摘要:
Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.
摘要:
Subject matter disclosed herein relates to a method of manufacturing a semiconductor integrated circuit device, and more particularly to a method of fabricating a phase change memory device.
摘要:
In one embodiment of the present disclosure, a composite electrode for a battery is provided. The composite electrode includes silver vanadium oxide present in an amount from about 75 weight percent to about 99 weight percent and polypyrrole present in an amount from about 1 weight percent to about 25 weight percent.
摘要:
A method of forming a metal pattern using a selective electroplating process is provided. First, a dielectric layer is formed on an underlying layer. Then, a trench defining blanket region is formed by patterning the dielectric layer. A diffusion barrier layer is conformally formed in the trench and on the blanket region. A polishing/plating stop layer and an upper seed layer are conformally formed on the diffusion barrier layer in a successive manner. The polishing/plating layer in the blanket region is exposed by selectively removing the upper seed layer in the blanket region, and, at the same time, a seed layer pattern remaining in the trenches is formed. An upper conductive layer is formed to fill the trench surrounded by the seed layer pattern using an electroplating process. Then, the dielectric layer in the blanket region is exposed by planarizing the upper conductive layer, the polishing/plating stop layer, the seed layer pattern, and the diffusion barrier layer.
摘要:
A refresh control circuit and method thereof and a bank address signal change circuit and methods thereof. The bank address signal change circuit may receive bank address signals from a bank address signal generation circuit. The received bank address signals may designate a first at least one of a plurality of memory banks. The bank address signal change circuit may determine whether the first at least one designated memory bank is associated with the longest refresh cycles from among the plurality of memory banks. Based on the determination, the bank address signal change circuit may generate a plurality of bank address signal change signals designating a second at least one of the plurality of memory banks. A refresh operation circuit may perform a refreshing operation on the second at least one memory banks in accordance with the bank address signal change signals. The bank address signal generation circuit, bank address signal change circuit and refresh operation circuit may each be included in a refresh control circuit.
摘要:
A gain flattening device for an optical fiber amplifier. In the gain flattening device, a first end portion, having first and second ends, receives an amplified optical signal from a first amplification fiber via the first end. A second end portion, having third and fourth ends, outputs the amplified optical signal to a second amplification fiber via the fourth end. A first connector is included for connecting the first end to the third end. A second connector is included for connecting the second end to the fourth end. At least one reflective grating is further included with a predetermined gain curve at a predetermined wavelength band. An optical coupling portion couples the amplified optical signal from the first connector to the second connector in at least one coupling region where the first and second connectors are closer to each other than in any other area, and outputs part of the amplified optical signal reflected from the reflective grating via the second end.
摘要:
Organometallic precursors may be utilized to form titanium silicon nitride films that act as heaters for phase change memories. By using a combination of TDMAT and TrDMASi, for example in a metal organic chemical vapor deposition chamber, a relatively high percentage of silicon may be achieved in reasonable deposition times, in some embodiments. In one embodiment, two separate bubblers may be utilized to feed the two organometallic compounds in gaseous form to the deposition chamber so that the relative proportions of the precursors can be readily controlled.
摘要:
Polishing pads are provided that include a substrate for a polishing pad and a plurality of spaced apart members on the substrate and protruding from the substrate. The plurality of members include at least one abrasive layer and at least one chemical additive layer. Related methods of fabricating polishing pads are also provided herein.
摘要:
A vehicle air duct assembly of an integrated beam structure includes a front beam member which is formed with an air vent duct for guiding air for the air conditioning of an automobile, a cowl cross bar for reinforcing the rigidity of the vehicle body and brackets for attaching a plurality of electrical equipment parts including an air bag; and a rear beam member which is coupled to the rear side of the front beam member and guides parts of air flowing through the air vent duct toward a front window glass of the automobile. According to the air duct, the number of parts is reduced, thus the manufacturing process is simplified, and a mixed material of steel and thermoplastic resin is used, thus the overall strength is increased and the weight is reduced.
摘要:
Memory arrays and methods of forming the same are provided. An example memory array can include at least one plane having a plurality of memory cells arranged in a matrix and a plurality of plane selection devices. Groups of the plurality of memory cells are communicatively coupled to a respective one of a plurality of plane selection devices. A decode logic having elements is formed in a substrate material and communicatively coupled to the plurality of plane selection devices. The plurality of memory cells and the plurality of plane selection devices are not formed in the substrate material.