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117 条记录 (耗时 0.036 秒)

    Hot-melt sealing glass compositions and methods of making and using the same
    41.
    发明授权
    Hot-melt sealing glass compositions and methods of making and using the same 有权
    热熔密封玻璃组合物及其制备和使用方法

    公开(公告)号：US08307674B2

    公开(公告)日：2012-11-13

    申请号：US12532424

    申请日：2009-07-15

    申请人： Robert D. Gardner ,  Keith M. Mason ,  Srinivasan Sridharan ,  Aziz S. Shaikh

    发明人： Robert D. Gardner ,  Keith M. Mason ,  Srinivasan Sridharan ,  Aziz S. Shaikh

    IPC分类号： C03C27/00

    CPC分类号： C03C8/24 ,  C03C3/066 ,  C03C3/072 ,  C03C3/16 ,  C03C8/245 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/16235 ,  H01L2924/00014

    摘要： Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.

    摘要翻译： 包括分散在聚合物粘合剂体系中的一种或多种玻璃料的热熔密封玻璃组合物。 聚合物粘合剂体系在室温下为固体，但在约35℃至约90℃的温度下熔融，由此形成可流动的液体分散体，其可施加到基底（例如盖片和 /或MEMS器件的器件晶片）。 根据本发明的热熔密封玻璃组合物在通过丝网印刷沉积之后快速再固化并附着到基底上。 因此，它们在丝网印刷后不会像常规的溶剂型玻璃料粘合膏一样扩散。 而且，由于根据本发明的热熔密封玻璃组合物不是溶剂型体系，它们在沉积后不需要强力干燥。

    Electronic device having lead and cadmium free electronic overglaze applied thereto
    45.
    发明授权
    Electronic device having lead and cadmium free electronic overglaze applied thereto 有权
    具有无铅和无镉电子烙印的电子设备

    公开(公告)号：US07740899B2

    公开(公告)日：2010-06-22

    申请号：US10431346

    申请日：2003-05-07

    申请人： Srinivasan Sridharan ,  Michail Moroz

    发明人： Srinivasan Sridharan ,  Michail Moroz

    IPC分类号： B05D5/12 ,  B05D3/02

    CPC分类号： C03C8/20 ,  C03C8/02 ,  C03C8/14 ,  C03C8/22

    摘要： The present invention provides an electronic device having a lead-free and cadmium-free glass composition applied thereto and fired to form an acid resistant overglaze, and a method of overglazing an electronic device using the lead-free and cadmium-free glass composition. The lead-free and cadmium-free glass composition fuses at low firing temperatures and is particularly suitable for use in thick film pastes. The glass composition forms predominantly bismuth titanate and/or zinc titanate crystals upon firing. Preferably, glass compositions include by weight from about 11% to about 52% SiO2, from 3.4% to about 40% TiO2, up to about 75% Bi2O3, up to about 40% by weight ZnO, where the sum of Bi2O3 and ZnO comprises from about 15% to about 85% of the glass composition by weight.

    摘要翻译： 本发明提供了一种电子装置，其具有施加到其上的无铅和无镉玻璃组合物并烧制以形成耐酸釉料，以及使用无铅和无镉玻璃组合物来搪瓷电子器件的方法。 无铅和无镉玻璃组合物在低烧成温度下熔化，特别适用于厚膜糊剂。 玻璃组合物在烧制时主要形成钛酸铋和/或钛酸锌晶体。 优选地，玻璃组合物包括按重量计约11％至约52％SiO 2，3.4％至约40％TiO 2，至多约75％Bi 2 O 3，至多约40％重量的ZnO，其中Bi 2 O 3和ZnO的总和包含 约占玻璃组合物重量的约15％至约85％。

    Method of making a low profile balloon
    49.
    发明授权
    Method of making a low profile balloon 有权
    制作低调气球的方法

    公开(公告)号：US07147817B1

    公开(公告)日：2006-12-12

    申请号：US10335484

    申请日：2002-12-31

    申请人： Florencia Lim ,  Timothy Owens ,  Srinivasan Sridharan ,  Chi Le Long

    发明人： Florencia Lim ,  Timothy Owens ,  Srinivasan Sridharan ,  Chi Le Long

    IPC分类号： B29C49/22 ,  B29C49/64

    CPC分类号： B29C61/006 ,  A61M25/0045 ,  A61M25/1006 ,  A61M25/1036 ,  A61M25/1038 ,  A61M25/104 ,  A61M2025/1031 ,  A61M2025/1075 ,  A61M2025/1081 ,  B29L2022/025 ,  B29L2031/7542

    摘要： A method of making a catheter balloon or other expandable tubular medical device or component thereof, in which an assembly of heat shrink material on an outer surface of coaxially disposed first and second tubes is heated to radially shrink the heat shrink material and reduce the outer diameter of the first tube. In a presently preferred embodiment, the heat shrink material extends at least along a central section of the first tube to reduce the outer diameter of the first tube at least along the central section of the first tube. The first and second tubes form the outer and inner layers, respectively, of a multilayered balloon, which has an improved low profile outer diameter.

    摘要翻译： 一种制造导管球囊或其它可扩张的管状医疗装置或其组件的方法，其中在同轴设置的第一和第二管的外表面上的热收缩材料的组件被加热以径向收缩热收缩材料并减小外径 的第一管。 在目前优选的实施例中，热收缩材料至少沿着第一管的中心部分延伸，以至少沿着第一管的中心部分减小第一管的外径。 第一和第二管分别形成多层气囊的外层和内层，其具有改进的低外形外径。

    Copper termination inks containing lead free and cadmium free glasses for capacitors
    50.
    发明授权
    Copper termination inks containing lead free and cadmium free glasses for capacitors 有权
    铜终端油墨含有无铅和无镉电容的玻璃

    公开(公告)号：US06982864B1

    公开(公告)日：2006-01-03

    申请号：US10864309

    申请日：2004-06-09

    申请人： Srinivasan Sridharan ,  Umesh Kumar ,  Chandrashekhar S. Khadilkar

    发明人： Srinivasan Sridharan ,  Umesh Kumar ,  Chandrashekhar S. Khadilkar

    IPC分类号： H01G4/06

    CPC分类号： H01G4/2325 ,  C03C3/066 ,  C03C8/04 ,  C03C8/14 ,  C03C8/16 ,  C03C8/18

    摘要： Lead-free and cadmium-free glass composition that is particularly suitable for use in conductive ink applications. The invention includes a capacitor comprising a copper termination, the copper termination is made by firing an ink including a glass component, the glass component may comprise up to about 65 mole % ZnO, up to about 51 mole % SrO, about 0.1 to about 61 mole % B2O3, up to about 17 mole % Al2O3, about 0.1 to about 63 mole % Sio2, up to about 40 mole % BaO+CaO, and up to about 20 mole % MgO.

    摘要翻译： 无铅和无镉玻璃组合物，特别适用于导电油墨应用。 本发明包括一个包含铜终端的电容器，铜端接件是通过烧制包括玻璃组分的油墨制成的，该玻璃组分可以包括高达约65％（摩尔）的ZnO，至多约51％的SrO，约0.1-约61 摩尔％B 2 O 3 3，至多约17摩尔％的Al 2 O 3 3，约0.1至约 63摩尔％的SiO 2，至多约40摩尔％的BaO + CaO和至多约20摩尔％的MgO。