Choke coil
    41.
    发明授权
    Choke coil 失效
    扼流线圈

    公开(公告)号:US5831505A

    公开(公告)日:1998-11-03

    申请号:US921594

    申请日:1997-09-02

    摘要: A choke coil equipped with a bobbin which is easy to form, which is resistant to mechanical impacts and which is light in weight and inexpensive. A bobbin 2 is formed, for example, by fitting or gluing together a bobbin member 21 formed of a magnetic substance and a bobbin member 22 formed of a non-magnetic substance. The magnetic substance bobbin member 21 is equipped with a core portion 23a with flange members 24a and 25a at the ends thereof and a flange member 26a provided in the central section thereof. The non-magnetic substance bobbin member 22 is equipped with a tubular portion 23b with flange members 24b and 25b provided at the ends thereof and a flange member 26b provided in the central section thereof. A tubular body portion 23 of the bobbin 2 is formed by the core portion 23a and the tubular portion 23b, and flange portions 24, 25 and 26 of the bobbin 2 are respectively formed by flange members 24a/24b, 25a/25b and 26a/26b.

    摘要翻译: 配备有容易形成的筒管的扼流圈,其耐机械冲击,重量轻且价格便宜。 线轴2例如通过将由磁性物质形成的线轴部件21和由非磁性物质形成的线轴部件22嵌合在一起而形成。 磁性物质线轴构件21在其端部设置有具有凸缘构件24a和25a的芯部23a和设置在其中心部分的凸缘构件26a。 非磁性体线轴构件22配备有在其端部设置有凸缘构件24b,25b的管状部23b和设置在其中央部的凸缘构件26b。 筒管2的筒状体部23由芯部23a和管状部23b形成,筒管2的凸缘部24,25和26分别由凸缘部件24a / 24b,25a / 25b,26a / 26b。

    Novel organosilicon compound
    42.
    发明授权
    Novel organosilicon compound 失效
    新型有机硅化合物

    公开(公告)号:US4652663A

    公开(公告)日:1987-03-24

    申请号:US862676

    申请日:1986-05-13

    CPC分类号: C07F7/025 C07F7/1836

    摘要: A class of novel organosilane compounds are disclosed as represented by the general formulaRSi(OCH.sub.2 CF.sub.3).sub.3,in which R is an atom or group selected from the class consisting of a hydrogen atom, unsaturated monovalent aliphatic hydrocarbon groups having from 2 to 20 carbon atoms, monovalent aryl groups and monovalent organic groups having from 3 to 20 carbon atoms and containing at least one hetero atom, i.e. an atom other than carbon and hydrogen atoms, such as oxygen, halogens, sulfur and nitrogen, the said hetero atom-containing organic group being bonded to the silicon atom through a carbon-to-silicon linkage. Several particular compounds belonging to the class were synthesized and identified.

    摘要翻译: 公开了一类由通式RSi(OCH2CF3)3表示的新型有机硅烷化合物,其中R是选自氢原子,具有2至20个碳原子的不饱和一价脂族烃基的原子或基团 具有3至20个碳原子并含有至少一个杂原子的单价芳基和一价有机基团,即除碳和氢原子之外的原子,如氧,卤素,硫和氮,所述含杂原子的有机物 基团通过碳 - 硅键连接到硅原子上。 合成并鉴定了属于该类的几种特定化合物。

    Semiconductor integrated circuit device, electronic apparatus, and charging controller for secondary battery
    44.
    发明授权
    Semiconductor integrated circuit device, electronic apparatus, and charging controller for secondary battery 有权
    半导体集成电路器件,电子设备和二次电池充电控制器

    公开(公告)号:US08860376B2

    公开(公告)日:2014-10-14

    申请号:US12664125

    申请日:2008-07-02

    IPC分类号: H02J7/04 H01M10/44 H02J7/00

    摘要: A charging control circuit for a secondary battery includes a temperature detection terminal for detecting the temperature of a secondary battery from an input detected voltage; a temperature comparison part having four threshold voltages corresponding to four reference temperatures, the temperature comparison part being configured to compare the four threshold voltages with the detected voltage input to the temperature detection terminal and to output a temperature range signal indicating the temperature range of the detected voltage; and a control part configured to control a charging current and/or a charging voltage based on the temperature range signal output from the temperature comparison part.

