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公开(公告)号：US20090296412A1
公开(公告)日：2009-12-03
申请号：US12471579
申请日：2009-05-26
申请人： Kozo Ogawa , Aiko Takahashi , Nobuhiko Betsuda , Hiroki Tamai , Kiyoshi Nishimura , Akiko Saito , Ryotaro Matsuda
发明人： Kozo Ogawa , Aiko Takahashi , Nobuhiko Betsuda , Hiroki Tamai , Kiyoshi Nishimura , Akiko Saito , Ryotaro Matsuda
CPC分类号： F21V29/004 , F21S8/043 , F21S8/06 , F21V21/29 , F21V21/30 , F21V23/005 , F21V29/507 , F21V29/73 , F21V29/75 , F21V29/763 , F21V29/773 , F21V29/89 , F21Y2105/00 , F21Y2115/10 , F21Y2115/15
摘要： A spotlight is provided with a substrate having LEDs disposed thereon and a main body casing on which the substrate is provided. The main body casing has a rear side portion having thermal conductivity, which is thermally coupled to the substrate, and is capable of changing the irradiation angle of light emitted from the LEDs. A plurality of heat-radiating fins for forming grooves operating as a plurality of convection paths along the direction of changing the irradiation angle are provided on the rear side portion of the main body casing.
摘要翻译： 聚光灯具有设置有LED的基板和设置有基板的主体外壳。 主体外壳具有热传导性的后侧部分，其热耦合到基板，并且能够改变从LED发射的光的照射角度。 在主体壳体的后侧部分设置有用于形成沿着改变照射角度的方向作为多个对流路径工作的槽的多个散热片。
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42.发明授权公开(公告)号：US08816381B2
公开(公告)日：2014-08-26
申请号：US12912434
申请日：2010-10-26
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2933/0066 , H05K3/242 , H05K2201/09036 , H05K2201/10106 , H05K2201/2054 , H05K2203/175 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected.
摘要翻译： 根据一个实施例，发光器件包括衬底，多个焊盘和多个发光元件。 焊盘具有导电性，并且布置在基板上。 通过电镀形成的反射层设置在每个焊盘的表面上。 发光元件安装在焊盘上。 凹陷部分留在基板上。 凹陷部分通过去除衬底上的图案而形成在衬底上，衬垫被电连接。
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公开(公告)号：US08616732B2
公开(公告)日：2013-12-31
申请号：US13024376
申请日：2011-02-10
IPC分类号： F21V7/00
CPC分类号： H01L25/0753 , F21K9/68 , F21S8/04 , F21V19/001 , F21V19/0055 , F21V31/04 , F21Y2103/10 , F21Y2115/10 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H05K3/284 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device comprises a substrate on a surface of which a light-emitting element is mounted, a light reflection layer formed on a second area of the surface of the substrate other than a first area on which the light-emitting element is mounted, and a sealing member sealing the light-emitting element. An engagement protrusion part protruding toward the sealing member is provided at an edge part of the light reflection layer at which the light reflection layer is in contact with the area on which the light-emitting element is mounted. The engagement protrusion part juts out into the sealing member to prevent exfoliation of the sealing member.
摘要翻译： 根据一个实施例，发光装置包括其表面上安装有发光元件的基板，形成在基板表面的第二区域上的光反射层，除了第一区域之外，光源 安装元件和密封发光元件的密封件。 在光反射层与安装有发光元件的区域接触的光反射层的边缘部分设置有朝向密封构件突出的接合突起部。 接合突出部突出到密封构件中，以防止密封构件的剥离。
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公开(公告)号：US08232709B2
公开(公告)日：2012-07-31
申请号：US12909535
申请日：2010-10-21
CPC分类号： H01L33/641 , F21K9/00 , F21S8/02 , F21V17/12 , F21V23/00 , F21V29/75 , F21V29/76 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H05K1/0209 , H05K1/0306 , H05K2201/09136 , H05K2201/09781 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting apparatus includes an insulating base made of ceramics, an obverse metallic component dividedly arranged on the front surface of the insulating base, semiconductor light-emitting elements mounted on the obverse metallic component, and a reverse metallic component arranged on a back surface of the insulating base and having a thickness same as or smaller than a thickness of the obverse metallic component and a volume equal to 50% or larger of a volume of the obverse metallic component.
摘要翻译： 根据一个实施例，一种发光装置包括由陶瓷制成的绝缘基底，分隔地布置在绝缘基底的前表面上的正面金属部件，安装在正面金属部件上的半导体发光元件和反向金属部件 布置在绝缘基底的背面上，其厚度等于或小于正金属成分的厚度，并且体积等于正面金属成分的体积的50％以上。
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公开(公告)号：USD656263S1
公开(公告)日：2012-03-20
申请号：US29369103
申请日：2010-09-02
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公开(公告)号：US20110199772A1
公开(公告)日：2011-08-18
申请号：US13024376
申请日：2011-02-10
CPC分类号： H01L25/0753 , F21K9/68 , F21S8/04 , F21V19/001 , F21V19/0055 , F21V31/04 , F21Y2103/10 , F21Y2115/10 , H01L33/54 , H01L33/60 , H01L2224/48091 , H01L2224/73265 , H05K3/284 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device comprises a substrate on a surface of which a light-emitting element is mounted, a light reflection layer formed on a second area of the surface of the substrate other than a first area on which the light-emitting element is mounted, and a sealing member sealing the light-emitting element. An engagement protrusion part protruding toward the sealing member is provided at an edge part of the light reflection layer at which the light reflection layer is in contact with the area on which the light-emitting element is mounted. The engagement protrusion part juts out into the sealing member to prevent exfoliation of the sealing member.
