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    DISTRIBUTION OF POWER VIAS IN A MULTI-LAYER CIRCUIT BOARD
    42.
    发明申请
    DISTRIBUTION OF POWER VIAS IN A MULTI-LAYER CIRCUIT BOARD 有权
    电力线在多层电路板中的分布

    公开(公告)号：US20160342724A1

    公开(公告)日：2016-11-24

    申请号：US14834767

    申请日：2015-08-25

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Zhaoqing Chen ,  Matteo Cocchini ,  Rohan U. Mandrekar ,  Tingdong Zhou

    IPC: G06F17/50 ,  H05K3/00

    CPC classification number: G06F17/5072 ,  G06F17/5077 ,  G06F17/5081 ,  G06F2217/78 ,  H05K1/0265 ,  H05K1/115 ,  H05K3/0005 ,  H05K2201/09227 ,  H05K2201/0979

    Abstract: One aspect is a method that includes identifying, by a power via placement tool executing on a processor of a circuit design system, a source and a sink of a voltage domain of a multi-layer circuit board based on a design file defining a layout of the multi-layer circuit board. A number of power vias to support a maximum current demand from the source to the sink is determined. Positions of a plurality of the power vias are determined at locations of the multi-layer circuit board forming paths through the power vias between the source and the sink and having a substantially equal total path length through each total path defined between the source and the sink through at least one of the power vias. The design file is modified to include the power vias at the positions.

    Abstract translation: 一个方面是一种方法，其包括通过在电路设计系统的处理器上执行的电力通过放置工具来识别基于设计文件的多层电路板的电压域的源极和接收器，该设计文件定义了 多层电路板。 确定支持从源到汇的最大电流需求的多个电源通孔。 在多层电路板的位置处确定多个电源通孔的位置，该位置通过源极和漏极之间的电力通孔形成通路，并具有基本上相等的总路径长度，通过在源极和漏极之间限定的每个总路径 通过至少一个电源通孔。 设计文件被修改为在位置包括电源通孔。

    INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO
    44.
    发明申请
    INTERCONNECT ARRAY PATTERN WITH A 3:1 SIGNAL-TO-GROUND RATIO 有权
    具有3：1信号对接率的互连阵列图案

    公开(公告)号：US20160150638A1

    公开(公告)日：2016-05-26

    申请号：US14551185

    申请日：2014-11-24

    Applicant: International Business Machines Corporation

    Inventor： Zhaoqing Chen ,  Matteo Cocchini ,  Rohan U. Mandrekar ,  Tingdong Zhou

    IPC: H05K1/02 ,  H01P3/02 ,  H01P3/08

    CPC classification number: H01L23/49838 ,  H01L23/528 ,  H01L23/66 ,  H01L2223/6627 ,  H01P3/02 ,  H01P3/026 ,  H01P3/081 ,  H04B1/00 ,  H04B3/32 ,  H05K1/0216 ,  H05K1/0245

    Abstract: An electronic device including a plurality of interconnects are orthogonally arranged in a grid pattern and evenly spaced by a first distance, the plurality of interconnects include: a first conductor pair with conductors arranged next to each other in a first direction, the first direction is oriented diagonally relative to the orthogonal grid pattern, a second conductor pair with conductors arranged next to each other in a second direction substantially perpendicular to the first direction, each conductor of the second conductor pair is spaced by the first distance from each signal conductor of the first conductor pair, and a third conductor pair with conductors arranged next to each other in a third direction substantially parallel to the first direction, each conductors of the third conductor pair is spaced by the first distance from one of the signal elements of the second conductor pair.

    Abstract translation: 包括多个互连件的电子设备以网格图案正交布置并均匀间隔第一距离，所述多个互连件包括：第一导体对，其具有沿第一方向彼此相邻布置的导体，所述第一方向定向 相对于正交栅格图案的对角线的第二导体对，具有基本上垂直于第一方向的第二方向彼此相邻布置的导体的第二导体对，第二导体对的每个导体与第一导体对的每个信号导体间隔开第一距离 导体对和第三导体对，其中导体在基本上平行于第一方向的第三方向上彼此相邻布置，第三导体对的每个导体与第二导体对的信号元件之一间隔开第一距离 。

    Obstruction detecting sleeve for conduit structures
    47.
    发明授权
    Obstruction detecting sleeve for conduit structures 有权

    公开(公告)号：US10939189B1

    公开(公告)日：2021-03-02

    申请号：US16572697

    申请日：2019-09-17

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Matteo Cocchini ,  Kyle Indukummar Giesen ,  Zachary Thomas Dreiss ,  Kyle Wonderly ,  Juan Martinez-Mantilla

    IPC: H04Q9/00 ,  H04W84/12

    Abstract: An apparatus for detecting an obstruction in a conduit structure, the apparatus includes a sleeve portion, a plurality of sensor cells, a primary termination cap, and a secondary termination cap. The plurality of sensor cells coupled to the sleeve portion, wherein each sensor cell from the plurality of sensor cells is electrically coupled to the primary termination cap and the secondary termination cap. The sleeve portion configured to wrap around a conduit structure, wherein each sensor cell from the plurality of sensor cells is directed to an exterior surface of the conduit structure. The primary termination cap electrically and mechanically coupled to a first end of the sleeve portion, wherein the primary termination cap includes Wi-Fi transmitter, a primary microcontroller, and a power source connection. The secondary termination cap electrically and mechanically coupled to a second end of the sleeve portion to short the plurality of sensor cells.

    Signal via positioning in a multi-layer circuit board
    49.
    发明授权
    Signal via positioning in a multi-layer circuit board 有权

    公开(公告)号：US10657308B2

    公开(公告)日：2020-05-19

    申请号：US15800151

    申请日：2017-11-01

    Applicant: International Business Machines Corporation

    Inventor： Sungjun Chun ,  Matteo Cocchini ,  Michael A. Cracraft

    IPC: G06F17/50 ,  G06F30/394

    Abstract: One aspect is a method that includes identifying a substantially uniform distribution of signal vias for a multi-layer circuit board based on a design file defining a layout. A signal via pitch is determined as a center-to-center distance between a neighboring pair of signal vias. The signal via pitch is compared to a target minimum drilling distance. A ground via is identified proximate the neighboring pair of the signal vias. Based determining that the signal via pitch of the neighboring pair is less than the target minimum drilling distance, at least one of the signal vias is positioned closer to the ground via such that after the positioning, the signal via pitch of the neighboring pair meets or exceeds the target minimum drilling distance. The design file is modified to include the positioning of the signal vias and is transmitted over a network to support circuit board manufacturing operations.

    Cable cassette apparatus
    50.
    发明授权
    Cable cassette apparatus 有权

    公开(公告)号：US10228733B2

    公开(公告)日：2019-03-12

    申请号：US15945869

    申请日：2018-04-05

    Applicant: International Business Machines Corporation

    Inventor： Matteo Cocchini ,  Michael A. Cracraft ,  Khaalid P. J. McMillan ,  Arushi Shahani ,  John G. Torok

    IPC: G06F1/18

    Abstract: An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.

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