同制造。 压力传感器和另一个传感器可以共享腔体压力或具有单独的腔体压力。
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