摘要:
A memory cell arrangement includes a first memory cell string having a plurality of serially source-to-drain-coupled transistors, at least some of them being memory cells, a second memory cell string having a plurality of serially source-to-drain-coupled transistors, at least some of them being memory cells. A dielectric material is between and above the first memory cell string and the second memory cell string. A source/drain line groove is defined in the dielectric material. The source/drain line groove extends from a source/drain region of one transistor of the first memory cell string to a source/drain region of the second memory cell string. Electrically conductive filling material is disposed in the source/drain line groove. Dielectric filling material is disposed in the source/drain line groove between the source/drain regions.
摘要:
A trench (2) is fabricated in a silicon body (1). The walls (4) of the trench are provided with a nitrogen implantation (6). An oxide layer between the source/drain regions (5) and a word line applied on the top side grows to a greater thickness than a lower oxide layer of an ONO storage layer fabricated as gate dielectric at the trench wall. Instead of the nitrogen implantation into the trench walls, it is possible to fabricate a metal silicide layer on the top sides of the source/drain regions in order to accelerate the oxide growth there.
摘要:
Wordline stacks are arranged parallel at a distance from one another on a substrate surface. Bitlines are arranged transversely to the wordline stacks at a distance from one another. Source/drain regions are formed as doped regions in the vicinity of the wordline stacks. A resistive layer is disposed between a plurality of the source/drain regions and the bitlines and formed of a material having a resistance that is switched by an applied voltage. Source lines are arranged parallel to the wordline stacks so that they connect further pluralities of the source/drain regions.
摘要:
A periodic pattern of conductor tracks with broader interspaces is produced by the application of a totally periodic pattern and subsequent removal of individual conductor tracks. An alternative method comprises the formation of a completely periodic hardmask, from which individual parts are removed. The modified hardmask is then used to etch a periodic pattern of conductor tracks with intermediate broader spaces.
摘要:
A method is provided for fabricating stacked non-volatile memory cells. A semiconductor wafer is provided having a plurality of diffusion regions forming buried bit lines. A charge-trapping layer and a conductive layer are deposited on the surface of the semiconductor wafer. Using a mask layer on top of the conductive layer, contact holes are formed wherein an insulating layer is formed. An etch stop layer is deposited on the surface of the semiconductor wafer. Above the etch stop layer, a dielectric layer is deposited and is patterned so as to form contact holes. Subsequently, the contact holes are enlarged through the etch stop layer and the insulating layer to the buried bit lines.
摘要:
Data carrier card having a card body of a flat form and having a recess, a carrier, a chip arranged on the carrier and inserted in the recess of the card body, external contact elements arranged on the carrier and electrically connected to the chip via conductor runs, and a cover covering the recess in operative connection with the carrier such that the carrier is held along the bottom in the recess, wherein the external contact elements and the chip are arranged on a same side of the carrier.
摘要:
In the method, trenches are etched and, in between, bit lines (8) are in each case arranged on doped source/drain regions (3, 4). Storage layers (5, 6, 7) are applied and gate electrodes (2) are arranged at the trench walls. After the introduction of polysilicon, which is provided for the gate electrodes (2), into the trenches, the top side is ground back in a planarizing manner until the top side of the covering layer (16) is reached, and afterward a polysilicon layer (18), which is provided for the word lines, is applied over the whole area and patterned to form the word lines.
摘要:
A memory cell includes a channel region between source/drain regions at the top side of a semiconductor body and is provided, transversely with respect to the longitudinal direction, with a bulge formed in the semiconductor material. This results in a uniform distribution of the strength of a radially directed electric field and avoids field strength spikes at lateral edges of the channel region. A storage layer sequence is situated between the channel region and the gate electrode as part of a word line.
摘要:
The charge-trapping layer comprises two strips above the source and drain junctions. The thicknesses of the charge-trapping layer and the gate dielectric are chosen to facilitate Fowler-Nordheim-tunnelling of electrons into the strips during an erasure process. Programming is performed by injection of hot holes into the strips individually for two-bit storage.
摘要:
The invention provides an integration scheme for a memory cell array, especially a charge-trapping memory cell array, comprising an architecture of local interconnects, which enables to avoid nitride insulations of wordline stacks and to produce CMOS devices of different structures and dimensions in standard technology along with the tinier memory cell transistors.