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1.发明授权Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties 有权用于硅芯片的贴片组合物放置在具有改善的触变性能的平坦基底上公开(公告)号：US08657413B2
公开(公告)日：2014-02-25
申请号：US13008428
申请日：2011-01-18
IPC分类号： B41J2/01 , C09J163/02 , C09J183/10 , H01L21/00 , C08G59/24 , C08G59/30 , C08G59/50
CPC分类号： B41J2/01 , B41J2/0458 , C08G59/306 , C08G59/56 , C08K5/5415 , C09J163/00 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29011 , H01L2224/29013 , H01L2224/29034 , H01L2224/2919 , H01L2224/32225 , H01L2224/83192 , H01L2224/83855 , H01L2924/00013 , H01L2924/10253 , H01L2924/15787 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.
摘要翻译： 使用芯片附着组合物将硅芯片粘合在平坦的基板上。 芯片附着组合物包括具有刚性主链的可交联环氧树脂，环氧硅氧烷树脂，热解法二氧化硅填料，胺固化剂和硅烷偶联剂。 芯片附着组合物在形成喷墨打印头组件时将硅加热器芯片粘合在平坦陶瓷基板上是特别有用的。 芯片附着组合物允许将硅加热器芯片精确地放置在平坦的陶瓷基板上并显示出良好的耐油墨性。
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2.发明申请DIE ATTACH COMPOSITION FOR SILICON CHIP PLACEMENT ON A FLAT SUBSTRATE HAVING IMPROVED THIXOTROPIC PROPERTIES 有权具有改进的三面体性能的平坦基材上的硅芯片布置的附件组合物公开(公告)号：US20120182355A1
公开(公告)日：2012-07-19
申请号：US13008428
申请日：2011-01-18
CPC分类号： B41J2/01 , B41J2/0458 , C08G59/306 , C08G59/56 , C08K5/5415 , C09J163/00 , H01L24/28 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/29011 , H01L2224/29013 , H01L2224/29034 , H01L2224/2919 , H01L2224/32225 , H01L2224/83192 , H01L2224/83855 , H01L2924/00013 , H01L2924/10253 , H01L2924/15787 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00
摘要： A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.
摘要翻译： 使用芯片附着组合物将硅芯片粘合在平坦的基板上。 芯片附着组合物包括具有刚性主链的可交联环氧树脂，环氧硅氧烷树脂，热解法二氧化硅填料，胺固化剂和硅烷偶联剂。 芯片附着组合物在形成喷墨打印头组件时将硅加热器芯片粘合在平坦陶瓷基板上是特别有用的。 芯片附着组合物允许将硅加热器芯片精确地放置在平坦的陶瓷基板上并显示出良好的耐油墨性。
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3.发明申请METHOD OF RESTRICTING CHIP MOVEMENT UPON BONDING TO RIGID SUBSTRATE USING SPRAY COATABLE ADHESIVE 审中-公开使用喷涂粘合剂粘合到刚性基板上的芯片运动限制方法公开(公告)号：US20110318882A1
公开(公告)日：2011-12-29
申请号：US13168219
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anne Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： H01L21/50
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A method of bonding a chip to a wafer at precise alignment suitable for fabricating a heater chip in an ink jet printhead is provided. The method includes spray coating an adhesive composition on a surface of a substrate, aligning and tacking at least one chip to the substrate coated with the adhesive composition, exposing the substrate tacked with at least one chip coated with the adhesive composition to radiation and heat, and performing thermal compression bonding. The method uses a spray coatable adhesive composition comprising a thermally activated adhesive and a photoacid generator.
摘要翻译： 提供了一种以适合于在喷墨打印头中制造加热器芯片的精确对准将芯片结合到晶片的方法。 该方法包括将粘合剂组合物喷涂在基材的表面上，将至少一个芯片对准并固定到涂覆有粘合剂组合物的基材上，将涂覆有至少一个涂有粘合剂组合物的芯片的基材暴露于辐射和加热， 并进行热压接。 该方法使用包含热活化粘合剂和光致酸产生剂的喷涂可涂层粘合剂组合物。
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4.发明授权公开(公告)号：US08785524B2
公开(公告)日：2014-07-22
申请号：US13168063
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
摘要翻译： 公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。 粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。 环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。 粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。
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公开(公告)号：US20110319513A1
公开(公告)日：2011-12-29
申请号：US13168063
申请日：2011-06-24
申请人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
发明人： Xiaoming Wu , Paul Dryer , David Rhine , Anna Pearson , Jeanne Marie Saldanha Singh , Richard Wells , Joel Provence
IPC分类号： C09J163/00
CPC分类号： B41J2/1601 , B41J2/1623 , B41J2/1628 , B41J2/1645
摘要： A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.