    摘要翻译: 二次电池的充电控制电路包括:温度检测端子,用于从输入检测电压检测二次电池的温度; 温度比较部分具有对应于四个参考温度的四个阈值电压,所述温度比较部分被配置为将四个阈值电压与输入到温度检测端子的检测电压进行比较,并输出指示检测到的温度范围的温度范围信号 电压; 以及控制部,被配置为基于从所述温度比较部输出的温度范围信号来控制充电电流和/或充电电压。

    Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body
    45.
    发明授权
    Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body 有权
    半导体晶片处理带卷绕体,半导体晶片加工带贴附装置以及半导体晶片加工带卷绕体的半导体晶片处理装置

    公开(公告)号:US08392011B2

    公开(公告)日:2013-03-05

    申请号:US11476382

    申请日:2006-06-28

    CPC分类号: H01L21/67294

    摘要: A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.

    摘要翻译: 提供半导体晶片处理带贴附装置,并且能够在最佳条件下将半导体晶片处理带粘贴到半导体晶片处理带上,该条件基于已经写入数据载体成员并从数据载体读取的处理数据 不像常规方法那样访问主机。 半导体晶片处理带贴附装置包括:馈送装置,其具有可以可拆卸地安装半导体晶片加工带卷绕体的馈送轴; 用于读取和写入已经写入到半导体晶片处理带卷绕体的数据载体构件的处理数据的磁带数据读/写装置; 以及胶带粘贴装置,用于根据由磁带数据读/写装置读取的处理数据,将从馈送装置输出的半导体晶片处理带粘贴到半导体晶片。

    Current source circuit and delay circuit and oscillating circuit using the same
    46.
    发明授权
    Current source circuit and delay circuit and oscillating circuit using the same 有权
    电流源电路和延迟电路与使用振荡电路相同

    公开(公告)号:US08248176B2

    公开(公告)日:2012-08-21

    申请号:US12962698

    申请日:2010-12-08

    IPC分类号: H03L5/00 G01J5/00

    摘要: A disclosed current source circuit includes a current mirror circuit having two enhancement-type MOS transistors, a depletion-type MOS transistor configured to be connected to a drain of one of the two enhancement-type MOS transistors and to function as a constant current source, and a resistor configured to have a negative temperature property and be connected to a source of the one of the two enhancement-type MOS transistors.

    摘要翻译: 所公开的电流源电路包括具有两个增强型MOS晶体管的电流镜电路,耗尽型MOS晶体管被配置为连接到两个增强型MOS晶体管之一的漏极并用作恒流源, 以及被配置为具有负温度特性并连接到两个增强型MOS晶体管中的一个的源极的电阻器。

    Varistor
    47.
    发明授权
    Varistor 有权
    压敏电阻

    公开(公告)号:US08044761B2

    公开(公告)日:2011-10-25

    申请号:US12337081

    申请日:2008-12-17

    IPC分类号: H01C7/10

    CPC分类号: H01C7/112 H01C7/102 H01C7/105

    摘要: A varistor 1 comprises a varistor element 10, a pair of external electrodes 30a, 30b on one main side of the varistor element 10 and a resistor 60 on the same main side, wherein the resistor 60 is formed so as to connect the pair of external electrodes 30a, 30b. The varistor element 10 contains zinc oxide as the main component and Ca oxides, Si oxides and rare earth metal oxides as accessory components, wherein the proportion X of the calcium oxides in terms of calcium atoms is 2-80 atomic percent with respect to 100 mol of the main component and the proportion Y of the silicon oxides in terms of silicon atoms is 1-40 atomic percent with respect to 100 mol of the main component, X/Y satisfying formula (1) below, and the external electrodes and resistor contain oxides other than bismuth oxide and copper oxide 1≦X/Y

    摘要翻译: 变阻器1包括变阻器元件10,在可变电阻元件10的一个主侧上的一对外部电极30a,30b和同一主面上的电阻器60,其中电阻器60形成为连接一对外部电阻 电极30a,30b。 变阻器元件10包含氧化锌作为主要成分,以Ca氧化物,Si氧化物和稀土金属氧化物为辅助成分,其中,钙原子的氧化钙的比例X相对于100摩尔为2-80原子% ,硅原子的比例Y相对于主成分100摩尔为1〜40原子%,满足下式(1)的X / Y,外部电极和电阻含有 氧化铋和氧化铜以外的氧化物1&nlE; X / Y <3(1)。

    Portable electronic apparatus with improved audio quality through a curved and sloped surface of a housing
    48.
    发明授权
    Portable electronic apparatus with improved audio quality through a curved and sloped surface of a housing 有权
    通过壳体的弯曲和倾斜的表面具有改善的音频质量的便携式电子设备

