公开(公告)号：US08253200B2

公开(公告)日：2012-08-28

申请号：US12274275

申请日：2008-11-19

申请人： Duli Mao ,  Hsin-Chih Tai ,  Howard E. Rhodes ,  Vincent Venezia ,  Yin Qian

发明人： Duli Mao ,  Hsin-Chih Tai ,  Howard E. Rhodes ,  Vincent Venezia ,  Yin Qian

IPC分类号： H01L29/78

CPC分类号： H01L27/14609 ,  H01L27/14612 ,  H01L27/14643 ,  H01L27/14689 ,  H01L29/6659 ,  H01L29/66636

摘要： Embodiments of the present invention are directed to an image sensor having pixel transistors and peripheral transistors disposed in a silicon substrate. For some embodiments, a protective coating is disposed on the peripheral transistors and doped silicon is epitaxially grown on the substrate to form lightly-doped drain (LDD) areas for the pixel transistors. The protective oxide may be used to prevent epitaxial growth of silicon on the peripheral transistors during formation of the LDD areas of the pixel transistors.

摘要翻译： 本发明的实施例涉及一种具有设置在硅衬底中的像素晶体管和外围晶体管的图像传感器。 对于一些实施例，保护涂层设置在外围晶体管上，并且掺杂的硅在衬底上外延生长以形成用于像素晶体管的轻掺杂漏极（LDD）区域。 保护氧化物可以用于在像素晶体管的LDD区域的形成期间防止外围晶体管上的硅的外延生长。

公开(公告)号：US08247852B2

公开(公告)日：2012-08-21

申请号：US12620437

申请日：2009-11-17

申请人： Hsin-Chih Tai ,  Howard E. Rhodes ,  Duli Mao ,  Vincent Venezia ,  Yin Qian

发明人： Hsin-Chih Tai ,  Howard E. Rhodes ,  Duli Mao ,  Vincent Venezia ,  Yin Qian

IPC分类号： H01L31/14

CPC分类号： H01L24/05 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14683 ,  H01L2224/02165 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05096 ,  H01L2224/05556 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327

摘要： A backside illuminated imaging sensor with reinforced pad structure includes a device layer, a metal stack, an opening and a frame. The device layer has an imaging array formed in a front side of the device layer and the imaging array is adapted to receive light from a back side of the device layer. The metal stack is coupled to the front side of the device layer where the metal stack includes at least one metal interconnect layer having a metal pad. The opening extends from the back side of the device layer to the metal pad to expose the metal pad for wire bonding. The frame is disposed within the opening to structurally reinforce the metal pad.

摘要翻译： 具有加强垫结构的背面照明成像传感器包括器件层，金属叠层，开口和框架。 器件层具有形成在器件层的前侧的成像阵列，并且成像阵列适于从器件层的背面接收光。 金属叠层耦合到器件层的前侧，其中金属堆叠包括具有金属焊盘的至少一个金属互连层。 开口从器件层的背面延伸到金属焊盘，露出用于引线接合的金属焊盘。 框架设置在开口内以在结构上加强金属垫。

公开(公告)号：US20120013777A1

公开(公告)日：2012-01-19

申请号：US12837870

申请日：2010-07-16

申请人： Duli Mao ,  Hsin-Chih Tai ,  Vincent Venezia ,  Yin Qian ,  Howard E. Rhodes

发明人： Duli Mao ,  Hsin-Chih Tai ,  Vincent Venezia ,  Yin Qian ,  Howard E. Rhodes

IPC分类号： H04N9/04

CPC分类号： H04N5/3696 ,  H01L27/14621 ,  H01L27/1464 ,  H04N9/04

摘要： Embodiments of an apparatus comprising a pixel array comprising a plurality of macropixels. Each macropixel includes a pair of first pixels each including a color filter for a first color, the first color being one to which pixels are most sensitive, a second pixel including a color filter for a second color, the second color being one to which the pixels are least sensitive and a third pixel including a color filter for a third color, the third color being one to which pixels have a sensitivity between the least sensitive and the most sensitive, wherein the first pixels each occupy a greater proportion of the light-collection area of the macropixel than either the second pixel or the third pixel. Corresponding process and system embodiments are disclosed and claimed.

摘要翻译： 包括包括多个宏像素的像素阵列的装置的实施例。 每个宏像素包括一对第一像素，每个第一像素包括用于第一颜色的滤色器，第一颜色是像素最敏感的一个，第二像素包括用于第二颜色的滤色器，第二颜色是 像素是最不灵敏的，并且第三像素包括用于第三颜色的滤色器，第三颜色是像素在最不灵敏和最敏感之间具有灵敏度的一个，其中第一像素每个占据较大比例的发光元件， 大小像素的收集区域比第二像素还是第三像素。 公开和要求保护相应的过程和系统实施例。

公开(公告)号：US20110260221A1

公开(公告)日：2011-10-27

申请号：US12768319

申请日：2010-04-27

申请人： Duli Mao ,  Hsin-Chih Tai ,  Vincent Venezia ,  Yin Qian ,  Howard E. Rhodes

