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公开(公告)号：US4803147A
公开(公告)日：1989-02-07
申请号：US124742
申请日：1987-11-24
IPC分类号： C08G73/10 , C08G73/12 , C08L79/08 , G03F7/037 , H01L21/027 , H01L21/312 , G03C1/68
CPC分类号： C08G73/105 , C08G73/1039 , C08G73/123 , C08L79/08 , G03F7/037 , Y10S430/107
摘要： A photosensitive polyimide polymer composition comprising a solvent soluble polyimide condensation product of an aromatic dianhydride and an aromatic diamine, a polyfunctional ethylenically unsaturated monomer and a photoinitiator. The solvent soluble polyimides of the composition are prepared from at least one compound selected from 2,2-hexafluoro-bis-(3,4-dicarboxyphenyl)tetracarboxylic dianhydride; 1,1-bis-[4-(1,2-dicarboxyphenyl)]-1-phenyl-2,2,2-trifluoroethane dianhydride; 2,2-hexafluoro-bis(3-aminophenyl)propane; 2,2-hexafluoro-bis(4-aminophenyl)propane; 2,2-hexafluoro-bis-[4-(3-aminophenoxy)phenyl]propane; 2,2-hexafluoro-bis-[4-(4-aminophenoxy)phenyl]propane and 1,1-bis-(4-aminopheny)-1-phenyl-2,2,2-trifluoroethane or mixtures thereof.
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公开(公告)号：US07247567B2
公开(公告)日：2007-07-24
申请号：US10869397
申请日：2004-06-16
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： C09G1/02 , C09K3/1463 , C23F3/06 , H01L21/3212
摘要： The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, copolymer, or polymer blend comprising at least one repeating group comprising at least one nitrogen-containing heterocyclic ring or a tertiary or quaternary nitrogen atom. The invention further provides a chemical-mechanical polishing composition particularly useful in polishing tungsten-containing substrates.
摘要翻译： 本发明提供了通过使用包含钨蚀刻剂，钨蚀刻抑制剂和水的组合物对包含钨的基材进行化学机械抛光的方法，其中所述钨抛光抑制剂是聚合物，共聚物或聚合物共混物，其包含在 至少一个包含至少一个含氮杂环或叔或季氮原子的重复基团。 本发明还提供了一种特别适用于抛光含钨衬底的化学机械抛光组合物。
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43.发明授权Fractionation of phenol formaldehyde condensate and photoresist compositions produced therefrom 失效分离苯酚甲醛缩合物和由其制备的光致抗蚀剂组合物
公开(公告)号：US5976761A
公开(公告)日：1999-11-02
申请号：US47571
申请日：1998-03-25
CPC分类号： C08G8/08 , G03F7/0236
摘要： A process for producing a water insoluble, aqueous alkali soluble, film forming novolak resin having low metal ions, made by the fractionation of a phenol formaldehyde condensation product, a process for producing a resin a photoresist composition of superior quality containing such novolak resin, and a method for producing a semiconductor device using such photoresist composition.
摘要翻译： 通过分解苯酚甲醛缩合产物制备具有低金属离子的水不溶性水溶性成膜酚醛清漆树脂的方法，含有这种酚醛清漆树脂的具有优良品质的光致抗蚀剂组合物的方法，以及 使用这种光致抗蚀剂组合物的半导体器件的制造方法。
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公开(公告)号：US5763135A
公开(公告)日：1998-06-09
申请号：US722711
申请日：1996-09-30
申请人： Shuji Ding , Ping-Hung Lu , Dinesh N. Khanna , Anthony J. Corso
发明人： Shuji Ding , Ping-Hung Lu , Dinesh N. Khanna , Anthony J. Corso
IPC分类号： G03F7/004 , C08L5/00 , C08L101/00 , C09B23/00 , C09B29/32 , C09B55/00 , G03F7/039 , G03F7/09 , H01L21/027 , G03F7/023 , G03F7/32
CPC分类号： G03F7/091
摘要： A light-sensitive positive photoresist composition containing a film forming resin, a photoactive compound, a solvent, and an arylhydrazo dye. The dyed photoresist reduces the linewidth variation of the resist pattern on a reflective substrate while giving good lithographic performance.