    公开(公告)号:US07746627B2

    公开(公告)日:2010-06-29

    申请号:US12489899

    申请日:2009-06-23

    IPC分类号: H05K5/00 G06F1/16

    CPC分类号: G06F1/1688 G06F1/1616

    摘要: A portable electronic apparatus includes a housing and an output device configured to output sound. The output device is disposed on a surface on an inside of a slope disposed on a lower surface of the housing, the slope resulting in the housing being opened in a predetermined direction. The slope forms a space between the slope and a mounting surface on which the housing is placed. The surface on the inside of the slope includes a curved surface. The curved surface may be concavely curved relative to the bottom surface of the housing. The electronic apparatus may also include an input device, and the output device may be disposed on a side forward of the input device.

    摘要翻译: 便携式电子设备包括壳体和被配置为输出声音的输出装置。 输出装置设置在设置在壳体的下表面上的斜面的内侧上的表面上,导致壳体沿预定方向打开。 斜坡在斜坡和安装表面之间形成一个空间,在该安装表面上放置了外壳。 斜坡内侧的表面包括一个曲面。 弯曲表面可以相对于壳体的底表面凹入弯曲。 电子设备还可以包括输入设备,并且输出设备可以设置在输入设备的前方的一侧。

    Fuel reforming system
    49.
    发明授权
    Fuel reforming system 失效
    燃料重整系统

    公开(公告)号:US07547333B2

    公开(公告)日:2009-06-16

    申请号:US10554906

    申请日:2004-08-03

    摘要: In a fuel reforming system (32) of a fuel cell system (1), which includes a reformer (7) generating hydrogen-containing gas to be an electromotive fuel and a combustor (6) generating combustion gas, the combustor (6) has two combustion parts including a main combustion part (20) and a sub-combustion part (18), a fuel pre-vaporization part (19) between the two combustion parts and a main fuel injection valve (16) and a sub-fuel injection valve (15) which supply the fuel to the respective combustion parts. In start-up of the fuel cell system (1), predetermined amounts of fuel and air for generating heat quantity required in the fuel pre-vaporization part (19) are subjected to lean combustion in the sub-combustion part (18), the fuel to be combusted in the main combustion part (20) is pre-vaporized in the fuel pre-vaporization part (19) by use of the combustion gas from the sub-combustion part (18), and the pre-vaporized fuel obtained by the pre-vaporization and air are subjected to premixed lean combustion in the main combustion part (20).

    摘要翻译: 在燃料电池系统(1)的燃料重整系统(32)中,包括产生作为电动燃料的含氢气体的重整器(7)和产生燃烧气体的燃烧器(6),所述燃烧器(6)具有 包括主燃烧部分(20)和副燃烧部分(18)的两个燃烧部分,两个燃烧部分之间的燃料预蒸发部分(19)和主燃料喷射阀(16)和副燃料喷射 将燃料供应到各个燃烧部分的阀(15)。 在燃料电池系统(1)的启动中,在副燃烧部(18)中对燃料预汽化部(19)中所需的用于产生热量的预定量的燃料和空气进行稀薄燃烧, 在主燃烧部分(20)中燃烧的燃料通过使用来自副燃烧部分(18)的燃烧气体在燃料预蒸发部分(19)中预蒸发,并且由 预燃气和空气在主燃烧部分(20)中经受预混稀燃燃烧。

    Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body
    50.
    发明申请
    Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body 有权
    半导体晶片处理带卷绕体,半导体晶片加工带贴附装置以及半导体晶片加工带卷绕体的半导体晶片处理装置

    公开(公告)号:US20070162175A1

    公开(公告)日:2007-07-12

    申请号:US11476382

    申请日:2006-06-28

    IPC分类号: G06F19/00

    CPC分类号: H01L21/67294

    摘要: A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.

    摘要翻译: 提供半导体晶片处理带贴附装置,并且能够在最佳条件下将半导体晶片处理带粘贴到半导体晶片处理带上,该条件基于已经写入数据载体成员并从数据载体读取的处理数据 不像常规方法那样访问主机。 半导体晶片处理带贴附装置包括:馈送装置,其具有可以可拆卸地安装半导体晶片加工带卷绕体的馈送轴; 用于读取和写入已经写入到半导体晶片处理带卷绕体的数据载体构件的处理数据的磁带数据读/写装置; 以及胶带粘贴装置,用于根据由磁带数据读/写装置读取的处理数据,将从馈送装置输出的半导体晶片处理带粘贴到半导体晶片。