摘要翻译： 公开了一种用于将硅模具接合到刚性基板的喷涂可涂层粘合剂组合物，优选的是硅衬底。 粘合剂组合物包括环氧树脂，热酸发生剂，光致酸产生剂和溶剂。 环氧基树脂包括固体双酚A环氧树脂和液体或半液体氢化双酚A环氧树脂的混合物，其重量比为约80:20至约65:35。 粘合剂组合物具有低粘度，其允许将其喷涂在刚性基材上并形成薄膜粘合剂，其允许将硅模具精确地放置在硅基材上。
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公开(公告)号：US20160312049A1
公开(公告)日：2016-10-27
申请号：US15199829
申请日：2016-06-30
申请人： Xiaorong Cai , Michael John Dixon , Yimin Guan , Ann P. Holloway , Jeanne Marie Saldanha Singh , Zhigang Xiao
发明人： Xiaorong Cai , Michael John Dixon , Yimin Guan , Ann P. Holloway , Jeanne Marie Saldanha Singh , Zhigang Xiao
IPC分类号： C09D11/03 , C09D11/107 , H05K1/03 , C09D11/30
CPC分类号： C09D11/03 , B05D3/0209 , B05D3/0254 , C09D11/101 , C09D11/107 , C09D11/30 , H05K1/0373 , H05K1/162 , H05K2201/0209 , H05K2203/013
摘要： An aqueous composition for forming a micro-fluid jet printable dielectric film layer, methods for forming dielectric film layers, and dielectric film layers formed by the method. The aqueous composition includes from about 5 to about 20 percent by 65 weight of a polymeric binder emulsion, from about 10 to about 30 percent by weight of a humectant, from about 0 to about 3 percent by weight of a surfactant, and an aqueous carrier fluid. The aqueous composition has a viscosity ranging from about 2 to about 6 centipoise at a temperature of about 23° C.
摘要翻译： 用于形成微流体喷射可印刷电介质膜层的水性组合物，用于形成电介质膜层的方法和通过该方法形成的电介质膜层。 水性组合物包括约5至约20重量％至65重量％的聚合物粘合剂乳液，约10至约30重量％的湿润剂，约0至约3重量％的表面活性剂和水性载体 流体。 含水组合物在约23℃的温度下具有约2至约6厘泊的粘度。
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公开(公告)号：US07784909B2
公开(公告)日：2010-08-31
申请号：US12021375
申请日：2008-01-29
IPC分类号： B41J2/14
CPC分类号： B41J2/17553 , B41J2/17526
摘要： An ink jetting structure includes a substrate that has a first surface and a second surface. A heater chip is mounted to the second surface of the substrate, and includes a first set of electrical contacts. A printhead circuit member has a third surface, a fourth surface, and an opening configured to receive the heater chip with the first set of electrical contacts of the heater chip being exposed through the opening. The third surface is mounted to the second surface of the substrate. The fourth surface has a second set of electrical contacts attached by wire bonds to the first set of electrical contacts. The third surface has a third set of electrical contacts electrically coupled to the second set of electrical contacts, and electrically connected to a flexible cable for coupling to corresponding contacts on a printer.
摘要翻译： 喷墨结构包括具有第一表面和第二表面的基底。 加热器芯片安装到基板的第二表面，并且包括第一组电触头。 打印头电路构件具有第三表面，第四表面和开口，其构造成接收加热器芯片，加热器芯片的第一组电触点通过开口露出。 第三表面安装到基板的第二表面。 第四表面具有通过引线键合连接到第一组电触点的第二组电触头。 第三表面具有电耦合到第二组电触头的第三组电触点，并且电连接到柔性电缆，用于耦合到打印机上的相应触点。
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公开(公告)号：US20100132874A1
公开(公告)日：2010-06-03
申请号：US12697308
申请日：2010-02-01
申请人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
发明人： Frank Edward Anderson , Michael John Dixon , Eric Spencer Hall , Elios Klemo , Bryan Dale McKinley , Jeanne Marie Saldanha Singh
IPC分类号： B29C65/02
CPC分类号： B41J2/14129 , B41J2/1603 , B41J2/1628 , B41J2/1632 , B41J2/1634 , B41J2202/03 , Y10T29/435 , Y10T29/49155 , Y10T29/49163 , Y10T29/49401 , Y10T428/24926
摘要： A composite ceramic substrate for receiving an ejection head chip for a micro-fluid ejection head and a method for making the composite ceramic substrate. The substrate includes a high temperature previously fired ceramic base having a substantially planarized first surface and at least one fluid supply slot therethrough. A low temperature co-fired ceramic (LTCC) tape layer bundle having at least two LTCC tape layers is attached to the ceramic base at an interface between the LTCC tape layer bundle and the first surface of the ceramic base. The LTCC tape layer bundle has at least one chip pocket therein and at least one of the LTCC tape layers includes a plurality of conductors.
