Abstract:
Disclosed herein is a micromirror array device that comprises an array of reflective deflectable mirror plates each being associated with one single addressing electrode to be deflected to an ON state angle. A light transmissive electrode is disposed proximate to the mirror plates for deflecting the mirror plates to a non-zero OFF angle. The mirror plates are arranged in the array with a center-to-centre distance of 10.17 microns or less.
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
Abstract:
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
Abstract:
Disclosed herein is a micromirror device having in-plane deformable hinge to which a deflectable and reflective mirror plate is attached. The mirror plate rotates to different angles in response to an electrostatic field established between the mirror plate and an addressing electrode associated with the mirror plate.
Abstract:
A method for processing microelectromechanical devices is disclosed herein. The method prevents the diffusion and interaction between sacrificial layers and structure layers of the microelectromechanical devices by providing selected barrier layers between consecutive sacrificial and structure layers.
Abstract:
A spatial light modulator is disclosed, along with methods for making such a modulator. The spatial light modulator comprises an array of micromirrors each having a hinge and a micromirror plate held via a hinge on a substrate, the micromirror plate being attached to the hinge such that the micromirror plate can rotate along a rotation axis and the hinge structure is located between the micromirror plate and the light source. The mirror plate is formed between the hinge and the substrate on which the hinge is formed. As a result, the hinge is exposed to the incident light during the operation.
Abstract:
A spatial light modulator comprises an array of micromirror devices each of which has a reflective and deflectable mirror plates. The mirror plates are moved between an ON and OFF state during operation, wherein the OFF state is a state wherein the mirror plate is not parallel to the substrate on which the mirror plate is formed. The micromirror device may have an ON state stopper for limiting the rotation of the mirror plate at the ON state angle, but does not have an OFF state stopper. The non-zero OFF state is achieved by attaching the mirror plate to a deformable hinge held by a hinge support that is curved at the natural resting state.
Abstract:
Disclosed herein is a micromirror array device that comprises an array of reflective deflectable mirror plates each being associated with one single addressing electrode to be deflected to an ON state angle. A light transmissive electrode is disposed proximate to the mirror plates for deflecting the mirror plates to a non-zero OFF angle. The mirror plates are arranged in the array with a center-to-centre distance of 10.17 microns or less.
Abstract:
Disclosed herein is a micromirror device having in-plane deformable hinge to which a deflectable and reflective mirror plate is attached. The mirror plate rotates to different angles in response to an electrostatic field established between the mirror plate and an addressing electrode associated with the mirror plate.
Abstract:
Disclosed herein is a micromirror array device package having a light absorbing material disposed within the package for reducing undesired light scattering. The light absorbing material can be deposited as a thin film (or strip, frame, segments or a combination thereof), or as a vertical wall insert between the micromirror array device and a cover substrate of the package.