摘要翻译： 含有成膜树脂，光活性化合物，溶剂和芳基水解染料的光敏正性光致抗蚀剂组合物。 染色的光致抗蚀剂降低了反射基板上的抗蚀剂图案的线宽变化，同时提供了良好的光刻性能。
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45.发明授权Fractionation of phenol formaldehyde condensate and photoresist compositions produced therefrom 失效分离苯酚甲醛缩合物和由其制备的光致抗蚀剂组合物
公开(公告)号：US5693749A
公开(公告)日：1997-12-02
申请号：US530648
申请日：1995-09-20
CPC分类号： G03F7/0236 , C08G8/08
摘要： A process for producing a water insoluble, aqueous alkali soluble, film forming novolak resin fraction having a low metal ion content, made by the fractionation of a phenol formaldehyde condensation product, a process for producing a photoresist compositions containing such a novolak resin, and a method for producing a semiconductor device using such a photoresist composition.
摘要翻译： 通过分解苯酚甲醛缩合产物制备具有低金属离子含量的水不溶性水溶性成膜酚醛清漆树脂级分的方法，制备含有这种酚醛清漆树脂的光致抗蚀剂组合物的方法和 使用这种光致抗蚀剂组合物的半导体器件的制造方法。
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公开(公告)号：US5077378A
公开(公告)日：1991-12-31
申请号：US526583
申请日：1990-05-21
CPC分类号： G03F7/0233 , C08G69/26 , C08G69/32
摘要： This invention is that of high temperature polyamides containing the hexafluoroisopropylidene group. The high temperature polyamides of the invention and photo or radiation sensitizers provide improved high temperature positive resists which can be developed in aqueous alkaline developer and thermally anneal to form heat resistant, polyoxazole relief structures suitable for use in microelectronic and printing applications. The positive photoresists of the invention have improved solubility in coating solvents and improved photospeed. The polyamides of the invention can be prepared by conventional condensation reactions; e.g. the condensation of a diamine and diacid chloride. In addition the polyamides of this invention provide high temperature protective coatings with superior adhesion properties in applications other than the photoresist area.
摘要翻译： 本发明是含有六氟异亚丙基的高温聚酰胺。 本发明的高温聚酰胺和光或辐射敏化剂提供改进的高温正性抗蚀剂，其可以在含水碱性显影剂中显影并热退火以形成适用于微电子和印刷应用的耐热的聚恶唑消除结构。 本发明的正性光致抗蚀剂具有改进的涂料溶剂溶度和改进的感光速度。 本发明的聚酰胺可以通过常规的缩合反应制备; 例如 二胺和二酰氯的缩合。 此外，本发明的聚酰胺提供了除光刻胶区域之外的应用中具有优异粘合性能的高温保护涂层。
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公开(公告)号：US4978738A
公开(公告)日：1990-12-18
申请号：US217914
申请日：1988-07-12
IPC分类号： C08G73/10
CPC分类号： C08G73/1042 , C08G73/1039
摘要： High molecular weight polyimides are formed by polycondensation of 2,2-bis(4-aminophenyl) hexafluoropropane or 2,2-bis(3-aminophenyl) hexafluoropropane with one or more of bis-(3,4 dicarboxyphenyl) ether dianhydride; 3,3', 4,4' benzophenone tetracarboxylic acid dianhydride; 3,3', 4,4' diphenyl tetracarboxylic acid dianhydride and 2,2-bis(3,4 dicarboxyphenyl) hexafluoropropane dianhydride. Generally, the polymers of the present invention are characterized by a molecular weight of more than about 90,000.
