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公开(公告)号：US20190011772A1
公开(公告)日：2019-01-10
申请号：US15745062
申请日：2017-08-17
Applicant: BOE Technology Group Co., Ltd.
Inventor： Qi Yao , Zhanfeng Cao , Feng Zhang , Haixu Li , Shengguang Ban , Yingwei Liu
IPC: G02F1/1335 , G02F1/1368 , H01L27/12 , G02F1/1362 , H01L21/02 , H01L21/3065 , H01L29/786
Abstract: An array substrate and a manufacturing method thereof, and a display device are provided. The array substrate includes: a base substrate, an active layer, and a first polarization structure. The active layer is disposed on the base substrate; the first polarization structure is disposed on a side of the active layer facing the base substrate, and an orthographic projection of the first polarization structure on the base substrate is at least partially overlapped with an orthographic projection of the active layer on the base substrate.
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42.发明申请公开(公告)号：US20180356920A1
公开(公告)日：2018-12-13
申请号：US15778310
申请日：2017-05-25
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yingwei Liu , Ning Chen
CPC classification number: G06F3/046 , G06F3/03545 , G06F2203/04103 , H01L27/1214 , H01L27/124 , H01L27/1262 , H01L27/22 , H01L43/04 , H01L43/065 , H01L43/14
Abstract: An electronic device, a manufacturing method and an operation method thereof, and an electronic copy system. Each pixel unit of the electronic device includes a Hall-effect working electrode including a first, second, third and fourth contact position, a thin film transistor, a gate line, a first common line, a second common line, a data line and a sensing line. A line connecting the first contact position and the second contact position intersects a line connecting the third contact position and the fourth contact position; the thin film transistor includes a gate electrode connected with the gate line, a source electrode connected with the data line and a drain electrode, the drain electrode and sensing line are respectively connected with the first and second contact position; the first and second common line are respectively connected with the Hall-effect working electrode through the third and fourth contact position.
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公开(公告)号：US12066247B2
公开(公告)日：2024-08-20
申请号：US17475021
申请日：2021-09-14
Applicant: BOE Technology Group Co., Ltd.
Inventor： Guocai Zhang , Junwei Yan , Shaodong Sun , Shihao Dong , Yingwei Liu , Zhanfeng Cao , Guangcai Yuan
Abstract: The present disclosure provides an air drying device including: a base including opposing top and bottom portions, the top portion including at least one first bearing surface; and at least one bearing plate disposed at the top portion of the base. The bearing plate includes a second bearing surface, and the first bearing surface is inclined relative to the second bearing surface.
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公开(公告)号：US12057540B2
公开(公告)日：2024-08-06
申请号：US17283512
申请日：2020-05-08
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Dongni Liu , Minghua Xuan , Chao Liu , Yingwei Liu
CPC classification number: H01L33/62 , H01L33/005 , H01L2933/0066
Abstract: The present disclosure provides a display panel and a manufacturing method. The display panel includes: a base substrate including a display surface and a display back surface arranged opposite to each other, and a side surface connected to the display surface and the display back surface; a plurality of first wirings on the display surface of the base substrate; a plurality of second wirings on the display back surface of the base substrate; a transition body on the side surface of the base substrate and in contact with the first wirings and the second wirings, a surface of the transition body away from the side surface being a smooth curved surface; and a plurality of connection lines covering an outer surface of the transition body, each first wiring being electrically connected to a corresponding second wiring via a corresponding connection line.
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公开(公告)号：US11929358B2
公开(公告)日：2024-03-12
申请号：US18137857
申请日：2023-04-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Wenqian Luo , Yingwei Liu , Ke Wang , Qi Yao , Huijuan Wang , Haixu Li , Zhanfeng Cao , Guangcai Yuan , Xue Dong , Guoqiang Wang , Zhijun Lv
CPC classification number: H01L25/167 , H01L24/13 , H01L27/124 , H01L2224/13016 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/1319
Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
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Patent Agency Ranking
公开(公告)号：US11894353B2
公开(公告)日：2024-02-06
申请号：US17010575
申请日：2020-09-02
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhiwei Liang , Wenqian Luo , Guoqiang Wang , Yingwei Liu
CPC classification number: H01L25/167 , H01L24/03 , H01L24/11 , H01L24/13 , H01L24/81 , H01L27/124 , H01L27/1259 , H01L2224/0382 , H01L2224/10122 , H01L2224/1182 , H01L2224/13007 , H01L2224/13016 , H01L2224/13078 , H01L2224/81201
Abstract: The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.
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公开(公告)号：US11742467B2
公开(公告)日：2023-08-29
申请号：US16920401
申请日：2020-07-02
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Wenqian Luo , Yingwei Liu , Ke Wang , Shengguang Ban , Zhanfeng Cao
CPC classification number: H01L33/62 , H01L24/16 , H01L2224/16225 , H01L2933/0066
Abstract: A preparation method of a backplane includes: forming an insulating structure layer having a groove on a base substrate by a mask exposure process, the groove being used for accommodating a metal trace; and repeating a metal sub-layer forming step including an ashing process and a wet etching process multiple times to form the metal trace positioned in the groove.
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公开(公告)号：US11688724B2
公开(公告)日：2023-06-27
申请号：US16765530
申请日：2019-05-31
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Wenqian Luo , Yingwei Liu , Ke Wang , Qi Yao , Huijuan Wang , Haixu Li , Zhanfeng Cao , Guangcai Yuan , Xue Dong , Guoqiang Wang , Zhijun Lv
CPC classification number: H01L25/167 , H01L24/13 , H01L27/124 , H01L2224/13016 , H01L2224/1319 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147
Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
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49.发明授权公开(公告)号：US11502153B2
公开(公告)日：2022-11-15
申请号：US16761823
申请日：2019-03-26
Applicant: BOE Technology Group Co., Ltd.
Inventor： Renquan Gu , Qi Yao , Jaiil Ryu , Zhiwei Liang , Yingwei Liu , Wusheng Li , Muxin Di
IPC: H01L27/32
Abstract: An array substrate and a manufacturing method thereof, a display device and a manufacturing method thereof are provided, which belong to the technical field of display. The array substrate includes: an interposer substrate, a thin-film transistor disposed on one side of the interposer substrate, and a bonding connection line embedded in the other side of the interposer substrate. The bonding connection line is configured to be connected to a drive circuit. An interposer via hole is arranged on the interposer substrate. A conductive structure is arranged in the interposer via hole. The thin-film transistor is electrically connected to the bonding connection line by the conductive structure.
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公开(公告)号：US11335712B2
公开(公告)日：2022-05-17
申请号：US16755652
申请日：2019-05-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Muxin Di , Ke Wang , Yingwei Liu , Xiaoyan Zhu , Zhanfeng Cao , Guangcai Yuan
Abstract: An array substrate is provided. The array substrate includes a base substrate; a first bonding pad layer including a plurality of first bonding pads on a first side of the base substrate; a second bonding pad layer including a plurality of second bonding pads on a second side of the base substrate, wherein the second side is opposite to the first side; and a plurality of signal lines on a side of the second bonding pad layer away from the base substrate. A respective one of the plurality of second bonding pads extends through the base substrate to electrically connect to a respective one of the plurality of first bonding pads. The respective one of the plurality of first bonding pads includes a protruding portion protruding away from the first side of the base substrate along a direction from the second side to the first side.
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