Abstract:
Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.
Abstract:
A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold.
Abstract:
An internal fastening feature that also acts as a means of separating a housing body from a protective cover is disclosed. The internal fastening feature includes two arms that meet at a central hub that is pivotally coupled to a bracket. The bracket is coupled to an interior-facing surface of the protective cover. A first arm defines a threaded opening that receives a fastener that keeps the protective cover coupled with the housing body. A second arm, extending in a different direction than the first arm, is positioned above a protrusion of the housing body. When the fastener is disengaged from the first arm, a disengaging tool can apply a force to the first arm that rotates the second arm until it presses against the protrusion. The force applied to the protrusion is then transmitted to the protective cover, which is consequently pushed away from the housing body.
Abstract:
An electronic device having a semi-rigid battery pack is disclosed. The semi-rigid battery pack offers an internal power supply with relatively high energy density (energy per volume) with a stiff cover covering the battery pack to shield other internal components from the battery pack. The cover may also be formed with a larger dimension than that of the battery pack such that when the battery pack undergoes a swelling event, the battery pack increases its volume while still be contained by the cover. In this manner, other internal components may be positioned proximate to the cover without being affected by the battery pack. In another embodiment, a mold member covers an outer peripheral portion and supports the battery pack while allowing the battery pack to undergo a swelling event.
Abstract:
This application relates to securing and positioning internal components within a housing of a portable computing device. In one embodiment, a number of insert molded retaining members are utilized to inhibit outward deformation of a sidewall of the housing during a drop event. In another embodiment, a cowling is utilized to retain a number of board-to-board connectors within communication slots on a printed circuit board (PCB). In another embodiment, a C-shaped washer having diametrically opposed protrusions is utilized to adjust an alignment of an internal component.
Abstract:
A housing for a personal electronic device is described herein. The housing may include at least structural member configured to be arranged within an internal cavity of the housing. The at least structural member is aligned with a feature external to the housing. The at least one structural member is affixed to an interior surface of the internal cavity. Furthermore, the at least structural member and housing are co-machined to define a coaxial aperture for accepting the feature.
Abstract:
Various systems of an electronic deice and methods for manufacturing the same are provided. In some embodiments, a routing assembly is provided that may not only route a cable along a circuit board, but that may also shield and electronic component or secure an electronic component to the circuit board. In some other embodiments, there is provided a mechanism for electrically coupling two components of an electronic device that may also be visually appealing in the context of other portions of the electronic device.
Abstract:
An electronic device may have a display mounted in a housing. The display may have a display panel with an array of pixels on a flexible substrate. A display cover layer may overlap the display panel. The flexible substrate may have a protruding portion that forms a tail. The tail may be coupled to a printed circuit on which a display driver integrated circuit and/or other circuitry is mounted. When the display is mounted in the housing, the tail may be bent back on itself to create a bend. The bend may be embedded in a molded polymer member. The molded polymer member may be attached to the housing with adhesive and may directly contact an inner surface of the display cover layer.
Abstract:
An electronic device may have a display mounted in a housing. The display may have a display panel with an array of pixels on a flexible substrate. A display cover layer may overlap the display panel. The flexible substrate may have a protruding portion that forms a tail. The tail may be coupled to a printed circuit on which a display driver integrated circuit and/or other circuitry is mounted. When the display is mounted in the housing, the tail may be bent back on itself to create a bend. The bend may be embedded in a molded polymer member. The molded polymer member may be attached to the housing with adhesive and may directly contact an inner surface of the display cover layer.
Abstract:
A strobe module can include a Fresnel lens that defines an external surface of the strobe module and a sidewall at least partially defining an internal volume and defining an external channel. A gasket can be disposed in the external channel. A substrate can be coupled to the sidewall to further define the internal volume and a light source can be disposed on the substrate in the internal volume.