中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

47 records (took 0.022 seconds)

    Cooling Electronic Components and Supplying Power to the Electronic Components
    45.
    发明申请
    Cooling Electronic Components and Supplying Power to the Electronic Components 审中-公开
    冷却电子元件并为电子元件供电

    公开(公告)号：US20140293533A1

    公开(公告)日：2014-10-02

    申请号：US14173233

    申请日：2014-02-05

    Applicant: International Business Machines Corporation

    Inventor： Andreas C. Doering ,  Ronald P. Luijten ,  Bruno Michel ,  Stephan Paredes

    IPC: G06F1/20

    CPC classification number: G06F1/20 ,  G06F1/189 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20509 ,  H01L2924/00

    Abstract: A mechanism is provided for cooling electronic components of a printed circuit board module and for supplying power to the electronic components of the printed circuit board module. The computer module comprises a printed circuit board module, wherein the electronic components are attached to a first side of the printed circuit board module, and a cooling module being attached to a second side of the printed circuit board, being arranged in parallel to the printed circuit board and having a first layer being thermally and electrically conductive. The first layer is arranged such that heat is dissipated from the printed circuit board module and that power from a power source is supplied to the electronic components of the printed circuit board module.

    Abstract translation: 提供了用于冷却印刷电路板模块的电子部件并且用于向印刷电路板模块的电子部件供电的机构。 计算机模块包括印刷电路板模块，其中电子部件附接到印刷电路板模块的第一侧，并且冷却模块附接到印刷电路板的第二侧，与印刷电路板模块平行布置 电路板，并且具有导热和导电的第一层。 第一层被布置成使得热量从印刷电路板模块消散，并且来自电源的电力被提供给印刷电路板模块的电子部件。

    PHOTOVOLTAIC MODULE COOLING DEVICES
    47.
    发明申请
    PHOTOVOLTAIC MODULE COOLING DEVICES 有权
    光伏模块冷却装置

    公开(公告)号：US20130255750A1

    公开(公告)日：2013-10-03

    申请号：US13853389

    申请日：2013-03-29

    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

    Inventor： Werner Escher ,  Bruno Michel ,  Stephan Paredes

    IPC: H01L31/052

    CPC classification number: H01L31/0521 ,  F24S10/20 ,  F24S23/71 ,  F24S30/45 ,  F28F3/12 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1461 ,  H02S40/44 ,  Y02E10/42 ,  Y02E10/44 ,  Y02E10/50 ,  Y02E10/52 ,  Y02E10/60 ,  H01L2924/00

    Abstract: A chip module cooling device includes two fluid circuits corresponding to inlet and outlet fluid circuits, respectively, wherein each comprises orifices and channel portions forming a tree structure, wherein branches represent the orifices, and nodes represent the channel portions, a branch linking a node to one child node only, wherein several nodes having a same parent node are sibling nodes and extends through L levels of the tree structure, with L≧3, and in fluidic connection with the other of the two fluid circuits, via channel portions corresponding to leaf nodes. For each fluid circuit, channel portions corresponding to sibling nodes are parallel to each other, and are not parallel to a channel portion corresponding to a parent node of the sibling nodes; and wherein channel portions of one of the fluid circuits are parallel to and interdigitated with channel portions of the other one of the fluid circuits.

    Abstract translation: 芯片模块冷却装置分别包括对应于入口和出口流体回路的两个流体回路，其中每个流体回路包括形成树结构的孔和通道部分，其中分支表示孔，节点表示通道部分，将节点连接到 一个子节点，其中具有相同父节点的几个节点是同级节点并且延伸到树结构的L个级别，其中L> = 3，并且与两个流体回路中的另一个流体连接，通过对应于 叶节点。 对于每个流体回路，对应于兄弟节点的信道部分彼此平行，并且不平行于对应于兄弟节点的父节点的信道部分; 并且其中一个流体回路的通道部分与另一个流体回路的通道部分平行并互相指向。

Patent Agency Ranking