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公开(公告)号:US11760010B2
公开(公告)日:2023-09-19
申请号:US17561425
申请日:2021-12-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Yan Zhao , Kristopher J. Erickson , Aja Hartman , Lihua Zhao , Sterling Chaffins , Kevin P. DeKam
IPC: B29C64/165 , B33Y10/00 , B29C64/112 , B29C64/393 , B33Y70/10 , B33Y70/00 , B33Y30/00 , B29C64/20 , B33Y50/02 , B29K77/00 , B29K105/00 , B29K105/16 , B29K505/14 , B29K507/04
CPC classification number: B29C64/165 , B29C64/112 , B33Y10/00 , B33Y70/00 , B33Y70/10 , B29C64/20 , B29C64/393 , B29K2077/00 , B29K2105/005 , B29K2105/0023 , B29K2105/0032 , B29K2105/162 , B29K2505/14 , B29K2507/04 , B29K2995/0005 , B33Y30/00 , B33Y50/02
Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.
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公开(公告)号:US11642842B2
公开(公告)日:2023-05-09
申请号:US16603303
申请日:2018-01-26
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Sterling Chaffins , Anthony P. Holden , Katrina Donovan , Noemie Midrez , Garry Hinch
IPC: B29C64/165 , B33Y10/00 , B29C64/291 , B22F10/14 , B33Y70/10 , C09D11/101 , C09D11/102 , C09D11/38 , C09D11/54 , B22F12/13 , B22F12/63
CPC classification number: B29C64/165 , B22F10/14 , B29C64/291 , B33Y10/00 , B33Y70/10 , C09D11/101 , C09D11/102 , C09D11/38 , C09D11/54 , B22F12/13 , B22F12/63
Abstract: In an example of a method for three-dimensional (3D) printing, a build material composition is applied to form a build material layer. The build material composition includes a polymeric or polymeric composite build material, and a precipitating agent. Based on a 3D object model, a fusing agent is selectively applied on at least a portion of the build material composition. The fusing agent includes a radiation absorber, which the precipitating agent precipitates. The build material composition is exposed to radiation to fuse the at least the portion to form a layer of a 3D part.
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公开(公告)号:US11458675B2
公开(公告)日:2022-10-04
申请号:US16325243
申请日:2016-10-25
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Sterling Chaffins , Cassady Sparks Roop , Kevin P DeKam , Vladek Kasperchik , Ali Emamjomeh , Johnathon Holroyd , Stephen G Rudisill , Alexey S Kabalnov
IPC: B29C64/00 , B29C64/153 , B29C64/336 , C08L67/04 , B29C70/88 , C08K3/22 , C09D11/40 , C08K3/08 , C09D11/52 , C09D11/322 , B29C64/205 , B33Y30/00 , B33Y50/00 , B33Y40/00 , B33Y80/00 , B29C64/255 , B29C64/227 , B29C64/307 , B29C64/176 , B29C64/182 , B29C64/25 , B33Y40/20 , B29C64/10 , B29C64/20 , B29C64/245 , B33Y99/00 , B29C64/30 , B33Y40/10 , B29C64/40 , B29K505/08 , B33Y70/00 , B33Y10/00 , C08L77/02
Abstract: The present disclosure is drawn to material sets for 3-dimensional printing. The material set can include a thermoplastic polymer powder having an average particle size from 20 μm to 200 μm, a conductive fusing agent composition including a transition metal, and nonconductive fusing agent composition. The nonconductive fusing agent composition can include transition metal oxide bronze particles.
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公开(公告)号:US11427725B2
公开(公告)日:2022-08-30
申请号:US16074235
申请日:2016-04-28
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: James William Stasiak , Garry Hinch , Sterling Chaffins , Kevin P. DeKam
IPC: C09D11/50 , B33Y30/00 , B33Y70/00 , B29C64/112 , B33Y80/00 , B29C64/165 , C09D11/037 , C09D11/102 , C09D11/322 , C09D11/54 , B82Y20/00 , B82Y40/00
Abstract: The present disclosure is drawn to material sets for 3-dimensional printing, 3-dimensional printing systems, and 3-dimensional printed parts. A material set can include a thermoplastic polymer powder having an average particle size from 20 μm to 100 μm, a photoluminescent ink including a photoluminescent agent, and a fusing ink. The fusing ink can include a fusing agent capable of absorbing electromagnetic radiation to produce heat.
