摘要:
A method is provided for fabricating stacked non-volatile memory cells. A semiconductor wafer is provided having a plurality of diffusion regions forming buried bit lines. A charge-trapping layer and a conductive layer are deposited on the surface of the semiconductor wafer. Using a mask layer on top of the conductive layer, contact holes are formed wherein an insulating layer is formed. An etch stop layer is deposited on the surface of the semiconductor wafer. Above the etch stop layer, a dielectric layer is deposited and is patterned so as to form contact holes. Subsequently, the contact holes are enlarged through the etch stop layer and the insulating layer to the buried bit lines.
摘要:
Data carrier card having a card body of a flat form and having a recess, a carrier, a chip arranged on the carrier and inserted in the recess of the card body, external contact elements arranged on the carrier and electrically connected to the chip via conductor runs, and a cover covering the recess in operative connection with the carrier such that the carrier is held along the bottom in the recess, wherein the external contact elements and the chip are arranged on a same side of the carrier.
摘要:
In the method, trenches are etched and, in between, bit lines (8) are in each case arranged on doped source/drain regions (3, 4). Storage layers (5, 6, 7) are applied and gate electrodes (2) are arranged at the trench walls. After the introduction of polysilicon, which is provided for the gate electrodes (2), into the trenches, the top side is ground back in a planarizing manner until the top side of the covering layer (16) is reached, and afterward a polysilicon layer (18), which is provided for the word lines, is applied over the whole area and patterned to form the word lines.
摘要:
A memory cell includes a channel region between source/drain regions at the top side of a semiconductor body and is provided, transversely with respect to the longitudinal direction, with a bulge formed in the semiconductor material. This results in a uniform distribution of the strength of a radially directed electric field and avoids field strength spikes at lateral edges of the channel region. A storage layer sequence is situated between the channel region and the gate electrode as part of a word line.
摘要:
The charge-trapping layer comprises two strips above the source and drain junctions. The thicknesses of the charge-trapping layer and the gate dielectric are chosen to facilitate Fowler-Nordheim-tunnelling of electrons into the strips during an erasure process. Programming is performed by injection of hot holes into the strips individually for two-bit storage.
摘要:
The invention provides an integration scheme for a memory cell array, especially a charge-trapping memory cell array, comprising an architecture of local interconnects, which enables to avoid nitride insulations of wordline stacks and to produce CMOS devices of different structures and dimensions in standard technology along with the tinier memory cell transistors.
摘要:
Transistor bodies of semiconductor material located at a main surface of a semiconductor substrate between shallow trench isolations are provided with a rounded or curved upper surface. A floating gate electrode is arranged above said upper surface and electrically insulated from the semiconductor material by a tunnel dielectric having essentially the same tiny thickness throughout a primary tunnel area encompassing the area of curvature. The floating gate electrode may bridge the transistor body and is covered with a coupling dielectric provided for a control gate electrode, which forms part of a wordline.
摘要:
The present invention relates to a flash memory cell comprising a silicon substrate having an active region comprising a channel region and source-/drain-regions, the active region comprising a projecting portion, which projecting portion at least comprising said channel region; a tunneling dielectric layer formed on the surface of said active region; a floating gate formed on the surface of said tunneling dielectric layer for storing electric charges; an inter-gates coupling dielectric layer formed on the surface of said floating gate, and a control gate formed on the surface of said inter-gates coupling dielectric layer, wherein said floating gate is formed to have a groove-like shape for at least partly encompassing said projecting portion of said active region. This invention further relates to a flash memory device comprising such flash memory cells, as well as a manufacturing method thereof.
摘要:
A memory layer intended for trapping charge carriers over a source region and a drain region is interrupted over the channel so that a diffusion of the charge carriers, which are trapped over the source region and over the drain region, is prevented. The memory layer is limited to regions over the parts of the source region and of the drain region facing the channel and is embedded all around in oxide.
摘要:
In a memory cell array comprising charge-trapping memory cells, local interconnects along the direction of the wordlines for connecting source/drain regions of adjacent memory cells to bitlines are formed by selective deposition of silicon or polysilicon bridges at sidewalls of the semiconductor material within upper recesses in the dielectric material of shallow trench isolations running across the wordlines.