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47 条记录 (耗时 0.032 秒)

    Micro-fluid ejection head
    42.
    发明授权
    Micro-fluid ejection head 失效
    微流体喷头

    公开(公告)号：US08500242B2

    公开(公告)日：2013-08-06

    申请号：US12974725

    申请日：2010-12-21

    申请人： Frank Anderson ,  Jiandong Fang ,  Jeanne Marie Saldanha Singh ,  Mike Dixon ,  Bryan McKinley ,  Samuel Sexton

    发明人： Frank Anderson ,  Jiandong Fang ,  Jeanne Marie Saldanha Singh ,  Mike Dixon ,  Bryan McKinley ,  Samuel Sexton

    IPC分类号： B41J2/145

    CPC分类号： B41J2/155

    摘要： A micro-fluid ejection head for a printer is disclosed. The micro-fluid ejection head comprises a plurality of printhead modules. Each of the plurality of printhead modules comprises an ejection chip for ejecting fluid. The micro-fluid ejection head further comprises a support frame to mount the plurality of printhead modules for creating a lengthy array of the plurality of printhead modules. The support frame is electrically coupled with the plurality of printhead modules for allowing the plurality of printhead modules to receive data and electrical power.

    摘要翻译： 公开了一种用于打印机的微流体喷射头。 微流体喷射头包括多个打印头模块。 多个打印头模块中的每一个包括用于喷射流体的喷射芯片。 微流体喷射头还包括支撑框架以安装多个打印头模块，用于创建多个打印头模块的冗长阵列。 支撑框架与多个打印头模块电耦合，以允许多个打印头模块接收数据和电力。

    PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS
    43.
    发明申请
    PRINTHEADS AND METHOD FOR ASSEMBLING PRINTHEADS 有权
    用于组装原理的标题和方法

    公开(公告)号：US20120236076A1

    公开(公告)日：2012-09-20

    申请号：US13046845

    申请日：2011-03-14

    申请人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, JR. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

    发明人： Michael J. Dixon ,  Jiandong Fang ,  Richard Earl Corley, JR. ,  Jeanne Marie Saldanha Singh ,  Frank E. Anderson ,  Xiaoming Wu

    IPC分类号： B41J2/145 ,  B23P17/00

    CPC分类号： B41J2/1628 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1642

    摘要： Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

    摘要翻译： 公开了一种用于打印机的打印头，其包括多个排出芯片单元。 多个排出芯片单元中的每个排出芯片单元构造成喷射至少一种流体。 打印头还包括多个支撑单元。 多个支撑单元的每个支撑单元与相应的排出芯片单元流体耦合。 每个支撑单元包括适于接收粘合剂以便于将各个支撑单元与相应的排出芯片单元相连接的多个沟槽。 此外，打印头包括与多个支撑单元中的每个支撑单元流体耦合的基座单元。 基座单元适于通过对应的支撑单元将至少一个流体提供给每个排出芯片单元。 另外公开了一种组装打印头的方法。

    SPRAY COATABLE ADHESIVE FOR BONDING SILICON DIES TO RIGID SUBSTRATES
    45.
    发明申请
    SPRAY COATABLE ADHESIVE FOR BONDING SILICON DIES TO RIGID SUBSTRATES 有权
    用于将硅胶粘结到刚性基材上的喷涂胶粘剂

    公开(公告)号：US20110319513A1

    公开(公告)日：2011-12-29

    申请号：US13168063

    申请日：2011-06-24

    申请人： Xiaoming Wu ,  Paul Dryer ,  David Rhine ,  Anna Pearson ,  Jeanne Marie Saldanha Singh ,  Richard Wells ,  Joel Provence

    发明人： Xiaoming Wu ,  Paul Dryer ,  David Rhine ,  Anna Pearson ,  Jeanne Marie Saldanha Singh ,  Richard Wells ,  Joel Provence

    IPC分类号： C09J163/00

    CPC分类号： B41J2/1601 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1645

    摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.

    摘要翻译： 公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。 粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。 环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。 粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。

    Corrosion resistant printhead body for ink jet pen
    46.
    发明授权
    Corrosion resistant printhead body for ink jet pen 有权
    用于喷墨笔的防腐打印头体

    公开(公告)号：US06264317B1

    公开(公告)日：2001-07-24

    申请号：US09443625

    申请日：1999-11-19

    申请人： Michael Raulinaitis ,  Jeanne Marie Saldanha Singh ,  Gary Raymond Williams

    发明人： Michael Raulinaitis ,  Jeanne Marie Saldanha Singh ,  Gary Raymond Williams

    IPC分类号： B41J2175

    CPC分类号： B41J2/17536 ,  B41J2/17503 ,  B41J2/17553

    摘要： The invention relates to an ink jet pen having exposed surfaces which are coated with a polymeric material. The polymeric material is treated with ultraviolet energy at a wavelength and for a period of time sufficient to increase the surface energy of the coating to thereby enhance the adhesive properties of the coating. The coated polymeric material and treated pen exhibits improved corrosion resistance and are more compatible with adhesives used to assemble components of the pen than similar untreated coatings.

    摘要翻译： 本发明涉及一种具有涂覆有聚合物材料的暴露表面的喷墨笔。 聚合物材料用波长的紫外线能量处理足够长的时间以增加涂层的表面能，从而增强涂层的粘合性能。 涂覆的聚合物材料和经处理的笔具有改善的耐腐蚀性，并且与相似的未处理涂层的组合装置的粘合剂更相容。

    Thermal printhead manufacture
    47.
    发明授权
    Thermal printhead manufacture 失效
    热敏打印头制造

    公开(公告)号：US5980682A

    公开(公告)日：1999-11-09

    申请号：US78912

    申请日：1998-05-14

    申请人： Bruce David Gibson ,  Jeanne Marie Saldanha Singh

    发明人： Bruce David Gibson ,  Jeanne Marie Saldanha Singh

    IPC分类号： B32B37/06 ,  B41J2/16 ,  B41J2/05 ,  B32B31/28

    CPC分类号： B41J2/1601 ,  B41J2/1623 ,  Y10T29/4913 ,  Y10T29/49169

    摘要： Thermal heater chip (1) is located within an opening of TAB circuit tape (5) and the TAB leads (3) are welded to the chip. This assembly is turned so that the underside of the leads face upward, and a curable, electrically insulative liquid is applied and cured to form a solid (11). The bottom of the chip is then attached to a heat radiating support (7) using heat conductive adhesive. The cured solid on the leads prevents any adhesive reaching the leads from causing an electrical shunt. The resulting printhead dissipates excess heat from the chip well from the support.

    摘要翻译： 热加热器芯片（1）位于TAB电路带（5）的开口内，TAB引线（3）焊接到芯片。 转动该组件使得引线的下侧面向上，并且可固化的电绝缘液体被施加并固化以形成固体（11）。 然后使用导热粘合剂将芯片的底部附接到散热支架（7）。 引线上固化的固体可防止任何粘合剂到达引线引起电气分流。 所得到的打印头从芯片上消耗多余的热量。