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公开(公告)号:US20220118694A1
公开(公告)日:2022-04-21
申请号:US17561425
申请日:2021-12-23
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Yan Zhao , Kristopher J. Erickson , Aja Hartman , Lihua Zhao , Sterling Chaffins , Kevin P. DeKam
IPC: B29C64/165 , B33Y70/00 , B29C64/112 , B33Y10/00 , B29K105/00 , B29K505/14 , B29C64/393 , B29K77/00 , B29K105/16 , B33Y50/02 , B33Y30/00 , B29K507/04 , B29C64/20
Abstract: In an example method for forming three-dimensional (3D) printed electronic parts, a build material is applied. An electronic agent is selectively applied in a plurality of passes on a portion of the build material. A fusing agent is also selectively applied on the portion of the build material. The build material is exposed to radiation in a plurality of heating events. During at least one of the plurality of heating events, the portion of the build material in contact with the fusing agent fuses to form a region of a layer. The region of the layer exhibits an electronic property. An order of the plurality of passes, the selective application of the fusing agent, and the plurality of heating events is controlled to control a mechanical property of the layer and the electronic property of the region.
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公开(公告)号:US11304313B2
公开(公告)日:2022-04-12
申请号:US16491186
申请日:2017-12-15
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Sterling Chaffins , Kevin P. Dekam , Thomas A. Saksa , Juan Sebastian Ramirez
IPC: H05K3/46 , B29C64/188 , B29C64/165 , H05K1/03 , H05K3/12 , B33Y10/00 , B33Y70/00
Abstract: According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
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公开(公告)号:US11001050B2
公开(公告)日:2021-05-11
申请号:US16073585
申请日:2016-04-20
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Sterling Chaffins , Kevin P. DeKam , Cassady S. Roop , Bret McHuron-Guss
IPC: B33Y80/00
Abstract: The present disclosure is drawn to material sets for 3-dimensional printing, 3-dimensional printing systems, and 3-dimensional printed parts. A material set can include a thermoplastic polymer powder having an average particle size from 20 μm to 100 μm, an x-ray contrast ink including a jettable x-ray contrast agent, and a fusing ink. The fusing ink can include a fusing agent capable of absorbing electromagnetic radiation to produce heat.
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公开(公告)号:US10654268B2
公开(公告)日:2020-05-19
申请号:US16210143
申请日:2018-12-05
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Gerard Alzona , David Maxfield , Dustin W Blair , Sterling Chaffins , Andrew L Van Brocklin
Abstract: In some examples, a controller receives impedance sensor values from an impedance sensor in a printhead, determines whether the impedance sensor values correlate to a production of an effective drive bubble for the printhead, and issues a command to modify a firing parameter for a fluid ejector of the printhead based on the impedance sensor values.
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公开(公告)号:US09707766B2
公开(公告)日:2017-07-18
申请号:US15111148
申请日:2014-01-29
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Sterling Chaffins , Kevin P. DeKam , Chien-Hua Chen
CPC classification number: B41J2/175 , B29B11/06 , B41J2/1603 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1632 , B41J2/1637 , B41J2002/14362 , H01L2924/181 , H01L2924/186
Abstract: A fluid directing assembly can comprise a molded support comprising a modified epoxy molded compound which includes epoxy resin, cross-linker, filler, and is devoid of wax release agent. The assembly can also include a silicon die attached to the molded support and wherein the silicon die and the molded support define a fluid directing channel.
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公开(公告)号:US20170066940A1
公开(公告)日:2017-03-09
申请号:US15308964
申请日:2014-06-04
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Larrie Deardurff , Jayprakash C. Bhatt , Sterling Chaffins , Cory J. Ruud
IPC: C09D11/38 , C09D11/102 , B41J2/01 , C09D11/40 , C09D11/322 , C09D11/36 , C09D11/033
CPC classification number: C09D11/38 , B41J2/01 , C09D11/033 , C09D11/102 , C09D11/322 , C09D11/36 , C09D11/40
Abstract: The present disclosure is drawn to inkjet inks and related methods. The inkjet ink includes water, from 5 wt % to 50 wt % of an organic solvent system, from 2 wt % to 9 wt % pigment solids, from 0.1 wt % to 3 wt % polyurethane binder, and from 0.4 wt % to 1.5 wt % of an oleyl or stearyl type polyoxyethylene glycol ether surfactant.
Abstract translation: 本公开涉及喷墨油墨和相关方法。 喷墨油墨包括水,5重量%至50重量%的有机溶剂体系,2重量%至9重量%的颜料固体,0.1重量%至3重量%的聚氨酯粘合剂,以及0.4重量%至1.5重量% 油基或硬脂基型聚氧乙烯醚醚表面活性剂的%。
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