发明人： Duli Mao ,  Hsin-Chih Tai ,  Vincent Venezia ,  Yin Qian ,  Howard E. Rhodes

IPC分类号： H01L31/0232 ,  H01L31/18

CPC分类号： H01L27/14698 ,  H01L27/14623 ,  H01L27/14627 ,  H01L27/1464 ,  H01L27/14643 ,  H01L27/14689

摘要： A technique for fabricating an image sensor including a pixel circuitry region and a peripheral circuitry region includes fabricating front side components on a front side of the image sensor. A dopant layer is implanted on a backside of the image sensor. A anti-reflection layer is formed on the backside and covers a first portion of the dopant layer under the pixel circuitry region while exposing a second portion of the dopant layer under the peripheral circuitry region. The first portion of the dopant layer is laser annealed from the backside of the image sensor through the anti-reflection layer. The anti-reflection layer increases a temperature of the first portion of the dopant layer during the laser annealing.

摘要翻译： 一种用于制造包括像素电路区域和外围电路区域的图像传感器的技术包括在图像传感器的正面上制造前侧部件。 掺杂剂层植入图像传感器的背面。 在背面形成防反射层，并且在像素电路区域下方覆盖掺杂剂层的第一部分，同时在外围电路区域下方暴露掺杂剂层的第二部分。 掺杂剂层的第一部分通过抗反射层从图像传感器的背面激光退火。 抗反射层在激光退火期间增加掺杂剂层的第一部分的温度。

公开(公告)号：US20110095188A1

公开(公告)日：2011-04-28

申请号：US12984452

申请日：2011-01-04

申请人： Yin Qian ,  Howard E. Rhodes ,  Hsin-Chih Tai ,  Vincent Venezia ,  Duli Mao

发明人： Yin Qian ,  Howard E. Rhodes ,  Hsin-Chih Tai ,  Vincent Venezia ,  Duli Mao

IPC分类号： H01L31/101

CPC分类号： H01L27/14603 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14647 ,  H01L27/14652

摘要： A backside illuminated imaging sensor includes a semiconductor layer and an infrared detecting layer. The semiconductor layer has a front surface and a back surface. An imaging pixel includes a photodiode region formed within the semiconductor layer. The infrared detecting layer is disposed above the front surface of the semiconductor layer to receive infrared light that propagates through the imaging sensor from the back surface of the semiconductor layer.

摘要翻译： 背面照明成像传感器包括半导体层和红外检测层。 半导体层具有前表面和后表面。 成像像素包括形成在半导体层内的光电二极管区域。 红外线检测层设置在半导体层的前表面上方，以从半导体层的背面接收从成像传感器传播的红外光。

公开(公告)号：US20110089517A1

公开(公告)日：2011-04-21

申请号：US12852990

申请日：2010-08-09

申请人： Vincent Venezia ,  Duli Mao ,  Hsin-Chih Tai ,  Yin Qian ,  Howard E. Rhodes

发明人： Vincent Venezia ,  Duli Mao ,  Hsin-Chih Tai ,  Yin Qian ,  Howard E. Rhodes

IPC分类号： H01L27/146

CPC分类号： H01L27/14632 ,  H01L27/14603 ,  H01L27/1463 ,  H01L27/1464

摘要： An image sensor includes a device wafer substrate of a device wafer, a device layer of the device wafer, and optionally a heat control structure and/or a heat sink. The device layer is disposed on a frontside of the device wafer substrate and includes a plurality of photosensitive elements disposed within a pixel array region and peripheral circuitry disposed within a peripheral circuits region. The photosensitive elements are sensitive to light incident on a backside of the device wafer substrate. The heat control structure is disposed within the device wafer substrate and thermally isolates the pixel array region from the peripheral circuits region to reduce heat transfer between the peripheral circuits region and the pixel array region. The heat sink conducts heat away from the device layer.

摘要翻译： 图像传感器包括器件晶片的器件晶片衬底，器件晶片的器件层，以及任选的热控结构和/或散热器。 器件层设置在器件晶片衬底的前侧，并且包括设置在像素阵列区域内的多个感光元件和设置在外围电路区域内的外围电路。 光敏元件对入射到器件晶片衬底背面的光敏感。 热控制结构设置在器件晶片衬底内，并且将像素阵列区域与外围电路区域隔离，以减少外围电路区域和像素阵列区域之间的热传递。 散热器将热量从器件层传导出去。

公开(公告)号：US07888763B2

公开(公告)日：2011-02-15

申请号：US12203858

申请日：2008-09-03

申请人： Yin Qian ,  Howard E. Rhodes ,  Hsin-Chih Tai ,  Vincent Venezia ,  Duli Mao

发明人： Yin Qian ,  Howard E. Rhodes ,  Hsin-Chih Tai ,  Vincent Venezia ,  Duli Mao

IPC分类号： H01L31/00 ,  H01L21/00

CPC分类号： H01L27/14603 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14632 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14641 ,  H01L27/14647 ,  H01L27/14652

摘要： A backside illuminated imaging sensor includes a semiconductor layer and an infrared detecting layer. The semiconductor layer has a front surface and a back surface. An imaging pixel includes a photodiode region formed within the semiconductor layer. The infrared detecting layer is disposed above the front surface of the semiconductor layer to receive infrared light that propagates through the imaging sensor from the back surface of the semiconductor layer.

