摘要:
A surface treatment apparatus for producing a steel strip having an enhanced phosphatizing property, has a plurality of guide rolls for guiding the strip along a predetermined path, a pickling vessel having nozzles for spraying a pickling liquid onto the surface of the strip, a first rinsing vessel having nozzles for spraying water onto the strip surface, an electrolytic treating vessel having an anode and a temperature control for the electrolytic treating liquid, a second rinsing vessel having nozzles for spraying water onto the strip surface, and a voltage supply for applying a voltage between an anode and a cathode consisting of a guide roll located beside and close to the electrolytic treating liquid contained in the electrolytic treating vessel.
摘要:
Disclosed is a hydrazine compound represented by the formula (1) below, which has an excellent control activity against a harmful arthropod. (1) (In the formula, R1, R5, R6 and R7 represent a hydrogen atom or the like; R2 and R3 are bonded together at their ends to form a 5- to 8-membered ring together with two nitrogen atoms; R4 represents a halogen atom or the like; J represents 1-(3-chloro-2-pyridyl)-3-bromo-1H-pyrazol-5-yl group or the like; and M represents a hydrogen atom, an optionally halogenated C1-C6 alkyl group, or the like.)
摘要翻译:公开了由下式(1)表示的肼化合物,其对有害节肢动物具有优异的控制活性。 (1)(式中,R 1,R 5,R 6和R 7表示氢原子等; R 2和R 3在其末端键合在一起,与2个氮原子一起形成5〜8元环; R 4表示 卤素原子等; J表示1-(3-氯-2-吡啶基)-3-溴-1H-吡唑-5-基等; M表示氢原子,任选卤代的C1-C6 烷基等。)
摘要:
There is provided a process for producing an amide compound having an excellent harmful arthropod-controlling activity and represented by the formula (III): wherein R1, R2 and R3 independently represent a C1-C6 alkyl group optionally substituted with at least one halogen atom etc., R4, R5, R6 and R7 independently represent a halogen atom etc.
摘要:
Disclosed is a method for producing an amide compound represented by the formula (3) below and having an excellent control activity against a harmful arthropod, which is characterized in that an aniline compound represented by the formula (1) below and an aldehyde compound represented by the formula (2) below are reacted in a solvent in the presence of an oxidizing agent such as oxygen or a peroxide. (In the formulae below, R1, R2 and R3 independently represent a C1-C6 alkyl group which may be substituted by a halogen atom, or the like; and R4, R5, R6 and R7 independently represent a halogen atom or the like.)
摘要:
This invention provides a method for manufacturing a tire in which the time necessary for the manufacture can be reduced without deteriorating uniformity in manufacturing the tire by a strip-build process. The method for manufacturing the tire comprises discharging a strip rubber (S) having a predetermined sectional shape by rubber discharging devices (A1, A2) while rotating a molding drum (B), and successively winding the discharged strip rubber (S) around the molding drum (B) to mold the rubber into a tire shape. The method comprises the step of disposing, around the radial direction of the molding drum (B), at least two rubber discharging devices of a first rubber discharging device (A1) and a second rubber discharging device (A2) in such a state that the phase is shifted in the circumferential direction, and conducting winding in such a state that a first strip rubber (S1) discharged by the first rubber discharging device (A1) and a second strip rubber (S2) discharged by the second discharging device (A2) are overlapped with each other by a predetermined degree in the widthwise direction of the molding drum (B).
摘要:
A processing method for selectively reducing or removing the region to be exposed with energy ray in a film formed on a substrate, comprising relatively scanning a first exposure light whose shape on the substrate is smaller than the whole first region to be exposed against the whole first region to be exposed to selectively remove or reduce the first region to be exposed, and exposing a whole second region to be exposed inside the whole first region to be exposed with a second exposure light to selectively expose the whole second region to be exposed.
摘要:
A semiconductor device comprising a substrate, a plurality of dielectric films formed on the substrate, laid one upon another, and a fuse interconnect-wire formed above the substrate and covered with a predetermined one of the dielectric films, and including a fuse main body which is to be blown to electrically disconnect the fuse interconnect-wire, which is smaller than a bottom of a fuse-blowing recess made in the predetermined dielectric film, which has a length not less than the diameter of a fuse-blowing laser beam and which opposes the bottom of the fuse-blowing recess.
摘要:
An apparatus for laser beam machining includes a scanning system configured to move an object in a scanning direction from a first edge of the object to another edge of the object; a beam shaping unit configured to convert a laser beam to an asymmetrical machining laser beam in the scanning direction on a plane orthogonal to an optical axis of the laser beam; and an irradiation optical system configured to irradiate the machining laser beam emitted from the beam shaping unit onto the object.
摘要:
In a laser beam machining method, a liquid, through which a laser beam can be transmitted, is supplied to the target surface of an object to be processed. A laser beam is guided to the target surface through the liquid. The laser beam processes the target surface under the application of ultrasonic vibration.
摘要:
The spiral pipe joint comprises a nipple 1, a caulking ring 2 and a flexible string-shaped pressure contact member 3. After an inserting portion 11 of the nipple 1 is inserted into a pipe body P, the pressure contact member 3 is wound once or more times around the outer peripheral surface of the pipe body P existing above the inserting portion 11, and the caulking ring 2 is placed on the outside of the thus wound pressure contact member 3 and is compressed in the center direction of the pipe body P to thereby reduce the diameter of the caulking ring 2 in such a manner that the caulking amount thereof on the small-diameter stepped portion 13 is larger than the step level difference between the inserting portion 11 and small-diameter stepped portion 13.