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    Positive pressure-applying latch mechanism
    42.
    发明授权
    Positive pressure-applying latch mechanism 有权

    公开(公告)号：US09949399B2

    公开(公告)日：2018-04-17

    申请号：US15176626

    申请日：2016-06-08

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Shawn Canfield ,  Robert R. Genest ,  Robert K. Mullady ,  Michael T. Peets

    IPC: H01R13/62 ,  H05K7/14

    CPC classification number: H05K7/1489 ,  H05K7/1409 ,  H05K7/1417 ,  Y10T403/595

    Abstract: A latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a pivotable latch coupled to the field-replaceable unit via a pivot, at a first side of the unit, and a spring member associated with the enclosure. The spring member is engaged by the latch and deflects with rotating of the latch from an open position to a latched position. The pivotable latch includes the first end and a second end, with the pivot being disposed closer to the first end than the second. The deflecting spring member facilitates provision of positive pressure on the unit directed towards a second side of the unit opposite to the first side to facilitate, for example, fixedly coupling a first connector at the second side to a second connector associated with the enclosure when the unit is latched within the enclosure.

    Enclosure with inner tamper-respondent sensor(s) and physical security element(s)
    43.
    发明授权
    Enclosure with inner tamper-respondent sensor(s) and physical security element(s) 有权

    公开(公告)号：US09913416B2

    公开(公告)日：2018-03-06

    申请号：US14941872

    申请日：2015-11-16

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  Thomas Weiss

    IPC: H05K3/02 ,  H05K13/00 ,  H05K3/10

    CPC classification number: H05K13/00 ,  H05K3/10 ,  H05K5/0208

    Abstract: Methods of fabricating tamper-respondent assemblies are provided which include an electronic enclosure, a tamper-respondent electronic circuit structure, and at least one security element. The electronic enclosure encloses, at least in part, at least one electronic component to be protected, and includes an inner surface. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure, and the at least one security element overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In enhanced embodiments, the electronic enclosure is secured to a multilayer circuit board which includes an embedded tamper-respondent sensor, and together, the tamper-respondent sensor covering the inner surface of the electronic enclosure and the embedded tamper-respondent sensor within the multilayer circuit board define a secure volume about the electronic component(s).

    Fabrication of positive pressure-applying latch mechanism
    46.
    发明授权
    Fabrication of positive pressure-applying latch mechanism 有权
    正压施加闩锁机构的制造

    公开(公告)号：US09585284B2

    公开(公告)日：2017-02-28

    申请号：US14538189

    申请日：2014-11-11

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Shawn Canfield ,  Robert R. Genest ,  Robert K. Mullady ,  Michael T. Peets

    IPC: H05K7/00 ,  H05K7/14

    CPC classification number: H05K7/1489 ,  H05K7/1409 ,  H05K7/1417 ,  Y10T403/595

    Abstract: Fabrication of a latch mechanism is provided for latching a field-replaceable unit within an enclosure. The latch mechanism includes a pivotable latch coupled to the field-replaceable unit via a pivot, at a first side of the unit, and a spring member associated with the enclosure. The spring member is engaged by the latch and deflects with rotating of the latch from an open position to a latched position. The pivotable latch includes the first end and a second end, with the pivot being disposed closer to the first end than the second. The deflecting spring member facilitates provision of positive pressure on the unit directed towards a second side of the unit opposite to the first side to facilitate, for example, fixedly coupling a first connector at the second side to a second connector associated with the enclosure when the unit is latched within the enclosure.

    Abstract translation: 提供了用于将外壳中的现场可更换单元锁定的闩锁机构的制造。 闩锁机构包括可枢转闩锁，其通过枢轴在该单元的第一侧和与该外壳相关联的弹簧构件联接到该现场可更换单元。 弹簧构件通过闩锁接合并且随着闩锁的旋转从打开位置偏转到闩锁位置。 可枢转闩锁包括第一端和第二端，其中枢轴设置成比第二端更靠近第一端。 偏转弹簧构件有助于在单元上朝向与第一侧相对的单元的第二侧提供正压力，以便例如在第二侧固定地将第二连接器固定地连接到与外壳相关联的第二连接器 机组锁定在机箱内。

    Tamper-respondent assemblies with enclosure-to-board protection
    47.
    发明授权
    Tamper-respondent assemblies with enclosure-to-board protection 有权
    防篡改组件具有外壳到板保护

    公开(公告)号：US09554477B1

    公开(公告)日：2017-01-24

    申请号：US14974036

    申请日：2015-12-18

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

    IPC: G08B21/00 ,  H05K5/02 ,  H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/0275 ,  G08B13/128 ,  H05K1/0216 ,  H05K1/112 ,  H05K1/181 ,  H05K3/22 ,  H05K5/0208 ,  H05K2201/10151 ,  H05K2201/10265 ,  H05K2201/10371

    Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

    Abstract translation: 提供了防篡改组件和制造方法，其中包含电路板保护的外壳。 防篡改组件包括电路板和安装到电路板的电子外壳，并且便于将至少一个电子部件封闭在安全的容积内。 篡改答复电子电路结构有助于定义安全量，篡改受理电子电路结构包括篡改答复电路。 提供粘合剂以部分地将电子外壳固定到电路板。 粘合剂至少部分地接触篡改响应电路，使得电子外壳与电路板的尝试分离导致粘合剂破坏篡改响应电路，便于检测篡改的监视电路的分离 通讯电子电路结构。

    Latch and spring assembly
    48.
    发明授权
    Latch and spring assembly 有权
    锁扣和弹簧总成

    公开(公告)号：US09547334B2

    公开(公告)日：2017-01-17

    申请号：US15014273

    申请日：2016-02-03

    Applicant: International Business Machines Corporation

    Inventor： John J. Loparco ,  David C. Olson ,  Michael T. Peets ,  John G. Torok ,  Wade H. White ,  Mitchell L. Zapotoski

    IPC: G06F1/16 ,  H05K7/14

    CPC classification number: G06F1/16 ,  H05K7/1401 ,  H05K7/1405 ,  H05K7/1407 ,  H05K7/1411 ,  H05K7/1492

    Abstract: One aspect of the invention discloses an apparatus for mating computing device structures. The apparatus comprises one or more rotatable latches, the one or more rotatable latches each including a respective screw mechanism housed within the one or more rotatable latches. The apparatus further comprises one or more spring assemblies, the one or more spring assemblies each including a respective thread assembly housed within the one or more spring assemblies. The respective thread assemblies comprise threading that is capable of receiving a corresponding screw mechanism of the one or more rotatable latches.

    Abstract translation: 本发明的一个方面公开了一种用于配合计算设备结构的设备。 该装置包括一个或多个可旋转的闩锁，该一个或多个可旋转闩锁各自包括容纳在该一个或多个可旋转闩锁内的相应的螺钉机构。 该装置还包括一个或多个弹簧组件，一个或多个弹簧组件各自包括容纳在一个或多个弹簧组件内的相应的螺纹组件。 相应的螺纹组件包括能够接收一个或多个可旋转闩锁的相应螺钉机构的螺纹。

    Doubling available printed wiring card edge for high speed interconnect in electronic packaging applications
    50.
    发明授权
    Doubling available printed wiring card edge for high speed interconnect in electronic packaging applications 有权
    电子封装应用中高速互连的可用打印接线卡边缘倍增

    公开(公告)号：US09325086B2

    公开(公告)日：2016-04-26

    申请号：US14452221

    申请日：2014-08-05

    Applicant: International Business Machines Corporation

    Inventor： William L. Brodsky ,  Robert R. Genest ,  John J. Loparco ,  Michael T. Peets ,  John G. Torok

    IPC: H05K1/14 ,  H01R11/01 ,  H01R12/71

    CPC classification number: H01R11/01 ,  H01R12/716 ,  H01R12/724 ,  H01R12/73 ,  H05K1/14 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/10189

    Abstract: An interconnection assembly for a motherboard uses right-angle edge connectors attached to a bottom side of the motherboard, and vertical header connectors attached to the top side. The header connectors mate with a transition card assembly which includes a transition card having plated through holes that receive pins of the header connectors. Right-angle mezzanine connectors mounted on the transition card have pins that extend into the plated through holes from the top side. The edge connectors and mezzanine connectors both face forward in a common direction. The transition card has holes along a rear edge to retain pressed-in nuts for mounting to a stabilizing bezel. Instead of pins being part of the header connectors, connector caps may be provided with pins having first ends that extend into sockets of the header connectors and second ends that extend into the plated through holes of the transition card.

    Abstract translation: 用于主板的互连组件使用附接到母板底部的直角边缘连接器，以及连接到顶侧的垂直插头连接器。 插头连接器与过渡卡组件配合，该过渡卡组件包括具有接收插头连接器的引脚的电镀通孔的过渡卡。 安装在过渡卡上的直角夹层连接器具有从顶侧延伸到电镀通孔中的销。 边缘连接器和夹层连接器都朝向共同的方向。 过渡卡沿着后边缘具有孔，以保持压入螺母，用于安装到稳定的挡板上。 引脚是插头连接器的一部分，连接器盖可以设置有具有延伸到插头连接器的插座中的第一端的插脚和延伸到过渡卡的电镀通孔中的第二端。

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