摘要翻译： 背面照明成像传感器包括半导体层和红外检测层。 半导体层具有前表面和后表面。 成像像素包括形成在半导体层内的光电二极管区域。 红外线检测层设置在半导体层的前表面上方，以从半导体层的背面接收从成像传感器传播的红外光。

公开(公告)号：US07875918B2

公开(公告)日：2011-01-25

申请号：US12430006

申请日：2009-04-24

申请人： Vincent Venezia ,  Ashish Shah ,  Rongsheng Yang ,  Duli Mao ,  Yin Qian ,  Hsin-Chih Tai ,  Howard E. Rhodes

发明人： Vincent Venezia ,  Ashish Shah ,  Rongsheng Yang ,  Duli Mao ,  Yin Qian ,  Hsin-Chih Tai ,  Howard E. Rhodes

IPC分类号： H01L31/062

CPC分类号： H01L27/1463 ,  H01L27/14601

摘要： An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type.

摘要翻译： 图像传感器像素包括基板，第一外延层，集电极层，第二外延层和光收集区域。 衬底被掺杂以具有第一导电类型。 第一外延层设置在衬底上并掺杂以具有第一导电类型。 集电极层选择性地设置在第一外延层的至少一部分上并被掺杂以具有第二导电类型。 第二外延层设置在集电极层上并掺杂以具有第一导电类型。 光收集区域收集光生电荷载流子并且设置在第二外延层内。 光收集区域也被掺杂以具有第二导电类型。

公开(公告)号：US20100271524A1

公开(公告)日：2010-10-28

申请号：US12430006

申请日：2009-04-24

申请人： Vincent Venezia ,  Ashish Shah ,  Rongsheng Yang ,  Duli Mao ,  Yin Qian ,  Hsin-Chih Tai ,  Howard E. Rhodes

发明人： Vincent Venezia ,  Ashish Shah ,  Rongsheng Yang ,  Duli Mao ,  Yin Qian ,  Hsin-Chih Tai ,  Howard E. Rhodes

IPC分类号： H04N5/335 ,  H01L27/146

CPC分类号： H01L27/1463 ,  H01L27/14601

摘要： An image sensor pixel includes a substrate, a first epitaxial layer, a collector layer, a second epitaxial layer and a light collection region. The substrate is doped to have a first conductivity type. The first epitaxial layer is disposed over the substrate and doped to have the first conductivity type as well. The collector layer is selectively disposed over at least a portion of the first epitaxial layer and doped to have a second conductivity type. The second epitaxial layer is disposed over the collector layer and doped to have the first conductivity type. The light collection region collects photo-generated charge carriers and is disposed within the second epitaxial layer. The light collection region is also doped to have the second conductivity type.

摘要翻译： 图像传感器像素包括基板，第一外延层，集电极层，第二外延层和光收集区域。 衬底被掺杂以具有第一导电类型。 第一外延层设置在衬底上并掺杂以具有第一导电类型。 集电极层选择性地设置在第一外延层的至少一部分上并被掺杂以具有第二导电类型。 第二外延层设置在集电极层上并掺杂以具有第一导电类型。 光收集区域收集光生电荷载流子并且设置在第二外延层内。 光收集区域也被掺杂以具有第二导电类型。

公开(公告)号：US20090200626A1

公开(公告)日：2009-08-13

申请号：US12260019

申请日：2008-10-28

申请人： Yin Qian ,  Hsin-Chih Tai ,  Duli Mao ,  Vincent Venezia ,  Howard E. Rhodes

发明人： Yin Qian ,  Hsin-Chih Tai ,  Duli Mao ,  Vincent Venezia ,  Howard E. Rhodes

IPC分类号： H01L31/0232

CPC分类号： H01L27/14647 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/1464

摘要： A backside illuminated imaging sensor includes a vertical stacked sensor that reduces cross talk by using different silicon layers to form photodiodes at separate levels within a stack (or separate stacks) to detect different colors. Blue light-, green light-, and red light-detection silicon layers are formed, with the blue light detection layer positioned closest to the backside of the sensor and the red light detection layer positioned farthest from the backside of the sensor. An anti-reflective coating (ARC) layer can be inserted in between the red and green light detection layers to reduce the optical cross talk captured by the red light detection layer. Amorphous polysilicon can be used to form the red light detection layer to boost the efficiency of detecting red light.

摘要翻译： 背面照明成像传感器包括垂直堆叠传感器，其通过使用不同的硅层在堆叠（或单独的堆叠）内的不同级别形成光电二极管来减少串扰，以检测不同的颜色。 形成蓝光，绿光和红光检测硅层，蓝光检测层位于最靠近传感器背面的位置，红光检测层位于离传感器背面最远的位置。 可以在红色和绿色光检测层之间插入抗反射涂层（ARC）层，以减少由红光检测层捕获的光学交叉对话。 可以使用非晶多晶硅来形成红光检测层，以提高检测红光的效率。