摘要翻译： 一种用于接收用于微流体喷射头的喷射头芯片的复合陶瓷基板和用于制造复合陶瓷基板的方法。 衬底包括具有基本平坦化的第一表面的高温预先烧制的陶瓷基底和穿过其中的至少一个流体供给槽。 具有至少两个LTCC带层的低温共烧陶瓷（LTCC）带层束在LTCC带层束和陶瓷基底的第一表面之间的界面附着在陶瓷基底上。 LTCC带层束在其中具有至少一个芯片袋，并且LTCC带层中的至少一个包括多个导体。
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9.发明申请GRADIENT LAYERS IN MULTI-LAYER CIRCUITS AND METHODS AND CIRCUITS RELATED TO THE SAME 审中-公开多层电路中的梯度层和与之相关的方法和电路公开(公告)号：US20080044631A1
公开(公告)日：2008-02-21
申请号：US11838257
申请日：2007-08-14
CPC分类号： H01C17/065 , H05K3/1208 , H05K3/125 , H05K3/386 , H05K2201/0209 , H05K2201/0269 , H05K2203/013 , Y10T428/24628
摘要： Methods for improving adherence of conductive traces, such as in a printed circuit, and circuits having conductive traces formed in accordance with such methods. One such method includes depositing a fluid composition receiving layer adjacent to a substrate, and depositing a gradient layer adjacent to the fluid composition receiving layer. The gradient layer is comprised of a fluid composition providing the fluid composition receiving layer and a fluid composition providing a conductive layer. A conductive layer composition is deposited adjacent to the gradient layer to provide the conductive layer.
摘要翻译： 用于改善导电迹线的粘附性的方法，例如在印刷电路中，以及根据这些方法形成的具有导电迹线的电路。 一种这样的方法包括沉积与衬底相邻的流体组合物接收层，以及沉积与流体组合物接收层相邻的梯度层。 梯度层由提供流体组合物接收层的流体组合物和提供导电层的流体组合物组成。 导电层组合物沉积在梯度层附近以提供导电层。
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10.发明授权Method and apparatus for adhesively securing ink jet pen components using thin film adhesives 有权使用薄膜粘合剂粘合地固定喷墨笔组件的方法和装置公开(公告)号：US06758934B2
公开(公告)日：2004-07-06
申请号：US10305636
申请日：2002-11-27
IPC分类号： B32B3118
CPC分类号： B41J2/17536 , Y10T156/1062 , Y10T156/1064 , Y10T156/108 , Y10T156/1082 , Y10T156/12 , Y10T156/1322
摘要： The invention relates to a method for attaching microelectronic devices, circuit boards and the like to a surface, and is particularly suitable for attaching a plurality of a semiconductor chips to an ink jet pen body. The method includes the steps of (a) providing a sheet of a thin film adhesive material having a first surface and a second surface opposite the first surface, the second surface being releasably attached to a carrier web; (b) simultaneously making a plurality of cuts in the sheet of thin film adhesive material, the cuts extending from the first surface to an interface between the second surface and the carrier web without significantly extending into the carrier web to provide one or more cut portions of adhesive film; (c) removing each cut portion of adhesive film from the carrier web; (d) engaging the second surface of each of the cut portions with predetermined locations on a receiving surface; and (e) providing one or more semiconductor chips in a desirably aligned configuration with respect to the predetermined locations and contacting each semiconductor chip with first surface of each of the cut portions. Use of the method and apparatus of the invention provides significant improvement in the application of adhesive films to surfaces in electronic component assembly.
摘要翻译： 本发明涉及一种将微电子器件，电路板等附着在表面上的方法，特别适用于将多个半导体芯片附着到喷墨笔体上。 该方法包括以下步骤：（a）提供具有第一表面和与第一表面相对的第二表面的薄膜粘合材料片，所述第二表面可释放地附接到载体网; （b）同时在薄膜粘合剂材料片上进行多个切口，切口从第一表面延伸到第二表面和载体网之间的界面，而不会显着延伸到载体网中以提供一个或多个切割部分 的胶膜; （c）从载体网上去除粘合膜的每个切割部分; （d）将每个切割部分的第二表面与接收表面上的预定位置接合; 和（e）相对于预定位置提供期望对准的一个或多个半导体芯片，并使每个半导体芯片与每个切割部分的第一表面接触。 使用本发明的方法和装置提供了在电子部件组件中将粘合剂膜应用于表面方面的显着改进。
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