摘要翻译： 根据一个实施例，发光装置包括其表面上安装有发光元件的基板，形成在基板表面的第二区域上的光反射层，除了第一区域之外，光源 安装元件和密封发光元件的密封构件。 在光反射层与安装有发光元件的区域接触的光反射层的边缘部分设置有朝向密封构件突出的接合突起部。 接合突出部突出到密封构件中，以防止密封构件的剥离。
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47.发明申请公开(公告)号：US20110101384A1
公开(公告)日：2011-05-05
申请号：US12912434
申请日：2010-10-26
CPC分类号： H01L25/0753 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2933/0066 , H05K3/242 , H05K2201/09036 , H05K2201/10106 , H05K2201/2054 , H05K2203/175 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting device includes a substrate, a plurality of pads and a plurality of light-emitting elements. The pads has electric conductance, and are arranged on the substrate. A reflecting layer which is formed by electroplating is provided on a surface of each of the pads. The light-emitting elements are mounted on the pads. A depressed part is left on the substrate. The depressed part is formed on the substrate by removing a pattern on the substrate, by which the pads are electrically connected.
摘要翻译： 根据一个实施例，发光器件包括衬底，多个焊盘和多个发光元件。 焊盘具有导电性，并且布置在基板上。 通过电镀形成的反射层设置在每个焊盘的表面上。 发光元件安装在焊盘上。 凹陷部分留在基板上。 凹陷部分通过去除衬底上的图案而形成在衬底上，衬垫被电连接。
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公开(公告)号：US20110089805A1
公开(公告)日：2011-04-21
申请号：US12909535
申请日：2010-10-21
IPC分类号： F21V29/00
CPC分类号： H01L33/641 , F21K9/00 , F21S8/02 , F21V17/12 , F21V23/00 , F21V29/75 , F21V29/76 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L2224/48091 , H01L2224/73265 , H01L2924/01322 , H05K1/0209 , H05K1/0306 , H05K2201/09136 , H05K2201/09781 , H01L2924/00014 , H01L2924/00
摘要： According to one embodiment, a light-emitting apparatus includes an insulating base made of ceramics, an obverse metallic component dividedly arranged on the front surface of the insulating base, semiconductor light-emitting elements mounted on the obverse metallic component, and a reverse metallic component arranged on a back surface of the insulating base and having a thickness same as or smaller than a thickness of the obverse metallic component and a volume equal to 50% or larger of a volume of the obverse metallic component.
摘要翻译： 根据一个实施例，一种发光装置包括由陶瓷制成的绝缘基底，分隔地布置在绝缘基底的前表面上的正面金属部件，安装在正面金属部件上的半导体发光元件和反向金属部件 布置在绝缘基底的背面上，其厚度等于或小于正金属成分的厚度，并且体积等于正面金属成分的体积的50％以上。
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公开(公告)号：US20090290346A1
公开(公告)日：2009-11-26
申请号：US12467395
申请日：2009-05-18
申请人： Kozo Ogawa , Kiyoshi Nishimura , Nobuhiko Betsuda , Hiroki Tamai , Akiko Saito
发明人： Kozo Ogawa , Kiyoshi Nishimura , Nobuhiko Betsuda , Hiroki Tamai , Akiko Saito
IPC分类号： F21V21/00
CPC分类号： F21K9/00 , F21S2/005 , F21V17/12 , F21V19/0035 , F21V19/0055 , F21V23/005 , F21V29/505 , F21V29/507 , F21V29/713 , F21V29/74 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： The light source unit is provided with a substrate and a decorative cover having thermal conductivity. The substrate includes a circuit pattern area, in which a plurality of LED chips are disposed, at the middle part thereof, has thermal conductivity, and transmits heat from the circuit pattern area to an area in the outer circumferential direction thereof. The decorative cover encloses the substrate, is electrically insulated from the circuit pattern area, and is thermally coupled to the surface side of the substrate at the periphery of the circuit pattern area by being face-contacted thereto. Heat of the substrate can be radiated by the decorative cover while securing an electric insulation property with respect to the circuit pattern area.
摘要翻译： 光源单元设置有基板和具有导热性的装饰盖。 基板包括在其中间部分设置有多个LED芯片的电路图形区域，具有导热性，并且将热量从电路图案区域传递到其外周方向的区域。 装饰盖包围基板，与电路图形区域电绝缘，并且通过与电路图形区域的周边面接触而与基板的表面侧热耦合。 可以通过装饰盖辐射基板的热量，同时确保相对于电路图案区域的电绝缘性能。
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