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公开(公告)号：US4978734A
公开(公告)日：1990-12-18
申请号：US321039
申请日：1989-03-09
申请人： Dinesh N. Khanna
发明人： Dinesh N. Khanna
CPC分类号： C08G69/265 , C08G69/42 , C08G73/22
摘要： The present invention provides polyamide-polyamide and polybenzoxazole-polyamide polymers derived therefrom with improved processing and film characteristics having incorporated into the polymeric backbone the polymeric condensation residuum of novel aromatic diamino compounds having the formula: ##STR1## wherein A is selected from the group consisting of SO.sub.2, O, S, CO, C.sub.1 to C.sub.6 alkylene, perfluoroalkylene or perfluoroalkylene having from 1 to 10 carbon atoms and a bond directly linking the two aromatic groups and R is selected from the group consisting of hydrogen, hydroxy and C.sub.1 to C.sub.4 alkoxy.The polyamide-polyamide polymers of this invention are prepared by reacting compounds of the above formula, alone or admixed with othr aromatic diamines, with one or more aromatic or aliphatic dicarboxylic acid or amide-forming derivatives thereof. Polybenzoxazole-polyamide drivatives of such polyamide-polyamide polymers are prepared utilizing compounds of the above formula wherein R is hydroxy or C.sub.1 to C.sub.4 alkoxy, and by subjecting the resulting alkoxy or hydroxy-substituted polyamide-polyamide to a dehydrating and cyclizing reaction to form the oxazole linkage which gives rise to polybenzoxazole-polyamide polymer.
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公开(公告)号：US4877653A
公开(公告)日：1989-10-31
申请号：US217796
申请日：1988-07-12
IPC分类号： B05D3/02
CPC分类号： C08J7/08 , C08J2379/08 , Y10T428/31721
摘要： A method of insolubilizing solvent soluble polyimides comprising the imidized condensation products of an aromatic dianhydride and a primary aromatic diamine wherein at least one of said dianhydride or diamine is selected from the group consisting of 2,2-hexafluoro-bis(3,4-dicarboxyphenyl)propane dianhydride; 2,2-hexafluoro-bis(3-aminophenyl) propane; 2,2-hexafluoro-bis(4-aminophenyl)propane; 2,2-hexafluoro-bis-[4-(3-aminophenoxy)phenyl]propane; 2,2-hexafluoro-bis[4-(4-aminophenoxy)phenyl]propane; 1,1-bis(4-aminophenyl)-1-phenyl-2,2,2-trifluoroethane; 1,1-bis-[4-(1,2-dicarboxyphenyl)]-1-phenyl-2,2,2-trifluoroethane dianhydride and mixtures thereof.The method comprises forming a shaped article or film comprising the polyimides and subjecting same to a heat annealing process at a temperature of at least 325.degree. C. and for a period of time sufficient to insolubilize the polyimide. Preferred temperatures range from 350.degree. C. to 400.degree. C. for a period of time of at least 45 minutes to about 2 hours.
摘要翻译： 一种不溶解溶剂可溶性聚酰亚胺的方法，其包括芳族二酐和伯芳族二胺的酰亚胺化缩合产物，其中所述二酐或二胺中的至少一种选自2,2-六氟双（3,4-二羧基苯基 ）丙烷二酐; 2,2-三氟 - 双（3-氨基苯基）丙烷; 2,2-四氟 - 双（4-氨基苯基）丙烷; 2,2-二氟 - 双 - [4-（3-氨基苯氧基）苯基]丙烷; 2,2-六氟双[4-（4-氨基苯氧基）苯基]丙烷; 1,1-双（4-氨基苯基）-1-苯基-2,2,2-三氟乙烷; 1,1-双 - [4-（1,2-二羧基苯基）] -1-苯基-2,2,2-三氟乙烷二酐及其混合物。 该方法包括形成包含聚酰亚胺的成形制品或薄膜，并在至少325℃的温度下进行热退火处理，并使其持续足以使聚酰亚胺不溶化的时间。 优选的温度为350℃至400℃，时间为至少45分钟至约2小时。
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