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    ELECTRIC MOTOR ASSEMBLY USING POLYMER-ONLY FASTENING AND METHODS OF MANUFACTURING THE SAME
    41.
    发明申请
    ELECTRIC MOTOR ASSEMBLY USING POLYMER-ONLY FASTENING AND METHODS OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220115922A1

    公开(公告)日：2022-04-14

    申请号：US17066520

    申请日：2020-10-09

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Anthony M. Coppola ,  Alireza Fatemi ,  William T. Ivan ,  Song He ,  Yew Sum Leong

    IPC: H02K1/18 ,  H02K1/20 ,  H02K9/19 ,  H02K11/01 ,  H02K15/02 ,  H02K15/12

    Abstract: An electric motor assembly includes a housing having a generally cylindrical inner surface defining a generally cylindrical cavity within the housing, a stator operatively disposed within the generally cylindrical cavity, the stator including a plurality of stacked laminations wherein each lamination has an outer circumferential edge and a plurality of finger elements extending inward, and a layer of polymer disposed between a generally cylindrical outer surface of the stator and the generally cylindrical inner surface of the housing, such that the stator is fastened to the housing by the polymer. A method of manufacturing the electric motor assembly includes disposing a stator within a housing such that a gap is defined between the stator and the housing and the stator is not directly connected to the housing, and substantially filling the gap with a polymer capable of fastening the stator to the housing by only the polymer.

    ELECTRONIC POWER MODULE ASSEMBLIES AND CONTROL LOGIC WITH DIRECT-COOLING VAPOR CHAMBER SYSTEMS
    42.
    发明申请
    ELECTRONIC POWER MODULE ASSEMBLIES AND CONTROL LOGIC WITH DIRECT-COOLING VAPOR CHAMBER SYSTEMS 有权

    公开(公告)号：US20210195808A1

    公开(公告)日：2021-06-24

    申请号：US16724998

    申请日：2019-12-23

    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

    Inventor： Ming Liu ,  Anthony M. Coppola ,  Kestutis A. Sonta

    IPC: H05K7/20 ,  B60L50/51 ,  B60L50/60

    Abstract: Presented are electronic power module assemblies with direct-cooling vapor chamber systems, methods for making/using such power module assemblies, and vehicles equipped with such power module assemblies. A power module assembly includes an outer housing with an internal coolant chamber that circulates therethrough a coolant fluid. A power semiconductor switching device is mounted to the module's housing, separated from the coolant chamber and isolated from the coolant fluid. The power device selectively modifies electric current transmitted between a power source and an electrical load. A two-phase, heat-spreading vapor chamber device includes an outer casing with a casing segment that is mounted to the module housing, fluidly sealed to the internal coolant chamber and exposed to the coolant fluid. Another casing segment includes an inboard-facing casing surface that is mounted to an outboard-facing surface of the power device, and an outboard-facing casing surface mounted to an inboard-facing surface of the power device.

    Method of forming at least one channel within a substrate and a system
    43.
    发明授权
    Method of forming at least one channel within a substrate and a system 有权

    公开(公告)号：US11020888B2

    公开(公告)日：2021-06-01

    申请号：US16033914

    申请日：2018-07-12

    Applicant: GM Global Technology Operations LLC

    Inventor： Anthony M. Coppola ,  Hamid G. Kia

    IPC: B29C45/14 ,  B29C45/44 ,  B29L1/00

    Abstract: A method of forming at least one channel within a substrate includes coupling a fitting to a mold, and securing together the fitting and an insert via threads. A system includes a mold configured to form the substrate. The method also includes inserting a component into an opening of the fitting. Part of the component is disposed outside of the opening of the fitting, and the component is utilized to define the at least one channel within the substrate. The method further includes molding at least one material to the component and the insert to form the substrate. Furthermore, the method includes removing the fitting from the insert while the insert remains molded to the substrate.

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